KMPC8275ZQMIBA
| Part Description |
PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27) |
|---|---|
| Quantity | 204 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8275 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2_LE | Device Package | 516-PBGA (27x27) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 516-BBGA | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 516-PBGA (27×27) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of KMPC8275ZQMIBA – PowerPC G2_LE 266MHz Microprocessor
The KMPC8275ZQMIBA is a single‑core, 32‑bit embedded microprocessor based on the PowerPC G2_LE architecture, running at 266 MHz. Designed for embedded and communications-focused designs, it combines a PowerQUICC II family core with integrated memory controllers and multiple high‑speed I/O interfaces to deliver balanced compute and connectivity for consumer and industrial applications.
Key Features
- Core Dual‑issue PowerPC G2_LE integer core implementation, delivered as a single 32‑bit core running at 266 MHz for deterministic embedded processing.
- Memory Subsystem Integrated DRAM and SDRAM controllers to support system memory configurations with on‑chip cache structure referenced in family documentation (separate instruction and data caches reported in the MPC8280 family datasheet).
- Communications & Co‑processing Built‑in communications co‑processors including RISC CPM functionality and communications offload capability to accelerate protocol handling.
- Ethernet Three 10/100 Mbps Ethernet interfaces for multi‑port networked applications and device connectivity.
- USB One USB 2.0 full/low‑rate interface for host or device connectivity options.
- Peripherals & Buses Additional interfaces include I2C and multiple serial communications controllers suitable for peripheral and sensor integration.
- Power and I/O 3.3 V I/O voltage standard for compatibility with common embedded logic levels.
- Package & Mounting 516‑ball PBGA package, 27×27 mm footprint, surface‑mount for compact board designs.
- Operating Range Rated for 0°C to 105°C operation and offered as a consumer‑qualified device.
- Compliance RoHS compliant.
Typical Applications
- Networking Appliances Multi‑port 10/100 Ethernet interfaces and communications co‑processors make this device suitable for routers, gateways, and edge network equipment.
- Embedded Communications Systems Integrated RISC CPM and serial communications controllers support protocol handling and serial connectivity in embedded communications modules.
- Consumer Electronics USB 2.0 connectivity and integrated memory controllers enable multimedia and connectivity features in consumer devices within the specified temperature range.
- Industrial Control Deterministic single‑core processing with broad I/O support fits control and monitoring applications requiring reliable embedded compute and network interfaces.
Unique Advantages
- Integrated Communications Capability: Three 10/100 Ethernet ports plus onboard communications co‑processors reduce external interface complexity and offload network processing.
- Balanced System Integration: On‑chip DRAM/SDRAM controllers and a USB 2.0 port help minimize external components and simplify board design.
- Proven PowerQUICC II Family Architecture: The PowerPC G2_LE core and family feature set provide a clear hardware baseline referenced in the MPC8280 family documentation for cache and core behavior.
- Compact PBGA Package: 516‑ball, 27×27 mm PBGA packaging enables high‑density board layouts while maintaining surface‑mount assembly compatibility.
- Wide Ambient Range for Consumer Use: Rated 0°C to 105°C to support a variety of consumer and light industrial environments.
- RoHS Compliant: Environmentally conscious manufacturing compliance simplifies end‑product regulatory alignment.
Why Choose KMPC8275ZQMIBA?
The KMPC8275ZQMIBA positions itself as a compact, communications‑oriented embedded processor delivering 266 MHz PowerPC G2_LE performance with integrated memory controllers and multiple network interfaces. It is well suited to designers who require a balanced combination of compute, protocol offload, and I/O integration in a single surface‑mount PBGA package.
Backed by NXP Semiconductors and documented within the PowerQUICC II family hardware specifications, this device provides a verifiable technical foundation for projects that demand reliable connectivity, streamlined BOM, and a consumer‑grade operating range.
Request a quote or submit an inquiry to obtain pricing and availability for KMPC8275ZQMIBA and to discuss configuration and supply options for your design needs.

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