LIFCL-17-9BG256I

The LIFCL-17-9BG256I is a CrossLink-NX™ FPGA IC offering 17,000 logic elements in a compact 256-LFBGA package. Designed for industrial applications, it combines a substantial logic fabric with on-chip memory and a 78-pin I/O count to support a wide range of programmable logic tasks.

Key platform attributes include a low-voltage core supply (0.95–1.05 V), approximately 0.442 Mbits of embedded memory, surface-mount packaging, and an operating temperature range of -40 °C to 100 °C—features that support robust, space-conscious designs in industrial environments.

Key Features

• Logic Capacity  17,000 logic elements provide programmable resources for custom logic, data path implementation, and control functions.
• Embedded Memory  Approximately 0.442 Mbits of on‑chip RAM to support buffering, state storage, and small lookup tables without external memory.
• I/O  78 user I/O pins available for interfacing with sensors, peripherals, and external buses.
• Package & Mounting  256-LFBGA package in a surface-mount form factor (supplier package: 256-CABGA, 14×14 mm) for compact board integration.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match low-voltage system domains and manage core power consumption.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant for environmental and regulatory alignment in modern product designs.

Typical Applications

• Industrial Automation  Implement control logic, protocol handling, and I/O aggregation where industrial temperature range and programmable logic are required.
• Interface Bridging & Protocol Conversion  Use the FPGA’s logic and I/O resources to translate or bridge between different digital interfaces and peripheral buses.
• Embedded Prototyping  Rapidly prototype custom logic functions and system-level features using the device’s on-chip resources and accessible I/O.
• Sensor Aggregation & Preprocessing  Aggregate signals from multiple sensors and perform inline preprocessing or filtering using the FPGA fabric and embedded RAM.

Unique Advantages

• Balanced Logic and Memory: 17,000 logic elements paired with ~0.442 Mbits of embedded RAM enable a mix of control logic and data buffering without immediate external memory.
• Compact, Surface-Mount Package: The 256-LFBGA (14×14 mm supplier package) allows high-density board layouts and simplifies mechanical integration.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployments in harsher environments and extended temperature cycles.
• Generous I/O Count: 78 I/O pins provide flexibility for connecting multiple peripherals, sensors, and external interfaces.
• Low-Voltage Core Operation: Core supply of 0.95–1.05 V aligns with modern low-voltage system domains to help manage power budgets.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious product designs.

Why Choose LIFCL-17-9BG256I?

The LIFCL-17-9BG256I positions itself as a practical, industrial-grade FPGA option for designers needing mid-range programmable logic capacity in a compact package. Its combination of 17,000 logic elements, on-chip RAM, and 78 I/Os makes it well suited for control, interfacing, and preprocessing tasks where board space and operating temperature resilience matter.

For teams developing industrial embedded systems, interface bridges, or prototype platforms, this CrossLink-NX™ device delivers a clear balance of logic resources, I/O flexibility, and packaging that supports scalable designs and reliable operation over extended temperature ranges.

Request a quote or submit your requirements to receive pricing and availability information for the LIFCL-17-9BG256I. Our team can provide component sourcing and order assistance based on your project needs.