LIFCL-17-8SG72I

The LIFCL-17-8SG72I is a CrossLink-NX™ field programmable gate array (FPGA) IC designed for compact, industrial-grade embedded logic implementations. It provides a balance of programmable logic capacity, on-chip memory, and I/O capability in a small 72-pin VFQFN package.

With 17,000 logic elements, approximately 0.44 Mbits of embedded RAM, and 40 general-purpose I/Os, this device targets applications that require moderate logic density, flexible interfacing, and reliable operation across an extended industrial temperature range.

Key Features

• Core Logic 17,000 logic elements provide programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.44 Mbits (442,368 bits) of on-chip RAM to support buffering, state machines, and small data stores without external memory.
• I/O Capacity Forty I/O pins enable a variety of peripheral and sensor interfaces while keeping board-level routing compact.
• Power Core supply range of 0.95 V to 1.05 V supports low-voltage system designs and predictable power budgeting.
• Package & Mounting 72-VFQFN exposed pad (supplier device package: 72-QFN, 10×10 mm) in a surface-mount form factor for space-constrained PCBs.
• Industrial Reliability Qualified for industrial use with an operating temperature range from −40°C to 100°C, suitable for harsh-environment deployments.
• Regulatory Status RoHS compliant for lead-free manufacturing and assembly processes.

Typical Applications

• Industrial Control and Automation Use the device’s industrial temperature rating and programmable logic to implement custom control, signal conditioning, and I/O bridging in factory equipment.
• Embedded System Glue Logic Integrate the FPGA for protocol adaptation, parallel/serial signal conversion, and custom timing logic between processors and peripherals using available I/Os.
• Sensor and Interface Processing Leverage on-chip RAM and 17,000 logic elements for preprocessing sensor data, managing interfaces, and implementing finite-state control close to sensors.
• Compact, Low-Voltage Designs Ideal for small form-factor products that require low-voltage core operation and a compact 72-QFN package.

Unique Advantages

• Balanced Logic Density: 17,000 logic elements provide substantial programmable capacity for mid-range embedded designs without excessive board space.
• On-Chip Memory for Reduced BOM: Approximately 0.44 Mbits of embedded RAM reduces reliance on external memory components, simplifying BOM and board layout.
• 40 Flexible I/Os: A practical number of I/Os for interfacing with sensors, peripherals, and control signals while keeping package size small.
• Compact Surface-Mount Package: 72-VFQFN exposed pad in a 10×10 QFN footprint enables high-density PCB designs and efficient thermal coupling.
• Industrial Temperature Range: −40°C to 100°C operating range supports deployment in demanding environments where wider temperature tolerance is required.
• Low-Voltage Core Operation: 0.95–1.05 V supply range helps enable low-power system designs and predictable integration into modern low-voltage power rails.

Why Choose LIFCL-17-8SG72I?

This CrossLink-NX™ FPGA delivers a practical combination of programmable logic, embedded memory, and I/O in a compact, industrial-grade package. It is suited to designers who need mid-level logic capacity with on-chip RAM and a small footprint for space- and power-constrained embedded systems.

Choose the LIFCL-17-8SG72I when you need a reliable, RoHS-compliant FPGA option that supports industrial temperature operation, low-voltage core supply, and a flexible I/O count—helping reduce external components and simplify board integration.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the LIFCL-17-8SG72I.