LIF-MDF6000-6UMG64I

The LIF-MDF6000-6UMG64I is a CrossLinkPlus family Field Programmable Gate Array (FPGA) IC. It provides a programmable fabric with 5,936 logic elements, embedded block RAM, and dedicated I/O and PHY building blocks described in the CrossLinkPlus datasheet.

Designed as an industrial-grade surface-mount device in a 64‑VFBGA (64‑ucfBGA, 3.5 × 3.5 mm) package, the device supports a 1.14 V to 1.26 V core supply and an operating temperature range of −40 °C to 100 °C, with 29 I/O pins and RoHS compliance.

Key Features

• Programmable Fabric — 5,936 logic elements providing configurable PFU blocks and slice-based logic as outlined in the CrossLinkPlus architecture.
• Embedded Memory — Approximately 0.18 Mbits of embedded block RAM (184,320 bits) for on-chip buffering and local storage.
• MIPI D-PHY Blocks — Hardened MIPI D-PHY blocks are included in the CrossLinkPlus family architecture to support MIPI physical-layer interfaces.
• Programmable I/O and sysI/O Buffers — Programmable I/O banks with configurable pull modes, output drive strength, and on‑chip termination options described in the datasheet.
• Clocking and Timing — Integrated clocking structure with sysCLK PLL, primary and edge clocks, dynamic clock enables, and internal oscillator options per the family documentation.
• Power Management — Power Management Unit (PMU) and state machine functionality designed into the family for controlled power sequencing and management.
• Package and Mounting — 64‑VFBGA (64‑ucfBGA, 3.5 × 3.5 mm) surface-mount package suitable for space‑constrained PCB designs.
• Industrial Temperature and Compliance — Industrial-grade device rated for −40 °C to 100 °C and RoHS compliant.

Typical Applications

• MIPI camera and sensor interfaces — Devices that require MIPI D-PHY connectivity and programmable logic for interface adaption and pre-processing.
• Programmable I/O bridging — Systems needing flexible I/O mapping and drive-strength/termination control between disparate peripherals.
• Embedded control and logic — Industrial systems requiring on-chip logic, embedded RAM, and deterministic clocking within an industrial temperature envelope.
• Compact FPGA deployments — Space-constrained designs that benefit from a small 3.5 × 3.5 mm 64‑VFBGA footprint with surface-mount mounting.

Unique Advantages

• Compact, production-ready package: 64‑VFBGA (3.5 × 3.5 mm) surface-mount package reduces PCB area while retaining 29 usable I/O pins.
• On-chip memory for local buffering: Approximately 0.18 Mbits of embedded RAM enables local data storage without external RAM in many use cases.
• Dedicated PHY and I/O features: Inclusion of MIPI D-PHY blocks and programmable sysI/O buffers simplifies integration of common serial interfaces.
• Industrial operating range: Specified −40 °C to 100 °C operation supports deployment in industrial environments.
• Controlled power domain: Core supply operation between 1.14 V and 1.26 V with an integrated PMU and configuration support as outlined in the family datasheet.

Why Choose LIF-MDF6000-6UMG64I?

The LIF-MDF6000-6UMG64I combines a CrossLinkPlus programmable fabric with dedicated I/O and PHY resources in a compact 64‑VFBGA package. Its mix of 5,936 logic elements, on‑chip block RAM, MIPI D-PHY capability and comprehensive clocking and power management features make it suitable for designs that require configurable logic, local buffering, and flexible I/O control within an industrial temperature range.

Engineers building compact, industrial-grade systems benefit from the device's small footprint, programmable interfaces, and family-level architecture described in the CrossLinkPlus documentation—providing a verifiable, architecture-driven foundation for integration and scale in production designs.

Request a quote or submit a product inquiry to receive pricing and availability information for LIF-MDF6000-6UMG64I. Our team will respond with a tailored quotation and configuration guidance.