LIFCL-17-8MG121I

IC FPGA 72 I/O 121CSFBGA
Part Description

CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 72 442368 17000 121-VFBGA, CSPBGA

Quantity 1,104 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package121-CSFBGA (6x6)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case121-VFBGA, CSPBGANumber of I/O72Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LIFCL-17-8MG121I – CrossLink-NX™ FPGA, 17,000 logic elements, 72 I/O, 121-VFBGA

The LIFCL-17-8MG121I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC delivering 17,000 logic elements and approximately 0.44 Mbits of embedded RAM (442,368 bits) in a compact 121-ball VFBGA/CSPBGA package. Built for board-level integration, it offers 72 I/O and surface-mount packaging suitable for industrial applications.

Designed for low-voltage core operation (0.95 V to 1.05 V) and rated for an operating range of −40 °C to 100 °C, this FPGA balances programmable logic capacity, on-chip memory, and a small-footprint package while meeting RoHS compliance requirements.

Key Features

  • Programmable Logic Capacity — 17,000 logic elements provide mid-range programmable logic resources for custom digital functions and control logic.
  • Embedded Memory — Approximately 0.44 Mbits of on-chip RAM (442,368 bits) to support buffering, small datasets, and state storage without external memory.
  • Flexible I/O — 72 I/O pins enable multiple peripheral interfaces and board-level connectivity options.
  • Low-Voltage Core — Core supply range from 0.95 V to 1.05 V supports low-power system designs and modern power architectures.
  • Compact, Surface-Mount Package — 121-VFBGA (CSPBGA) footprint, supplier package 121-CSFBGA (6×6), optimized for space-constrained PCBs and automated assembly.
  • Industrial Temperature and Grade — Rated for −40 °C to 100 °C and specified as Industrial grade for deployment in demanding environments.
  • RoHS Compliant — Meets directive requirements for reduced hazardous substances.

Unique Advantages

  • Right-sized Logic Density: 17,000 logic elements provide adequate capacity for mid-level custom logic without the cost and size of larger FPGAs.
  • On-chip Memory Reduces BOM: Approximately 0.44 Mbits of embedded RAM can lower or eliminate the need for some external memory components.
  • Ample I/O for Integration: 72 I/O pins enable flexible connectivity to sensors, peripherals, and system interfaces.
  • Compact Packaging for Dense Boards: The 121-ball VFBGA/CSPBGA package minimizes board area while supporting surface-mount assembly.
  • Industrial Temperature Range: −40 °C to 100 °C rating supports operation in a wide range of environmental conditions.
  • Low-Voltage Operation: 0.95–1.05 V core supply helps align with modern low-voltage power domains.

Why Choose LIFCL-17-8MG121I?

The LIFCL-17-8MG121I positions itself as a balanced FPGA option for designers who need meaningful programmable logic capacity, on-chip memory, and a compact package while meeting industrial temperature requirements. Its combination of 17,000 logic elements, 72 I/O, and surface-mount 121-VFBGA packaging makes it appropriate for space-constrained boards that require reliable operation across −40 °C to 100 °C.

For engineering teams and procurement seeking a RoHS-compliant, industrial-grade FPGA with low-voltage core operation and integrated memory, the LIFCL-17-8MG121I offers a practical mix of capability and integration to streamline designs and reduce external component count.

Request a quote or submit your specifications today to evaluate LIFCL-17-8MG121I for your next design.

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