IDT79RC32V334-150BBI
| Part Description |
MIPS-II Microprocessor IC Interprise™ 1 Core, 32-Bit 150MHz 256-PBGA (17x17) |
|---|---|
| Quantity | 971 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | IDT79RC32V334 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | MIPS-II | Device Package | 256-PBGA (17x17) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C – 85°C | Package / Case | Tray | ||
| Speed | 150MHz | Voltage | 3.3V |
Overview of IDT79RC32V334-150BBI – IC MPU INTERPRISE 150MHZ 256BGA
The IDT79RC32V334-150BBI is a single-core 32-bit MIPS-II microprocessor operating at up to 150 MHz, designed for embedded applications that require integrated memory and peripheral control. It combines a high-performance RC32300-based CPU core with on-chip system controllers to address communications and industrial embedded designs.
Built for industrial environments, this device delivers system-level integration—SDRAM controller, PCI and local-bus interfaces, DMA, UARTs and programmable I/O—while supporting a 3.3 V I/O domain, 5 V tolerant I/O, and an extended operating range of −40 °C to 85 °C.
Key Features
- Core – RC32300-based MIPS-II 32-bit CPU core, single core, up to 150 MHz operation with enhanced MIPS-II ISA and DSP/conditional-move instructions.
- Memory and Cache – On-chip MMU with a 32-page TLB, 8 kB 2-way set-associative instruction cache and 2 kB 2-way set-associative data cache with per-line cache locking and programmable cache policies.
- SDRAM and Boot Support – Integrated SDRAM controller supporting 4 banks (up to 512 MB total SDRAM) and flexible support for Flash ROM, SRAM and 8-bit boot PROM devices.
- High-performance I/O and Buses – Local bus interface (26-bit address, 32-bit data) up to 75 MHz; 32-bit PCI interface up to 66 MHz (PCI Rev 2.2 compatible) supporting master/target modes and three-slot arbitration.
- DMA and Data Movement – Four general-purpose DMA channels with endian swapping, byte-lane alignment, scatter/gather and chaining support for memory‑to‑memory and memory‑to‑I/O transfers.
- Peripherals – Dual 16550-compatible UARTs (baud rates up to 1.5 Mb/s), SPI master interface, four 32-bit timer/counters and programmable I/O lines usable as inputs, outputs or interrupt sources.
- Debug and Development – EJTAG in-circuit emulator interface and IEEE 1149.1 JTAG support; off-the-shelf development tools are supported for software bring-up.
- Power, Package and Temperature – 3.3 V operation with 5 V tolerant I/O, supplied in a 256-ball PBGA (17 × 17 mm, 1.0 mm pitch) surface-mount package; industrial operating range −40 °C to 85 °C.
- Compliance – RoHS compliant.
Typical Applications
- Embedded Communications – Integrated communications processing for protocol handling and peripheral interfacing using on-chip UARTs, SPI and DMA.
- Industrial Control – Control and monitoring systems that benefit from industrial temperature operation, deterministic timers and programmable I/O.
- PCI-based Embedded Systems – Host or peripheral roles on 32-bit PCI buses (up to 66 MHz) for embedded boards and mezzanine modules.
- Memory-rich Embedded Platforms – Systems requiring up to 512 MB SDRAM and flexible external memory support for firmware, operating systems and application stacks.
Unique Advantages
- Single-chip system integration: On-chip SDRAM controller, PCI, local-bus, DMA, UARTs and timers reduce BOM and simplify board-level design.
- Flexible memory subsystem: MMU with 32-page TLB plus configurable cache policies and support for up to 512 MB SDRAM enables varied OS and application memory models.
- Deterministic peripheral control: Four 32-bit timers, programmable I/O and DMA channels support real-time and high-throughput data movement without heavy CPU overhead.
- Industrial readiness: 3.3 V operation with 5 V tolerant I/O and −40 °C to 85 °C operating range suits industrial embedded deployments.
- Standard development and debug support: EJTAG and IEEE‑1149.1 JTAG support along with off-the-shelf development tools accelerate bring-up and debugging.
- Compact, surface-mount package: 256-ball PBGA (17 × 17 mm) provides a balance of pin density and thermal/board layout convenience for space-constrained designs.
Why Choose IDT79RC32V334-150BBI?
The IDT79RC32V334-150BBI positions itself as a robust, integrated microprocessor for embedded and communications-focused applications that require a MIPS-II core, multi-bus connectivity and on-chip memory controllers. Its mix of peripheral interfaces, DMA capability and cache/MMU features make it suitable for designs that need sustained data movement and flexible memory architectures.
This device is well suited for engineers designing industrial and embedded systems who need a single-package solution with off-the-shelf development support, industrial temperature operation and a compact PBGA footprint. The combination of integration and predictable performance supports scalable, long-lived embedded designs.
Request a quote or submit an RFQ for pricing and availability for the IDT79RC32V334-150BBI to begin your procurement process.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016