LIF-MD6000-6KMG80I

IC FPGA 37 I/O 80CKFBGA
Part Description

CrossLink™ Field Programmable Gate Array (FPGA) IC 37 184320 5936 80-TFBGA

Quantity 1,780 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package80-CKFBGA (7x7)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case80-TFBGANumber of I/O37Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1484Number of Logic Elements/Cells5936
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits184320

Overview of LIF-MD6000-6KMG80I – CrossLink™ FPGA — 5,936 logic elements, ≈0.18 Mbits embedded memory, 37 I/Os, 80-TFBGA

The LIF-MD6000-6KMG80I is a CrossLink™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, offering a programmable fabric with dedicated I/O and embedded resources. It provides 5,936 logic elements, approximately 0.18 Mbits of on-chip RAM, and 37 I/Os in an 80-TFBGA surface-mount package.

This device is designed for designs that require programmable I/O, integrated MIPI D‑PHY capability and on-chip memory while operating from a low core supply (1.14 V to 1.26 V) across an industrial temperature range (−40 °C to 100 °C). It is RoHS compliant.

Key Features

  • Programmable Fabric — 5,936 logic elements (cells) provide the programmable logic capacity for custom functions and protocol adaptation.
  • Embedded Memory — Approximately 0.18 Mbits (184,320 bits) of total on-chip RAM for buffering, frame memory or data processing tasks.
  • I/O and Interfaces — 37 general-purpose I/Os with programmable sysI/O buffers and dedicated MIPI D‑PHY blocks documented in the CrossLink family data sheet.
  • Clocking and Timing — Integrated clocking structure including PLLs and internal oscillators described in the CrossLink family documentation to support flexible clock management.
  • Power and Voltage — Low-voltage core supply range of 1.14 V to 1.26 V to support energy-conscious system designs.
  • Power Management — On-chip Power Management Unit (PMU) functionality is included in the CrossLink family architecture to support controlled power sequencing and management.
  • Package and Mounting — Surface-mount 80-TFBGA package (Supplier Device Package: 80-CKFBGA, 7×7) for compact PCB integration.
  • Industrial Temperature Range — Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
  • Standards and Compliance — RoHS compliant.

Typical Applications

  • Imaging and Vision Interfaces — Implements MIPI D‑PHY and programmable logic for camera interface bridging, preprocessing, or protocol conversion in embedded vision systems.
  • Sensor and Perimeter I/O — Programmable I/O banks and sysI/O buffer options enable flexible sensor interfacing and protocol adaptation for industrial sensor hubs.
  • Protocol Bridging and Interface Adaptation — Use the programmable fabric and I/O resources to implement custom protocol bridges or timing adapters between subsystems.
  • Embedded Prototyping and Control — Compact package and integrated resources make the device suitable for embedded control functions and proof-of-concept designs requiring moderate logic density.

Unique Advantages

  • Balanced Logic and Memory — 5,936 logic elements paired with ~0.18 Mbits of embedded RAM provide a mid-range resource balance for control, buffering and preprocessing tasks.
  • Integrated MIPI D‑PHY Capability — Documented MIPI D‑PHY blocks in the CrossLink family simplify implementation of camera and display interfaces where applicable.
  • Compact, Surface-Mount Package — 80-TFBGA footprint and 7×7 supplier package option support space-constrained PCB designs.
  • Industrial Temperature Range — −40 °C to 100 °C operating range supports deployment in industrial environments.
  • Low-Voltage Core — 1.14 V to 1.26 V core supply range supports low-power system designs and modern power-rail architectures.
  • Documented Family-Level Features — CrossLink family data sheet provides details on programmable I/O banks, sysI/O buffers, PLLs, embedded RAM, PMU and configuration options for design planning.

Why Choose LIF-MD6000-6KMG80I?

The LIF-MD6000-6KMG80I positions itself as a practical FPGA choice for embedded systems that need moderate logic density, flexible I/O, and on-chip memory in a small surface-mount package. Its CrossLink family architecture documents dedicated MIPI D‑PHY blocks, programmable I/O banks, clocking resources and power management features that help reduce external component count and simplify interface implementations.

This device is suited to engineers building compact imaging interfaces, sensor hubs, protocol bridges or control subsystems who require documented family-level resources, industrial temperature operation and RoHS compliance. The CrossLink family documentation provides the technical details needed to plan integration and configuration.

Request a quote or submit a procurement inquiry to begin sourcing LIF-MD6000-6KMG80I for your next design. Include your quantity and delivery requirements for a tailored response.

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