HD64413ASFI

GRAPHICS PROCESSOR
Part Description

GRAPHICS PROCESSOR

Quantity 2 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesHD64413A
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Core ProcessorQ2SDDevice PackageQFPECCN3A991
Graphics AccelerationNoHTS Code8542.39.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountOperating Temperature0 °C – 70 °CPackage / CaseQFP
QualificationConsumerREACH ComplianceN/ARoHS ComplianceRoHS non-compliant
Voltage – I/O3.3 V

Overview of HD64413ASFI – GRAPHICS PROCESSOR

The HD64413ASFI is a Renesas microprocessor IC in the HD64413A series, identified as a graphics processor. It is built around a Q2SD core processor and targeted for embedded, consumer applications where surface-mount QFP packaging and 3.3 V I/O compatibility are required.

Designed for consumer-grade embedded designs, the HD64413ASFI provides a compact, RoHS-compliant option for systems operating within a 0 °C to 70 °C temperature range.

Key Features

  • Core Processor  Q2SD core processor architecture as specified for the HD64413ASFI.
  • Voltage I/O  3.3 V I/O level for compatibility with common embedded system power domains.
  • Package and Mounting  QFP package in a surface-mount form factor suitable for PCB assembly processes.
  • Operating Temperature Range  Rated for 0 °C to 70 °C operation, matching consumer-grade environmental requirements.
  • Qualification  Consumer qualification for use in consumer electronics and related embedded products.
  • Graphics Acceleration  No dedicated graphics acceleration is included as specified for this device.
  • Environmental Compliance  RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

  • Consumer Embedded Systems  Suited for consumer-targeted embedded products that require a microprocessor in a QFP surface-mount package.
  • Compact PCB Designs  QFP surface-mount packaging makes the device appropriate for densely packed PCB layouts.
  • 3.3 V Logic Systems  Integration into systems that operate with 3.3 V I/O signaling.

Unique Advantages

  • Established Core Architecture: Q2SD core processor provides a defined processing foundation for embedded designs.
  • 3.3 V I/O Compatibility: Native 3.3 V I/O simplifies interfacing with common peripherals and logic families.
  • Surface-Mount QFP Package: QFP package supports standard automated assembly and reflow processes.
  • Consumer-Grade Temperature Rating: 0 °C to 70 °C specification aligns with typical consumer product operating conditions.
  • RoHS Compliance: Enables use in lead-free manufacturing flows and helps meet environmental requirements.

Why Choose HD64413ASFI?

The HD64413ASFI provides a focused, consumer-qualified microprocessor option within the Renesas HD64413A series, offering a Q2SD core, 3.3 V I/O compatibility, and a QFP surface-mount package. Its RoHS compliance and consumer temperature rating make it a practical choice for embedded consumer products where standard operating ranges and lead-free assembly are priorities.

This part is appropriate for engineers and designers developing compact, surface-mount embedded systems that require a defined processor platform with straightforward integration into 3.3 V domains.

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