LIF-MD6000-6JMG80I

IC FPGA 37 I/O 80CTFBGA
Part Description

CrossLink™ Field Programmable Gate Array (FPGA) IC 37 184320 5936 80-VFBGA

Quantity 624 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package80-CTFBGA (6.5x6.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case80-VFBGANumber of I/O37Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1484Number of Logic Elements/Cells5936
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits184320

Overview of LIF-MD6000-6JMG80I – CrossLink™ Field Programmable Gate Array (FPGA) IC, 80-VFBGA

The LIF-MD6000-6JMG80I is a CrossLink™ family FPGA offering a mid-density programmable fabric with dedicated I/O and system blocks. It integrates a configurable logic array, embedded memory, hardened MIPI D-PHY blocks and flexible sysI/O to address interfacing and bridging tasks in compact, industrial-temperature designs.

Targeted at embedded and vision-adjacent applications, this device provides a combination of programmable logic (5,936 logic elements), approximately 0.18 Mbits of on-chip RAM, and 37 general-purpose I/Os in a 80-VFBGA (80-CTFBGA, 6.5 × 6.5 mm) surface-mount package, with supply and environmental specifications suited for industrial deployments.

Key Features

  • Programmable Fabric  A configurable FPGA fabric with PFU blocks and slices described in the CrossLink family architecture for implementing custom logic and glue functions.
  • Logic Density  5,936 logic elements (cells) to implement mid-density control, interface, and data-path functions.
  • Embedded Memory  Approximately 0.18 Mbits of embedded RAM (184,320 bits) for buffering, FIFOs, and small on-chip data storage.
  • Hardened MIPI D-PHY  Includes MIPI D-PHY blocks as part of the device architecture for supporting MIPI physical-interface implementations.
  • Flexible sysI/O  37 I/Os with programmable I/O banks and sysI/O buffer features (pull modes, drive strength, on-chip termination) for adaptable signal interfacing.
  • Clocking and Timing  Integrated clocking structure with sysCLK PLL and internal oscillators to support a range of timing and clock-management needs.
  • Power Management  On-chip Power Management Unit (PMU) and defined recommended operating conditions with a core supply range of 1.14 V to 1.26 V.
  • Package and Mounting  80-VFBGA / 80-CTFBGA (6.5 × 6.5 mm) surface-mount package for space-efficient board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Compliance  RoHS compliant.

Typical Applications

  • Sensor and camera interfaces  Use the integrated MIPI D-PHY blocks and flexible sysI/O to implement camera sensor links and sensor bridging functions.
  • Video and image pre-processing  Mid-density logic and embedded RAM allow implementation of lightweight video/streaming pipelines, framing buffers, and protocol conversion.
  • Embedded system glue logic  Implement custom interfaces, protocol translation, and control logic where compact packaging and industrial temperature range are required.
  • Industrial I/O aggregation  Consolidate multiple I/O functions with programmable I/O banks and on-chip termination/drive control for robust board-level interfacing.

Unique Advantages

  • Integrated MIPI D-PHY support: Built-in MIPI D-PHY blocks reduce external component count for sensor and camera interface implementations.
  • Mid-density logic with embedded RAM: 5,936 logic elements and approximately 0.18 Mbits of RAM enable practical on-chip buffering and custom logic without large FPGA overhead.
  • Compact, surface-mount package: 80-CTFBGA (6.5 × 6.5 mm) package provides high functionality in a small PCB footprint.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial and temperature-challenging environments.
  • Flexible I/O control: Programmable sysI/O with drive strength, pull modes, and on-chip termination simplifies signal integrity and board-level interface design.
  • Power management and clocking: Integrated PMU, sysCLK PLL and internal oscillators provide on-chip power and clock control for streamlined system design.

Why Choose LIF-MD6000-6JMG80I?

The LIF-MD6000-6JMG80I CrossLink FPGA balances mid-range programmable logic, embedded memory and dedicated interface blocks in a compact 80-VFBGA package. Its built-in MIPI D-PHY resources and flexible sysI/O make it well suited for designs that require on-chip sensor interfaces, protocol bridging and I/O consolidation while operating across an industrial temperature range.

Designers and OEMs looking for a compact, RoHS-compliant FPGA solution with specific on-chip interface primitives and measurable logic/memory resources will find this device appropriate for embedded vision adjuncts, interface controllers and industrial I/O functions.

Request a quote or submit a product inquiry to obtain pricing, lead time and ordering details for the LIF-MD6000-6JMG80I.

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