KMPC8275CVRMIBA

The KMPC8275CVRMIBA is a PowerPC G2_LE microprocessor in the MPC8275 series, featuring a single 32-bit core running at 266 MHz. It delivers integrated communications and memory interfaces for embedded industrial applications.

Designed for robust embedded systems, the device combines a high-performance PowerPC core, multiple Ethernet and serial communications controllers, DRAM/SDRAM memory controllers, and a compact 516-PBGA (27×27) surface-mount package with industrial temperature qualification.

Key Features

• Core – Dual-issue PowerPC G2_LE architecture implemented as a single 32‑bit core running at 266 MHz, offering deterministic processor performance for embedded control and communications workloads.
• Cache and Memory – Separate 16 KB instruction and 16 KB data caches (four-way set associative, physically addressed with LRU replacement) and integrated DRAM/SDRAM controllers for system memory support.
• Communications and Co‑processors – Integrated communications functionality including communications co‑processor (RISC CPM) and dedicated communications controller resources; family documentation shows multiple SCCs and FCCs present for MPC8275 series devices.
• Ethernet and USB – Three 10/100 Mbps Ethernet ports and one USB 2.0 full/low‑rate interface for networking and peripheral connectivity.
• Peripheral Interfaces – On‑chip I2C plus additional serial communication controllers suitable for multiport embedded designs.
• Package, Voltage and Mounting – 516‑pin PBGA (27×27) supplier device package, surface‑mount, with 3.3 V I/O specification.
• Operating Range & Compliance – Industrial qualification with operating temperature range from −40 °C to 105 °C and RoHS compliance.

Typical Applications

• Industrial Communications Equipment – Use the multiple 10/100 Mbps Ethernet ports and communications co‑processor to implement protocol bridging, remote I/O and industrial networking nodes.
• Network Appliances and Gateways – Embedded router, gateway or protocol translation designs benefit from the integrated Ethernet, USB and serial communications controllers.
• Embedded Control Systems – Single‑core PowerPC performance with dedicated memory controllers suits real‑time control, monitoring and supervisory applications in industrial environments.
• Legacy and Migration Platforms – Systems targeting PowerQUICC II family architectures can leverage the MPC8275 series for compatibility and straightforward migration.

Unique Advantages

• Highly integrated communications – Multiple Ethernet ports, USB 2.0 and numerous serial controllers reduce external components and streamline board layout for networked embedded systems.
• PowerQUICC II family architecture – Part of the MPC8280/MPC8275 PowerQUICC II family, offering a consistent architecture and feature set for designs that rely on these SoC capabilities.
• Deterministic embedded core – Dual‑issue PowerPC G2_LE core with separate instruction and data caches enables predictable single‑core performance for control and communications tasks.
• Industrial temperature and RoHS compliant – −40 °C to 105 °C operating range and RoHS status support deployment in rugged industrial environments with environmental compliance.
• Compact surface‑mount PBGA package – 516‑pin PBGA (27×27) footprint combines high I/O density with a compact package suitable for space‑constrained embedded boards.

Why Choose KMPC8275CVRMIBA?

The KMPC8275CVRMIBA combines a PowerPC G2_LE single 32‑bit core running at 266 MHz with extensive communications and memory interfaces in a 516‑pin PBGA package, making it a solid choice for industrial embedded systems and networked appliances. Its integration of Ethernet, USB and on‑chip communications controllers simplifies design and reduces BOM complexity for communications‑centric applications.

This device is well suited for engineers developing industrial control, networking and gateway devices who require an industrial temperature range, 3.3 V I/O and the proven architecture of the PowerQUICC II family. The KMPC8275CVRMIBA offers a balance of processing capability, communications integration and packaging density for long‑term embedded deployments.

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