IDT79RC32V334-150BBI

IC MPU INTERPRISE 150MHZ 256BGA
Part Description

MIPS-II Microprocessor IC Interprise™ 1 Core, 32-Bit 150MHz 256-PBGA (17x17)

Quantity 971 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesIDT79RC32V334
ManufacturerRenesas Electronics Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorMIPS-IIDevice Package256-PBGA (17x17)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 85°CPackage / CaseTray
Speed150MHzVoltage3.3V

Overview of IDT79RC32V334-150BBI – IC MPU INTERPRISE 150MHZ 256BGA

The IDT79RC32V334-150BBI is a single-core 32-bit MIPS-II microprocessor operating at up to 150 MHz, designed for embedded applications that require integrated memory and peripheral control. It combines a high-performance RC32300-based CPU core with on-chip system controllers to address communications and industrial embedded designs.

Built for industrial environments, this device delivers system-level integration—SDRAM controller, PCI and local-bus interfaces, DMA, UARTs and programmable I/O—while supporting a 3.3 V I/O domain, 5 V tolerant I/O, and an extended operating range of −40 °C to 85 °C.

Key Features

  • Core – RC32300-based MIPS-II 32-bit CPU core, single core, up to 150 MHz operation with enhanced MIPS-II ISA and DSP/conditional-move instructions.
  • Memory and Cache – On-chip MMU with a 32-page TLB, 8 kB 2-way set-associative instruction cache and 2 kB 2-way set-associative data cache with per-line cache locking and programmable cache policies.
  • SDRAM and Boot Support – Integrated SDRAM controller supporting 4 banks (up to 512 MB total SDRAM) and flexible support for Flash ROM, SRAM and 8-bit boot PROM devices.
  • High-performance I/O and Buses – Local bus interface (26-bit address, 32-bit data) up to 75 MHz; 32-bit PCI interface up to 66 MHz (PCI Rev 2.2 compatible) supporting master/target modes and three-slot arbitration.
  • DMA and Data Movement – Four general-purpose DMA channels with endian swapping, byte-lane alignment, scatter/gather and chaining support for memory‑to‑memory and memory‑to‑I/O transfers.
  • Peripherals – Dual 16550-compatible UARTs (baud rates up to 1.5 Mb/s), SPI master interface, four 32-bit timer/counters and programmable I/O lines usable as inputs, outputs or interrupt sources.
  • Debug and Development – EJTAG in-circuit emulator interface and IEEE 1149.1 JTAG support; off-the-shelf development tools are supported for software bring-up.
  • Power, Package and Temperature – 3.3 V operation with 5 V tolerant I/O, supplied in a 256-ball PBGA (17 × 17 mm, 1.0 mm pitch) surface-mount package; industrial operating range −40 °C to 85 °C.
  • Compliance – RoHS compliant.

Typical Applications

  • Embedded Communications – Integrated communications processing for protocol handling and peripheral interfacing using on-chip UARTs, SPI and DMA.
  • Industrial Control – Control and monitoring systems that benefit from industrial temperature operation, deterministic timers and programmable I/O.
  • PCI-based Embedded Systems – Host or peripheral roles on 32-bit PCI buses (up to 66 MHz) for embedded boards and mezzanine modules.
  • Memory-rich Embedded Platforms – Systems requiring up to 512 MB SDRAM and flexible external memory support for firmware, operating systems and application stacks.

Unique Advantages

  • Single-chip system integration: On-chip SDRAM controller, PCI, local-bus, DMA, UARTs and timers reduce BOM and simplify board-level design.
  • Flexible memory subsystem: MMU with 32-page TLB plus configurable cache policies and support for up to 512 MB SDRAM enables varied OS and application memory models.
  • Deterministic peripheral control: Four 32-bit timers, programmable I/O and DMA channels support real-time and high-throughput data movement without heavy CPU overhead.
  • Industrial readiness: 3.3 V operation with 5 V tolerant I/O and −40 °C to 85 °C operating range suits industrial embedded deployments.
  • Standard development and debug support: EJTAG and IEEE‑1149.1 JTAG support along with off-the-shelf development tools accelerate bring-up and debugging.
  • Compact, surface-mount package: 256-ball PBGA (17 × 17 mm) provides a balance of pin density and thermal/board layout convenience for space-constrained designs.

Why Choose IDT79RC32V334-150BBI?

The IDT79RC32V334-150BBI positions itself as a robust, integrated microprocessor for embedded and communications-focused applications that require a MIPS-II core, multi-bus connectivity and on-chip memory controllers. Its mix of peripheral interfaces, DMA capability and cache/MMU features make it suitable for designs that need sustained data movement and flexible memory architectures.

This device is well suited for engineers designing industrial and embedded systems who need a single-package solution with off-the-shelf development support, industrial temperature operation and a compact PBGA footprint. The combination of integration and predictable performance supports scalable, long-lived embedded designs.

Request a quote or submit an RFQ for pricing and availability for the IDT79RC32V334-150BBI to begin your procurement process.

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