LIF-MD6000-6UWG36ITR

The LIF-MD6000-6UWG36ITR is a CrossLink™ family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers a moderate logic density FPGA fabric in a compact 36-UFBGA WLCSP package with industrial-grade operating range and surface-mount mounting.

This device is suited for embedded designs that require programmable logic, on-chip embedded memory, and a small footprint with a supply voltage between 1.14 V and 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Programmable FPGA Fabric – Provides 5,936 logic elements for implementing custom logic, state machines, and glue logic.
• Embedded Memory – Approximately 0.18 Mbits (184,320 bits) of on-chip RAM for buffering, frame storage, and small data structures.
• I/O and Interface Count – 17 general-purpose I/O pins for system connections in a compact package.
• CrossLink Family I/O and PHY Blocks – Family-level features include MIPI D‑PHY blocks and programmable I/O banks with configurable pull modes and output drive strength options.
• Clocking and Timing – Family documentation describes sysCLK PLL and internal oscillator options for flexible clocking and timing management.
• Power and Configuration – Includes a Power Management Unit and documented programming/configuration flow in the CrossLink family datasheet.
• Package and Mounting – 36-UFBGA WLCSP surface-mount package; supplier device package specified as 36-WLCSP (2.54 × 2.59 mm).
• Electrical and Environmental – Recommended supply range of 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Compact Embedded Systems – Small WLCSP footprint and surface-mount mounting make the device suitable for space-constrained embedded boards requiring programmable logic.
• Industrial Control and Automation – Industrial-grade temperature range supports designs deployed in factory and industrial environments where extended temperature tolerance is required.
• Interface Bridging and Sensor I/O – CrossLink family MIPI D‑PHY and programmable I/O bank capabilities support designs that require protocol bridging or sensor interface adaptation.
• On-Board Glue Logic – Moderate logic density and embedded RAM enable creation of custom glue logic, timing interfaces, and small state machines directly on the PCB.

Unique Advantages

• Compact, high-density packaging: 36-WLCSP (2.54 × 2.59 mm) lets you integrate programmable logic into small form-factor designs without sacrificing I/O capability.
• Controlled power envelope: Narrow supply voltage window (1.14 V–1.26 V) simplifies power-supply design and voltage management on the board.
• Family-proven I/O and PHY features: CrossLink family MIPI D‑PHY blocks and programmable sysI/O options reduce the need for additional external interface components.
• Industrial temperature support: Rated for −40 °C to 100 °C operation to meet environmental requirements for industrial deployments.
• Embedded memory for local buffering: Approximately 0.18 Mbits of on-chip RAM supports buffering and small data-store needs without external memory.

Why Choose LIF-MD6000-6UWG36ITR?

The LIF-MD6000-6UWG36ITR brings CrossLink family capabilities into a compact, industrial-grade WLCSP package with a clearly defined supply and temperature range. With 5,936 logic elements, approximately 0.18 Mbits of embedded RAM, and family-level support for MIPI D‑PHY and programmable I/O, the device is positioned for embedded designs that need on-board programmable logic, interface flexibility, and a small PCB footprint.

This part is appropriate for engineers and procurement teams building compact industrial systems, interface bridges, or space-constrained embedded products that require documented CrossLink family features and on-chip resources while maintaining RoHS compliance.

Request a quote or submit a product inquiry to get pricing, availability, and assistance integrating the LIF-MD6000-6UWG36ITR into your design.