LIFCL-17-7BG256I

IC FPGA 78 I/O 256CABGA
Part Description

CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 78 442368 17000 256-LFBGA

Quantity 1,511 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LFBGANumber of I/O78Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LIFCL-17-7BG256I – CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 78 442368 17000 256-LFBGA

The LIFCL-17-7BG256I is a CrossLink-NX™ field programmable gate array (FPGA) IC designed for industrial-grade programmable logic applications. It integrates 17,000 logic elements with on-chip embedded memory and a flexible I/O count to support a range of control, interface and signal-processing tasks.

With a low-voltage core supply range (0.95–1.05 V), a 256-LFBGA surface-mount package, and an industrial operating temperature range, this device targets robust embedded designs that require moderate logic density, local memory, and a compact footprint.

Key Features

  • Logic Capacity  17,000 logic elements for implementing custom digital functions and moderate-complexity FPGA designs.
  • Embedded Memory  Approximately 0.44 Mbits of on-chip RAM (442,368 bits) to support buffering, small FIFOs, and local data storage without external memory.
  • I/O Count  78 I/O pins to connect sensors, actuators, interfaces, and external peripherals directly to the FPGA fabric.
  • Power  Core voltage supply range of 0.95 V to 1.05 V to support low-voltage FPGA operation and power-sensitive system designs.
  • Package & Mounting  256-LFBGA package (supplier device package: 256-CABGA, 14×14) in a surface-mount form factor suitable for compact PCB layouts.
  • Temperature & Grade  Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.

Typical Applications

  • Industrial Control  Programmable logic for PLCs, motor controllers, and machine automation where industrial temperature range and on-board logic are required.
  • Interface Bridging  Custom protocol translation and glue logic using available I/Os and embedded memory to buffer and process signals between subsystems.
  • Sensor Aggregation  Collecting, conditioning, and pre-processing sensor data at the edge before handing off to a host processor, leveraging local RAM and I/Os.
  • Embedded System Prototyping  Development of moderate-complexity programmable logic blocks and proof-of-concept designs in compact, surface-mount form factors.

Unique Advantages

  • Balanced Logic Density:  17,000 logic elements provide a mid-range capacity suitable for many control and interface functions without excessive board space.
  • Local Memory Resources:  Approximately 0.44 Mbits of embedded RAM reduce dependence on external memory for buffering and small data structures.
  • Robust Industrial Operation:  Rated for -40 °C to 100 °C operation and marked as industrial grade for deployment in challenging environments.
  • Compact Surface-Mount Package:  256-LFBGA (256-CABGA, 14×14) enables high I/O count in a compact footprint for space-constrained PCBs.
  • Low-Voltage Core:  0.95–1.05 V supply range supports low-power core operation and compatibility with modern system power rails.
  • Regulatory-Friendly:  RoHS compliance simplifies integration into assemblies subject to environmental regulations.

Why Choose LIFCL-17-7BG256I?

The LIFCL-17-7BG256I delivers a practical combination of logic capacity, embedded memory, and I/O density in a compact 256-LFBGA package tailored for industrial applications. Its low-voltage core and industrial temperature rating make it suitable for embedded systems that require reliable, programmable logic close to sensors, actuators, and interfaces.

This device is a solid option for engineers and procurement teams designing mid-complexity FPGA solutions that value integration, compact packaging, and environmental compliance while maintaining the flexibility of programmable logic.

Request a quote or submit an inquiry to receive pricing and availability details for the LIFCL-17-7BG256I CrossLink-NX™ FPGA.

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