LIFCL-17-8BG256I

The LIFCL-17-8BG256I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, offered in a 256-pin LFBGA package. It delivers 17,000 logic elements with approximately 0.44 Mbits of embedded memory and 78 I/O pins, making it suitable for industrial-class programmable logic tasks that require flexible I/O and on-chip memory.

Designed for industrial use, the device supports a core supply range of 0.95–1.05 V and an operating temperature range of −40 °C to 100 °C, providing a combination of integration and environmental robustness for embedded and control-oriented designs.

Key Features

• Core Logic  17,000 logic elements provide the programmable fabric for implementing custom logic, state machines, and data-path functions.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM for buffering, FIFOs, and local storage without external memory.
• I/O Capacity  78 configurable I/O pins to support a wide range of peripheral connections and interface options.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match low-voltage system domains and enable optimized power delivery.
• Package & Mounting  256-LFBGA package (supplier package: 256-CABGA, 14×14) with surface-mount mounting for compact board integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Programmable logic and I/O integration for controllers and I/O bridging in industrial environments, supported by the industrial temperature rating.
• Embedded Systems  On-chip logic and embedded RAM support custom processing, protocol handling, and local buffering in compact embedded designs.
• Interface Aggregation  Use the 78 I/Os to consolidate and manage multiple peripheral connections or to implement custom interface translations.

Unique Advantages

• Balanced Logic and Memory  17,000 logic elements paired with approximately 0.44 Mbits of embedded RAM allow designers to implement both control logic and local data storage on-chip.
• Industrial Temperature Capability  Rated for −40 °C to 100 °C operation, enabling designs intended for industrial and temperature-variable deployments.
• Compact, Surface-Mount Packaging  256-LFBGA (256-CABGA, 14×14) packaging supports high-density PCB layouts while keeping the module footprint small.
• Flexible I/O Count  78 I/O pins provide capacity to connect sensors, controllers, and external devices without immediate need for I/O expanders.
• Low-Voltage Core Operation  Core supply range of 0.95–1.05 V enables integration into modern low-voltage system domains.
• Regulatory-Friendly  RoHS compliance supports environmental and regulatory requirements for many industrial products.

Why Choose LIFCL-17-8BG256I?

The LIFCL-17-8BG256I positions itself as a versatile industrial-grade FPGA offering a practical balance of programmable logic, embedded memory, and I/O capacity in a compact surface-mount package. Its low-voltage core range and extended operating temperature make it suitable for embedded and industrial designs that need on-chip processing and flexible interfacing.

This device is well suited to engineers and teams building control systems, embedded platforms, or I/O aggregation solutions who require a reliable, RoHS-compliant FPGA with clear thermal and power specifications. Its combination of logic density, memory, and I/O provides a scalable building block for mid-range programmable logic implementations.

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