LIF-MD6000-6UMG64I
| Part Description |
CrossLink™ Field Programmable Gate Array (FPGA) IC 29 184320 5936 64-VFBGA |
|---|---|
| Quantity | 26 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 64-ucfBGA (3.5x3.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 64-VFBGA | Number of I/O | 29 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1484 | Number of Logic Elements/Cells | 5936 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 184320 |
Overview of LIF-MD6000-6UMG64I – CrossLink Field Programmable Gate Array (FPGA), 5,936 logic elements, 184,320-bit RAM, 64‑VFBGA
The LIF-MD6000-6UMG64I is a CrossLink™ FPGA IC from Lattice Semiconductor designed for industrial-grade embedded designs. It provides a programmable FPGA fabric with 5,936 logic elements and 184,320 bits of on-chip RAM in a compact 64‑VFBGA package. Key platform attributes include a low-voltage supply window (1.14 V–1.26 V), 29 I/O, and an operating temperature range of −40 °C to 100 °C, making it suitable for space-constrained, temperature-demanding applications.
Key Features
- Programmable Logic 5,936 logic elements for implementing custom logic, signal processing, and glue‑logic functions.
- Embedded Memory 184,320 bits of total on-chip RAM to support buffering, FIFOs, and small data tables directly in the fabric.
- I/O and System Interface 29 I/O providing flexible connectivity for peripheral interfaces and board-level signals.
- Power Narrow supply range of 1.14 V to 1.26 V for the device core compatibility with precise system power rails.
- Package and Mounting 64‑VFBGA (supplier device package: 64‑ucfBGA, 3.5 × 3.5 mm) in a surface-mount form factor for compact PCB designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
- Regulatory / Environmental RoHS‑compliant to meet common environmental and manufacturing requirements.
- Family-Level Architecture (CrossLink) Datasheet-referenced architecture elements include programmable I/O banks, programmable fabric, clocking structure, embedded block RAM, and power management unit—enabling system-level integration and versatile design partitioning.
Unique Advantages
- Compact high-density packaging: The 64‑VFBGA (3.5 × 3.5 mm) package delivers a small board footprint while retaining meaningful logic and memory resources.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments without additional thermal qualification notes in the product data.
- Low-voltage core operation: The 1.14 V–1.26 V supply window allows alignment with precision low-voltage power rails common in modern embedded systems.
- On-chip RAM for local buffering: 184,320 bits of embedded RAM reduce reliance on external memory for modest buffering and data staging needs.
- RoHS compliance: Meets environmental regulations for lead-free assembly and manufacturing processes.
Why Choose LIF-MD6000-6UMG64I?
The LIF-MD6000-6UMG64I positions itself as a compact, industrial-grade CrossLink FPGA option for engineers looking to integrate programmable logic, embedded memory, and a flexible I/O complement into space-limited designs. Its combination of 5,936 logic elements, on-chip RAM, and a tight core voltage window supports efficient partitioning of control, interface, and signal-processing duties directly on-chip.
This device is well suited for development teams and product designs that require a small-footprint FPGA with industry temperature range and RoHS compliance. The CrossLink family architecture details in the datasheet—covering programmable I/O, clocking, embedded RAM, and power management—support robust implementation choices and long-term design scalability.
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