LIF-MD6000-6UMG64ITR1K

The LIF-MD6000-6UMG64ITR1K is a CrossLink™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, offering a compact, surface-mount 64‑VFBGA package and industrial operating range. The device integrates programmable FPGA fabric with embedded memory, programmable I/O banks and hardened MIPI D‑PHY blocks as described in the CrossLink family data sheet.

Designed for applications requiring flexible I/O configuration, deterministic clocking and on-chip memory, this part targets embedded designs that must operate across a wide temperature range while staying within a 1.14 V to 1.26 V core supply envelope.

Key Features

• Programmable Logic — 5,936 logic elements of programmable fabric suitable for implementing custom logic, protocol adapters and control functions.
• Embedded Memory — Approximately 0.18 Mbits (184,320 bits) of on‑chip RAM to support buffering, small data stores and state machines.
• I/O Count & Flexibility — 29 I/Os with programmable sysI/O buffers and programmable I/O banks; datasheet documents on‑chip termination, output drive strength and configurable pull modes.
• MIPI D‑PHY & High‑Speed Interfaces — CrossLink family includes MIPI D‑PHY blocks and hardened MIPI D‑PHY I/Os, enabling direct support for MIPI D‑PHY signaling as outlined in the datasheet.
• Clocking & Timing — Integrated clock resources including sysCLK PLL, edge and primary clocks, and internal oscillators (HFOSC, LFOSC) for on‑chip clock generation and distribution.
• Power Management — On‑chip Power Management Unit (PMU) and power sequencing guidance included in the CrossLink family documentation.
• Industrial Grade & Temperature Range — Specified operating temperature from -40 °C to 100 °C for deployments in industrial environments.
• Package & Mounting — 64‑VFBGA (supplier device package: 64‑ucfBGA, 3.5 × 3.5 mm) surface‑mount package suitable for compact board designs.
• Supply & Compliance — Core voltage range 1.14 V to 1.26 V; RoHS compliant.

Typical Applications

• High‑speed serial interface bridging — Use the integrated MIPI D‑PHY blocks and programmable fabric to implement protocol conversion and interface bridging.
• Embedded I/O and control — Implement custom peripheral controllers, glue logic and I/O conditioning with the device’s programmable I/O banks and on‑chip memory.
• Industrial control and monitoring — Industrial temperature rating and surface‑mount 64‑VFBGA package make the device suitable for space‑constrained industrial systems requiring reliable operation from -40 °C to 100 °C.
• Compact embedded designs — Small 3.5 × 3.5 mm package and integrated clocking/PMU features support compact, integrated modules and boards.

Unique Advantages

• Highly configurable logic capacity — 5,936 logic elements provide a balance of programmable resources for a wide range of custom logic tasks without large package overhead.
• Integrated MIPI D‑PHY support — Hardened MIPI D‑PHY blocks and related I/O reduce design complexity for systems that require MIPI signaling.
• On‑chip RAM for local buffering — Approximately 0.18 Mbits of embedded memory enables local data storage for buffering and stateful functions, reducing external memory needs.
• Industrial operating range — Specified for -40 °C to 100 °C operation to meet industrial environment requirements.
• Compact, manufacturable package — 64‑VFBGA (64‑ucfBGA, 3.5 × 3.5 mm) surface‑mount package supports dense board layouts and automated assembly.
• Documented clocking and power features — sysCLK PLL, internal oscillators and a Power Management Unit are detailed in the CrossLink family data sheet for deterministic clock and power sequencing design.

Why Choose LIF-MD6000-6UMG64ITR1K?

The LIF-MD6000-6UMG64ITR1K delivers a compact CrossLink FPGA implementation that combines programmable logic, embedded RAM and hardened MIPI D‑PHY functionality in a small, surface‑mount 64‑VFBGA package. Its documented clocking, I/O and power management features from the CrossLink family data sheet support disciplined design and predictable integration.

This part is well suited for engineers and procurement teams targeting industrial‑temperature embedded systems that need flexible I/O, MIPI D‑PHY connectivity and an on‑chip memory complement suitable for buffering and local storage, all backed by Lattice Semiconductor’s CrossLink family documentation.

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