DRA718BIGCBDRQ1

1 GHZ ARM CORTEX-A15 SOC PROCESS
Part Description

ARM® Cortex®-A15 Microprocessor IC DRA71x 1 Core, 32-Bit 600MHz 538-FCBGA (17x17)

Quantity 1,767 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesJacinto DRA71x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4, BB2D, C66x, GPU, IVACore ProcessorARM® Cortex®-A15Device Package538-FCBGA (17x17)
Display & Interface ControllersHDMI, LCDECCNN/AEthernet10/100/1000Mbps (1), 1Gbps (2)
GradeAutomotiveGraphics AccelerationYesHTS CodeN/A
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 125°C (TJ)Package / Case538-LFBGA, FCBGA
RAM ControllersDDR3, DDR3LREACH ComplianceREACH UnknownRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Debug Security, Device Identity, Isolation Firewalls, Secure Boot, Secure Storage, Software IP ProtectionSpeed600MHzSupplier Device Package538-FCBGA (17×17)
USBUSB 2.0 (2), USB 3.0 (1)Voltage – I/O1.35V, 1.5V, 1.8V, 3.3V

Overview of DRA718BIGCBDRQ1 – 1 GHZ ARM CORTEX-A15 SOC PROCESS

The DRA718BIGCBDRQ1 is a member of the Texas Instruments Jacinto DRA71x family: an ARM® Cortex®-A15 based system-on-chip designed for automotive infotainment and human‑machine interface applications. It combines an ARM® Cortex®-A15 application core with an array of multimedia accelerators, DSPs and image-processing units to support rich audio, video and graphics workloads.

Engineered for automotive use, the device carries AEC‑Q100 qualification and includes hardware security features and robust I/O to simplify integration in in-vehicle systems requiring Full‑HD video, multiple camera inputs, display controllers and high-speed connectivity.

Key Features

  • Core and CPU performance Single ARM® Cortex®-A15 core, 32-bit architecture, specified at 600 MHz.
  • Heterogeneous processing and accelerators Integrated co-processors and accelerators including ARM® Cortex®-M4 IPUs, C66x DSP, BB2D 2D accelerator, IVA and a PowerVR™ SGX544 3D GPU for graphics and vision tasks.
  • On-chip memory and memory controller Up to 512 KB of on-chip L3 RAM and DDR3/DDR3L memory interface (EMIF) with support up to DDR‑1333 and up to 2 GB across a single chip select.
  • Video and display subsystems Full‑HD video support (1920 × 1080p, 60 fps), display controller with DMA and multi-pipeline support, HDMI 1.4a/DVI encoder and Video Processing Engine (VPE).
  • High-speed connectivity Integrated USB (one SuperSpeed USB 3.0 dual-role, two high-speed USB 2.0), PCI Express® 3.0 subsystems (two 5-Gbps lanes), and multiple MMC/SD/SDIO and QSPI interfaces.
  • Automotive networking Dual-port gigabit Ethernet (GMAC) and dual CAN controllers (DCAN supporting CAN 2.0B) for in-vehicle network connectivity.
  • Extensive peripheral set MIPI® CSI-2 camera interface, up to 186 GPIO, multiple I2C, UART, McSPI, McASP audio ports, VIP video input port and 1‑Wire®/HDQ support.
  • Security and system integrity Hardware cryptography accelerators, debug security, device identity, isolation firewalls, secure boot, secure storage and software IP protection.
  • Package and environmental 538‑ball FCBGA (17 mm × 17 mm, 0.65 mm pitch), automotive grade with AEC‑Q100 qualification and operating temperature range of −40 °C to 125 °C. RoHS compliant.

Typical Applications

  • Automotive HMI — Drives in-vehicle human-machine interfaces with integrated graphics, video pipelines and touchscreen/display support.
  • Navigation systems — Handles map rendering, multimedia playback and sensor input processing for navigation units.
  • Infotainment and multimedia — Enables Full‑HD video playback, multiple audio streams and connectivity via USB, Ethernet and PCIe.
  • Digital clusters and display audio — Supports digital instrument clusters and audio systems with high reliability and security features.
  • Camera and vision input — MIPI CSI-2 and VIP modules allow multi-camera capture and preprocessing for vision and driver-assist subsystems.

Unique Advantages

  • Highly integrated multimedia platform: Combines CPU, DSP, GPU, IVA and video engines to consolidate video, graphics and audio workloads and reduce external component count.
  • Automotive-qualified for harsh environments: AEC‑Q100 qualification and −40 °C to 125 °C operating range provide suitability for in-vehicle deployment.
  • Comprehensive security features: Hardware crypto, secure boot, isolation firewalls and secure storage help protect IP and device identity in production systems.
  • Broad connectivity options: Multiple USB, PCIe, Ethernet, CAN and storage interfaces enable flexible system architectures and peripheral integration.
  • Memory and performance scalability: DDR3/DDR3L EMIF support up to DDR‑1333 and up to 2 GB enables handling of large multimedia buffers and complex applications.

Why Choose DRA718BIGCBDRQ1?

The DRA718BIGCBDRQ1 positions itself as a purpose-built SoC for automotive infotainment and HMI designs that require integrated multimedia processing, robust security and wide peripheral support. Its combination of an ARM® Cortex®-A15 application core, dedicated DSPs and graphics accelerators simplifies system design while meeting automotive temperature and qualification requirements.

As part of the Texas Instruments Jacinto DRA71x family, this device is suited for engineers developing navigation, digital cluster, radio and multimedia systems who need an integrated platform that balances performance, connectivity and vehicle-grade reliability.

Request a quote or contact sales to discuss pricing, availability and how the DRA718BIGCBDRQ1 can fit your next automotive infotainment or HMI design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up