IDT79RC64T575-250DP
| Part Description |
MIPS-I Microprocessor IC - 1 Core, 64-Bit 250MHz 208-PQFP (28x28) |
|---|---|
| Quantity | 116 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | IDT79RC64T575 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | MIPS-I | Device Package | 208-PQFP (28x28) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 64-Bit | Operating Temperature | 0°C – 85°C | Package / Case | Tray | ||
| Speed | 250MHz | Voltage | 2.5V, 3.3V |
Overview of IDT79RC64T575-250DP – IC MPU 250MHZ 208QFP
The IDT79RC64T575-250DP is a single-core, 64-bit embedded microprocessor operating at 250 MHz, supplied in a 208‑pin PQFP (28 × 28 mm) surface-mount package. Designed for consumer embedded applications, it pairs 64‑bit processing with an on-chip memory subsystem and system-level interfaces to support compact, performance-oriented designs.
As a RoHS‑compliant, consumer‑qualified device with an operating range of 0 °C to 70 °C, this MPU is suited to a variety of embedded designs that require balanced compute performance, memory efficiency, and standard package/assembly flow.
Key Features
- Core — Single 64‑bit MIPS‑I processor core running at 250 MHz, providing fixed-frequency deterministic compute for embedded workloads.
- On‑chip cache and TLB — 32 kB two‑set‑associative instruction cache and 32 kB two‑set‑associative data cache, with per‑line I/D cache locking capability; on‑chip 48‑entry, 96‑page TLB for virtual‑to‑physical address mapping.
- System interface — 64‑bit SysAd bus interface in the RC64575 family configuration, supporting high‑bandwidth system integration and pipeline operation scaled to bus frequency.
- Voltage and I/O — 2.5 V core operation with 3.3 V‑tolerant I/O, enabling mixed‑voltage system compatibility.
- Debug and test — JTAG Boundary Scan Interface for board‑level test and development visibility.
- Package and mounting — 208‑PQFP (28 × 28) supplier device package, shipped in tray; Surface Mount Device (SMD) for standard PCB assembly.
- Qualification and environment — Consumer qualification with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
Typical Applications
- Consumer Embedded Devices — Control and processing in consumer electronics that require 64‑bit compute at 250 MHz within a standard PQFP package and consumer temperature range.
- Multimedia and DSP‑Enhanced Products — Embedded systems leveraging on‑chip cache and accelerator capabilities for media or signal processing workloads.
- System Controllers — Use as a primary controller in systems that need virtual memory support and a 64‑bit system bus interface.
- Development and Evaluation Platforms — Suitable for prototyping and firmware development with JTAG debug support and standard surface‑mount packaging.
Unique Advantages
- 64‑bit single‑core performance: 250 MHz operation provides a predictable execution environment for embedded compute tasks.
- Robust on‑chip memory subsystem: Dedicated 32 kB I‑cache and 32 kB D‑cache plus a sizeable TLB reduce external memory traffic and improve system responsiveness.
- Mixed‑voltage compatibility: 2.5 V core with 3.3 V‑tolerant I/O simplifies interfacing to common peripheral logic levels.
- Standard PQFP package: 208‑pin PQFP (28 × 28) in tray facilitates integration into existing assembly lines and PCB layouts.
- Consumer‑grade readiness: RoHS compliance and 0 °C to 70 °C qualification match typical consumer product requirements.
Why Choose IDT79RC64T575-250DP?
The IDT79RC64T575-250DP delivers a practical balance of 64‑bit processing, on‑chip memory organization, and system interfacing in a standard 208‑pin PQFP package. Its combination of cache, TLB, and 3.3 V‑tolerant I/O simplifies system design while supporting embedded software that benefits from virtual memory and higher‑width datapaths.
This MPU is well suited to designers of consumer embedded products who need a compact, RoHS‑compliant solution with defined operating characteristics (0 °C to 70 °C) and industry‑standard package compatibility for streamlined prototyping and production.
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