LIA-MD6000-6JMG80E

The LIA-MD6000-6JMG80E is a CrossLink family FPGA from Lattice Semiconductor Corporation configured as a compact, automotive‑grade programmable logic device. It provides a programmable fabric with 5,936 logic elements (1,484 CLBs), approximately 184,320 bits of embedded RAM, and 37 general-purpose I/O pins in an 80‑VFBGA (80‑CTFBGA, 6.5 × 6.5 mm) surface-mount package.

Documented CrossLink family features include hardened MIPI D‑PHY blocks, programmable sysI/O banks, on‑chip PLLs and a Power Management Unit, making this device suitable for designs that require integrated I/O interfaces, deterministic logic resources and operation across a wide temperature range. The device is AEC‑Q100 qualified and specified for operation from −40 °C to 125 °C with a core supply range of 1.14 V to 1.26 V.

Key Features

• Programmable FPGA fabric Compact programmable fabric providing approximately 5,936 logic elements across 1,484 CLBs for application-specific logic and data path implementations.
• Embedded memory Approximately 0.184 Mbits (184,320 bits) of on‑chip RAM for buffering, line memories and localized data storage.
• MIPI D‑PHY and programmable I/O CrossLink family documentation describes hardened MIPI D‑PHY blocks and flexible sysI/O banks to support high‑speed serial camera and sensor interfaces alongside configurable single‑ended and differential I/O.
• Clocking and timing On‑chip sysCLK PLLs and internal oscillator resources are documented for precise clock domain management and timing control.
• Power management Integrated Power Management Unit (PMU) and documented power sequencing/timing features support coordinated device power control.
• Automotive qualification & temperature range AEC‑Q100 qualified with rated operation from −40 °C to 125 °C for automotive‑class applications.
• Supply and package Core supply range 1.14 V to 1.26 V; offered in an 80‑VFBGA (80‑CTFBGA, 6.5 × 6.5 mm) surface‑mount package for compact board layouts.
• Comprehensive documentation CrossLink family data sheet details architecture, I/O characteristics, DC and switching parameters, programming and configuration, and technical support references.

Typical Applications

• Automotive sensor interfaces — Hardened MIPI D‑PHY blocks and AEC‑Q100 qualification make this device suitable for camera and sensor bridging in vehicle electronics.
• Image and vision pre‑processing — On‑chip RAM and programmable logic support buffering and custom preprocessing pipelines for camera or vision subsystems.
• Embedded I/O bridging — Programmable sysI/O banks enable flexible adaptation between disparate serial and parallel interfaces in compact systems.
• Custom logic acceleration — Deploy the FPGA fabric and clocking resources to offload deterministic, application‑specific functions within tight package and thermal constraints.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 rating combined with −40 °C to 125 °C operation addresses the thermal and reliability demands of in‑vehicle applications.
• Integrated MIPI capability: Hardened MIPI D‑PHY blocks reduce integration complexity for camera and sensor interfaces.
• Balanced logic and memory resources: Approximately 5,936 logic elements and 184,320 bits of RAM provide mid‑range capacity for a wide range of control and data tasks.
• Compact package footprint: 80‑VFBGA (6.5 × 6.5 mm) surface‑mount package minimizes board area for space‑constrained designs.
• Documented power and clock control: On‑chip PMU, PLLs and oscillator resources detailed in the CrossLink documentation support coordinated power sequencing and clock domain management.

Why Choose LIA-MD6000-6JMG80E?

LIA-MD6000-6JMG80E positions itself as a mid‑density, automotive‑qualified FPGA option within the CrossLink family, combining programmable logic, embedded RAM and hardened MIPI D‑PHY capability in a compact 80‑VFBGA package. It is well suited for designers building camera interfaces, sensor bridges, embedded vision preprocessors and other automotive or temperature‑demanding systems that require on‑chip I/O flexibility and documented power/clock management.

Designers benefit from the CrossLink family documentation covering architecture, I/O characteristics, timing and configuration, enabling efficient integration of this device into production designs.

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