LIF-MD6000-6UMG64ITR

The LIF-MD6000-6UMG64ITR is a CrossLink™ family FPGA from Lattice Semiconductor. It combines a programmable FPGA fabric with embedded block RAM and hardened I/O building blocks described in the CrossLink data sheet, packaged in a compact 64-ball VFBGA footprint.

Designed for industrial applications, this device offers 5,936 logic elements, approximately 0.184 Mbits (184,320 bits) of on-chip RAM, and 29 general-purpose I/Os, delivered in a surface-mount 64-ucfBGA (3.5 × 3.5 mm) package. The device operates from a 1.14 V to 1.26 V supply and is specified for an operating range of −40 °C to 100 °C.

Key Features

• Programmable Fabric 5,936 logic elements for custom logic, state machines, and protocol implementation.
• Embedded Memory Approximately 0.184 Mbits (184,320 bits) of on-chip block RAM for buffering, frame storage, and local data structures.
• I/O and Interfaces 29 general-purpose I/Os with CrossLink family sysI/O and programmable I/O bank features described in the datasheet, plus hardened MIPI D‑PHY blocks referenced in the CrossLink documentation.
• Clocking and Power Management Integrated clocking structures and a Power Management Unit (PMU) are described for system-level control and timing management in the CrossLink family data sheet.
• Package and Mounting 64-VFBGA package (supplier package: 64-ucfBGA, 3.5 × 3.5 mm) optimized for surface-mount assembly in compact systems.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial-environment requirements.
• Low-Voltage Core Supply Core supply range from 1.14 V to 1.26 V for designs that require low-voltage FPGA cores.
• Regulatory RoHS compliant.

Typical Applications

• Camera and Sensor Interfaces Use the CrossLink family’s documented MIPI D‑PHY blocks and programmable I/O to implement camera or sensor interface logic and protocol bridging.
• Embedded Vision Preprocessing On-chip logic and embedded RAM enable local preprocessing, buffering, and low-latency pipeline stages for vision systems.
• Industrial I/O and Protocol Bridging Industrial-grade temperature rating and flexible I/O make the device suitable for custom interface conversions and field instrumentation logic.
• Compact System Integration The 3.5 × 3.5 mm 64-ball BGA package supports space-constrained designs where programmable logic is required.

Unique Advantages

• Compact, production-ready package: 64-ucfBGA (3.5 × 3.5 mm) enables FPGA functionality in small form-factor boards.
• Balanced logic and memory: 5,936 logic elements with approximately 0.184 Mbits of embedded RAM for a variety of mixed logic and buffering tasks.
• Integrated I/O capabilities: CrossLink family sysI/O features and documented MIPI D‑PHY blocks reduce the need for separate interface ICs when implementing high-speed sensor links.
• Industrial temperature tolerance: −40 °C to 100 °C spec supports deployment in harsh or temperature-variable environments.
• Low-voltage core operation: 1.14 V to 1.26 V supply aligns with low-power system designs.
• RoHS compliant: Meets common material compliance requirements for modern electronics manufacturing.

Why Choose LIF-MD6000-6UMG64ITR?

The LIF-MD6000-6UMG64ITR positions itself as a compact, industrial-grade FPGA option within the CrossLink family, delivering a balanced combination of programmable logic, embedded memory, and documented interface blocks. Its small 64-ball BGA package, industrial temperature range, and low-voltage core supply make it suitable for space-constrained and temperature-challenged embedded systems that need flexible I/O and on-chip preprocessing.

This device is appropriate for designers who require a vetted CrossLink-family FPGA with explicit datasheet coverage for programmable I/O, clocking, power management, and MIPI D‑PHY blocks. Its specification set supports straightforward integration into sensor interfaces, embedded vision pipelines, and custom protocol bridging in industrial applications.

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