LIFCL-17-8SG72C

The LIFCL-17-8SG72C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial-grade embedded designs. This device integrates approximately 17,000 logic elements with on-chip memory and a compact exposed-pad 72-VFQFN package to support space-conscious system designs.

With 40 I/O pins, approximately 0.44 Mbits of embedded RAM and low-voltage operation from 0.95 V to 1.05 V, the device targets commercial embedded applications requiring a balance of logic capacity, on-chip memory and low-voltage power-envelope operation.

Key Features

• Core Logic Approximately 17,000 logic elements provide programmable logic capacity for medium-complexity designs.
• Programmable Logic Blocks 4,250 internal logic blocks support structured implementation of combinational and sequential logic (data field: Number Of Labs Clbs).
• Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM for buffering, state storage and small data tables.
• I/O Count 40 general-purpose I/O pins to interface with external peripherals and sensors.
• Power Low-voltage supply range from 0.95 V to 1.05 V to support designs constrained by tight power budgets.
• Package and Mounting Surface-mount 72-VFQFN exposed pad; supplier device package listed as 72-QFN (10x10) for compact PCB integration.
• Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant to meet common environmental requirements for commercial products.

Typical Applications

• Commercial Embedded Systems — Use as a programmable logic engine where approximately 17,000 logic elements and on-chip RAM enable custom control, glue-logic and protocol handling within commercial-product temperature ranges.
• Interface and I/O Management — 40 I/O pins allow the device to manage multiple peripheral interfaces and signal-conditioning tasks in compact board designs.
• Prototyping and Development — Suitable for evaluating mid-density programmable logic functions and early hardware/software integration on a compact QFN footprint.

Unique Advantages

• Optimized Logic Density: Approximately 17,000 logic elements provide a practical balance between capabilities and board-level cost for commercial designs.
• On-chip Memory Integration: Approximately 0.44 Mbits of embedded RAM reduces dependence on external memory for buffering and small data stores.
• Compact, Board-Friendly Package: 72-VFQFN exposed pad (72-QFN, 10x10) enables dense PCB layouts and thermal grounding through the exposed pad.
• Low-Voltage Operation: Narrow supply range (0.95 V to 1.05 V) supports designs targeting reduced power consumption and predictable supply requirements.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C to align with mainstream commercial-product thermal profiles.
• Regulatory Readiness: RoHS compliance helps simplify environmental compliance for commercial products.

Why Choose LIFCL-17-8SG72C?

The LIFCL-17-8SG72C CrossLink-NX FPGA delivers a focused combination of logic capacity, embedded RAM and a compact exposed-pad QFN package tailored for commercial embedded designs. Its approximately 17,000 logic elements, 40 I/O and low-voltage supply window make it a pragmatic choice for projects that need on-chip programmability without excessive board area or power overhead.

This device is suited to engineers and procurement teams building commercial-grade embedded systems who require clear, verifiable device characteristics—logic density, memory budget, I/O count, package and operating range—to match design requirements and long-term production planning.

Request a quote or submit a parts availability inquiry to receive pricing and lead-time information for the LIFCL-17-8SG72C.