 | | LH75411N0Q100C0;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 806 | |
 | | LH79520N0Q000B1,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 923 | |
 | | LH79520N0Q000B1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART Peripherals: DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 576 | |
| N/A | N/A | LH79524N0F100A1 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM720T™ RISC Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 1,961 | |
 | | LH79524N0F100A1,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 1,717 | |
 | | LH79524N0F100A1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LFBGA | Microcontrollers | 208-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LFBGA (14×14) | 65 | |
| N/A | N/A | LH79525N0Q100A1 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM720T™ RISC Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 189 | |
 | | LH79525N0Q100A1;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 10x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) | 550 | |
| N/A | N/A | LH7A400N0G000B5 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 2V ~ 2.2V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 1,074 | |
 | | LH7A400N0G000B5,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 1,077 | |
 | | LH7A400N0G000B5;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256BGA | Microcontrollers | 256-BGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) | 457 | |
 | | LH7A404N0F000B3,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 1,861 | |
 | | LH7A404N0F000B3;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 964 | |
 | | LH7A404N0F092B3,55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 778 | |
 | | LH7A404N0F092B3;55 | NXP Semiconductors | IC MCU 32BIT ROMLESS 324LFBGA | Microcontrollers | 324-LFBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC’97, DMA, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 9x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-LFBGA (17×17) | 321 | |
 | | LIA-MD6000-6JMG80E | Lattice Semiconductor Corporation | IC FPGA 37 I/O 80CTFBGA | FPGAs | 80-CTFBGA (6.5x6.5) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 5936 | 1,247 | |
 | | LIA-MD6000-6KMG80E | Lattice Semiconductor Corporation | IC FPGA 37 I/O 80CKFBGA | FPGAs | 80-CKFBGA (7x7) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 5936 | 633 | |
| N/A | | LIA-MD6000-6MG81E | Lattice Semiconductor Corporation | IC FPGA 37 I/O 81CSFBGA | FPGAs | 81-CSFBGA (4.5x4.5) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 5936 | 898 | |
 | | LIF-MD6000-6JMG80I | Lattice Semiconductor Corporation | IC FPGA 37 I/O 80CTFBGA | FPGAs | 80-CTFBGA (6.5x6.5) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 5936 | 1,212 | |
 | | LIF-MD6000-6KMG80I | Lattice Semiconductor Corporation | IC FPGA 37 I/O 80CKFBGA | FPGAs | 80-CKFBGA (7x7) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 5936 | 978 | |