LIFCL-17-7SG72C

The LIFCL-17-7SG72C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) packaged in a 72-VFQFN exposed pad surface-mount package. It delivers programmable logic capacity and on-chip memory suited for compact commercial designs that require up to 40 general-purpose I/O pins and a controlled low-voltage core supply.

Designed for commercial-grade embedded systems, the device combines approximately 17,000 logic elements with on-chip memory and a small 72-QFN (10×10) footprint to support space-constrained board designs while maintaining RoHS compliance.

Key Features

• Core Logic  Approximately 17,000 logic elements provide flexible programmable logic capacity for custom functions and control logic.
• Embedded Memory  Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, LUTs, and small data storage needs.
• I/O  40 user I/O pins to support multiple peripherals and interfaces in compact designs.
• Power  Core voltage supply range of 0.95 V to 1.05 V for low-voltage FPGA implementations.
• Package & Mounting  72-VFQFN exposed pad (supplier package: 72-QFN 10×10) in a surface-mount format optimized for dense, compact PCBs.
• Operating Range  Commercial temperature rating with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for global commercial product designs.

Typical Applications

• Commercial embedded systems  Compact designs that require programmable logic, up to 40 I/Os, and integrated on-chip memory in a small QFN footprint.
• Board-level integration and prototyping  Surface-mount 72-QFN (10×10) package with exposed pad supports dense PCB layouts for prototype and production builds.
• Low-voltage FPGA implementations  Designs that operate with a core supply between 0.95 V and 1.05 V and require predictable power rails.

Unique Advantages

• Balanced logic and memory  Combines approximately 17,000 logic elements with about 0.42 Mbits of on-chip RAM to handle control, buffering, and modest data-processing tasks.
• Compact package  72-VFQFN exposed pad in a 72-QFN (10×10) footprint reduces board area while supporting thermal dissipation through the exposed pad.
• Clear power envelope  A defined core voltage range (0.95–1.05 V) simplifies power-supply planning and system design.
• Commercial temperature suitability  Rated for 0 °C to 85 °C operation to meet standard commercial product requirements.
• Regulatory friendliness  RoHS compliance supports environmental and regulatory objectives for commercial products.

Why Choose LIFCL-17-7SG72C?

The LIFCL-17-7SG72C positions itself as a compact, commercially rated FPGA option that balances programmable logic density and embedded memory within a small 72-VFQFN package. Its combination of approximately 17,000 logic elements, 442,368 bits of on-chip RAM, and 40 I/Os makes it suitable for space-constrained commercial designs requiring configurable logic and modest on-chip storage.

This device is a fit for engineers and product teams building commercial embedded systems, prototypes, and production boards where board area, low-voltage operation, and RoHS compliance matter. Its footprint and thermal-friendly exposed pad help integrate programmable logic into compact PCBs while supporting predictable power and temperature envelopes.

Request a quote or submit your requirements today to get pricing and availability for the LIFCL-17-7SG72C.