LIF-MD6000-6MG81I

IC FPGA 37 I/O 81CSFBGA
Part Description

CrossLink™ Field Programmable Gate Array (FPGA) IC 37 184320 5936 81-VFBGA

Quantity 665 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package81-CSFBGA (4.5x4.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case81-VFBGANumber of I/O37Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1484Number of Logic Elements/Cells5936
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits184320

Overview of LIF-MD6000-6MG81I – CrossLink™ Field Programmable Gate Array (FPGA) IC 37 184320 5936 81-VFBGA

The LIF-MD6000-6MG81I is a CrossLink family FPGA in an 81-VFBGA package designed for compact, programmable logic integration. Its architecture, documented in the CrossLink data sheet, includes programmable I/O banks, MIPI D-PHY blocks, embedded block RAM, and a system clock PLL and power management unit—features that support flexible interface and timing functions in space-constrained designs.

With 5,936 logic elements, approximately 0.18 Mbits of embedded RAM and support for a 1.14 V to 1.26 V core supply, this industrial-grade, RoHS-compliant device targets applications that require configurable logic, on-chip memory and robust operating conditions from −40 °C to 100 °C.

Key Features

  • Logic Capacity — 5,936 logic elements providing programmable fabric for custom logic implementation and control functions.
  • Configurable Logic Blocks (CLBs) — 1,484 CLBs for structured logic partitioning and resource allocation.
  • Embedded Memory — Approximately 0.18 Mbits (184,320 bits) of on-chip RAM for buffering, frame storage or small data structures.
  • I/O Count & Flexibility — 37 I/Os with programmable sysI/O banks and on-chip I/O features referenced in the CrossLink architecture.
  • Hardened MIPI D-PHY Blocks — Integrated MIPI D-PHY building blocks as detailed in the CrossLink family data sheet for high-speed serial camera/visual interface support.
  • Clocking & Timing — Integrated sysCLK PLL, primary/edge clock structures and internal oscillators for flexible clock management.
  • Power & Supply — Core voltage supply range of 1.14 V to 1.26 V and documented power management unit (PMU) in the CrossLink documentation.
  • Package & Assembly — Surface-mount 81-VFBGA (supplier package: 81-CSFBGA, 4.5 × 4.5 mm) for compact board-level integration.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
  • Regulatory — RoHS-compliant.

Typical Applications

  • Camera and Vision Interfaces — Use built-in MIPI D-PHY blocks and programmable I/O to implement camera bridging, preprocessing or format conversion functions.
  • Sensor Aggregation & Bridge Functions — Embedded RAM and programmable fabric enable data buffering and protocol adaptation between sensors and host systems.
  • Compact Embedded Systems — Small 4.5 × 4.5 mm package and low-voltage core make the device suitable for tight-board designs requiring configurable logic.

Unique Advantages

  • Compact, production-ready package: 81-VFBGA (81-CSFBGA, 4.5 × 4.5 mm) enables high-density board layouts without sacrificing connectivity.
  • On-chip memory for local buffering: Approximately 0.18 Mbits of embedded RAM reduces dependence on external memory for short-term storage and streaming tasks.
  • Integrated MIPI D-PHY capability: Hardened D-PHY blocks simplify implementation of common high-speed serial interfaces described in the CrossLink documentation.
  • Industrial temperature range: Rated from −40 °C to 100 °C for reliable operation in a wide range of environments.
  • Low-voltage core: 1.14 V to 1.26 V supply range supports modern low-power system architectures and consistent power sequencing as outlined in the datasheet.
  • RoHS-compliant: Meets common environmental requirements for electronics manufacturing.

Why Choose LIF-MD6000-6MG81I?

The LIF-MD6000-6MG81I brings CrossLink family programmability and I/O versatility into a compact, industrial-grade package. Its combination of 5,936 logic elements, approximately 0.18 Mbits of embedded RAM, integrated MIPI D-PHY blocks and flexible clocking and power management options makes it well suited to designs that require deterministic interface logic, localized buffering and robust operation across wide temperature ranges.

This device is a practical choice for engineers building space-constrained systems that need configurable logic and on-chip resources, offering clear specification traceability for procurement and design validation based on the CrossLink family documentation.

Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the LIF-MD6000-6MG81I.

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