LIF-MD6000-6JMG80I
| Part Description |
CrossLink™ Field Programmable Gate Array (FPGA) IC 37 184320 5936 80-VFBGA |
|---|---|
| Quantity | 624 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 80-CTFBGA (6.5x6.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 80-VFBGA | Number of I/O | 37 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1484 | Number of Logic Elements/Cells | 5936 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 184320 |
Overview of LIF-MD6000-6JMG80I – CrossLink™ Field Programmable Gate Array (FPGA) IC, 80-VFBGA
The LIF-MD6000-6JMG80I is a CrossLink™ family FPGA offering a mid-density programmable fabric with dedicated I/O and system blocks. It integrates a configurable logic array, embedded memory, hardened MIPI D-PHY blocks and flexible sysI/O to address interfacing and bridging tasks in compact, industrial-temperature designs.
Targeted at embedded and vision-adjacent applications, this device provides a combination of programmable logic (5,936 logic elements), approximately 0.18 Mbits of on-chip RAM, and 37 general-purpose I/Os in a 80-VFBGA (80-CTFBGA, 6.5 × 6.5 mm) surface-mount package, with supply and environmental specifications suited for industrial deployments.
Key Features
- Programmable Fabric A configurable FPGA fabric with PFU blocks and slices described in the CrossLink family architecture for implementing custom logic and glue functions.
- Logic Density 5,936 logic elements (cells) to implement mid-density control, interface, and data-path functions.
- Embedded Memory Approximately 0.18 Mbits of embedded RAM (184,320 bits) for buffering, FIFOs, and small on-chip data storage.
- Hardened MIPI D-PHY Includes MIPI D-PHY blocks as part of the device architecture for supporting MIPI physical-interface implementations.
- Flexible sysI/O 37 I/Os with programmable I/O banks and sysI/O buffer features (pull modes, drive strength, on-chip termination) for adaptable signal interfacing.
- Clocking and Timing Integrated clocking structure with sysCLK PLL and internal oscillators to support a range of timing and clock-management needs.
- Power Management On-chip Power Management Unit (PMU) and defined recommended operating conditions with a core supply range of 1.14 V to 1.26 V.
- Package and Mounting 80-VFBGA / 80-CTFBGA (6.5 × 6.5 mm) surface-mount package for space-efficient board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Compliance RoHS compliant.
Typical Applications
- Sensor and camera interfaces Use the integrated MIPI D-PHY blocks and flexible sysI/O to implement camera sensor links and sensor bridging functions.
- Video and image pre-processing Mid-density logic and embedded RAM allow implementation of lightweight video/streaming pipelines, framing buffers, and protocol conversion.
- Embedded system glue logic Implement custom interfaces, protocol translation, and control logic where compact packaging and industrial temperature range are required.
- Industrial I/O aggregation Consolidate multiple I/O functions with programmable I/O banks and on-chip termination/drive control for robust board-level interfacing.
Unique Advantages
- Integrated MIPI D-PHY support: Built-in MIPI D-PHY blocks reduce external component count for sensor and camera interface implementations.
- Mid-density logic with embedded RAM: 5,936 logic elements and approximately 0.18 Mbits of RAM enable practical on-chip buffering and custom logic without large FPGA overhead.
- Compact, surface-mount package: 80-CTFBGA (6.5 × 6.5 mm) package provides high functionality in a small PCB footprint.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial and temperature-challenging environments.
- Flexible I/O control: Programmable sysI/O with drive strength, pull modes, and on-chip termination simplifies signal integrity and board-level interface design.
- Power management and clocking: Integrated PMU, sysCLK PLL and internal oscillators provide on-chip power and clock control for streamlined system design.
Why Choose LIF-MD6000-6JMG80I?
The LIF-MD6000-6JMG80I CrossLink FPGA balances mid-range programmable logic, embedded memory and dedicated interface blocks in a compact 80-VFBGA package. Its built-in MIPI D-PHY resources and flexible sysI/O make it well suited for designs that require on-chip sensor interfaces, protocol bridging and I/O consolidation while operating across an industrial temperature range.
Designers and OEMs looking for a compact, RoHS-compliant FPGA solution with specific on-chip interface primitives and measurable logic/memory resources will find this device appropriate for embedded vision adjuncts, interface controllers and industrial I/O functions.
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