KMPC8280CZUUPEA

The KMPC8280CZUUPEA is a single‑core, 32‑bit PowerPC G2_LE microprocessor from NXP Semiconductors, rated at 450 MHz and supplied in a 480‑TBGA (37.5 × 37.5 mm) package. Designed as a member of the PowerQUICC II family, it integrates communication‑oriented peripherals and memory controllers to address embedded and industrial computing needs.

With integrated Ethernet ports, USB 2.0 support, on‑chip DRAM/SDRAM controllers and communications co‑processors, this device targets embedded communications and industrial applications that require a compact, rugged, and RoHS‑compliant processing solution.

Key Features

• Core and Performance  Dual‑issue integer PowerPC G2_LE core derived from the EC603e microarchitecture, operating at up to 450 MHz for deterministic embedded processing.
• Memory and Cache  Separate 16 KB instruction and 16 KB data caches (four‑way set associative, physically addressed, LRU replacement) and integrated DRAM/SDRAM controllers for system memory support.
• Integrated Communications  Three 10/100 Mbps Ethernet controllers and one USB 2.0 full/low‑rate interface provide on‑chip connectivity for networked embedded systems.
• Co‑Processors  Communications and RISC CPM co‑processors to offload protocol and communication tasks from the main CPU core.
• System Interfaces  Additional interfaces include I2C and other serial communications controllers suited to peripheral and subsystem control.
• Power and I/O  3.3 V I/O standard to match common embedded system voltage domains.
• Package and Mounting  Supplied in a 480‑TBGA (37.5 × 37.5 mm) package with exposed pad (480‑LBGA description in ordering) and surface‑mount mounting type for high‑density board designs.
• Thermal and Environmental  Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for regulated environments.

Typical Applications

• Embedded Networking Equipment  On‑chip Ethernet controllers and communication co‑processors enable use in routers, switches, and managed network appliances.
• Industrial Control Systems  Industrial qualification and wide operating temperature range support control and automation platforms requiring reliable operation in harsh environments.
• Communications Infrastructure  Integrated serial communications controllers, USB, and memory interfaces suit protocol handling and data path tasks in communications modules.
• Compact Embedded Compute Modules  High integration in a 480‑TBGA package provides a compact processor building block for dense embedded systems and modules.

Unique Advantages

• Integrated Communication Peripherals: Three 10/100 Ethernet ports plus USB 2.0 reduce external component count for networked designs.
• Offload Capabilities: Communications and RISC CPM co‑processors take on protocol and data‑path work to free the main core for application tasks.
• Deterministic Embedded Performance: PowerPC G2_LE dual‑issue integer core with 16 KB I/D caches delivers predictable processing performance at up to 450 MHz.
• Industrial‑Grade Operation: −40 °C to 105 °C operating range and industrial qualification support deployment in demanding environments.
• Compact, Surface‑Mount Package: 480‑TBGA (37.5 × 37.5 mm) with exposed pad facilitates high‑density PCB designs while providing thermal conduction paths.
• Standards‑Friendly I/O Voltage: 3.3 V I/O compatibility simplifies integration with common embedded peripherals and transceivers.

Why Choose KMPC8280CZUUPEA?

The KMPC8280CZUUPEA positions itself as a compact, communications‑focused embedded processor that combines a PowerPC G2_LE core with integrated Ethernet, USB, and memory controllers—making it suitable for applications that require on‑chip connectivity and reliable industrial operation. Backed by NXP Semiconductors and designed within the PowerQUICC II family, it provides a balance of processing capability and peripheral integration for embedded and industrial system designs.

Choose this device when you need a rugged, RoHS‑compliant microprocessor with on‑chip communications, predictable single‑core performance at 450 MHz, and packaging suitable for space‑constrained, surface‑mount implementations.

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