LIFCL-17-9SG72I

The LIFCL-17-9SG72I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC providing 17,000 logic elements and approximately 0.42 Mbits of embedded memory (442,368 bits). The device is offered in a compact 72-VFQFN exposed pad package with surface-mount mounting and supports up to 40 general-purpose I/O pins.

With a supply range of 950 mV to 1.05 V and an industrial operating temperature range of -40 °C to 100 °C, this FPGA is specified for designs that require programmable logic, embedded RAM, and a small-footprint package while meeting RoHS compliance.

Key Features

• Core Logic 17,000 logic elements provide the programmable fabric for custom digital functions and control logic.
• Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM to support buffering, state storage, and small data structures.
• I/O Count 40 user I/O pins for interfacing to peripherals, sensors, and other system signals.
• Power Operates from 950 mV to 1.05 V supply, enabling low-voltage system designs.
• Package and Mounting 72-VFQFN exposed pad, supplier package 72-QFN (10×10), surface-mount package suitable for compact board layouts.
• Temperature Range Industrial-grade operation from -40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to meet environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial systems — Programmable logic in equipment where industrial temperature range (-40 °C to 100 °C) and configurable functions are required.
• Embedded control — On-chip logic and embedded RAM for control tasks and peripheral management within compact designs.
• Custom I/O bridging — 40 I/O pins and programmable fabric allow implementation of bespoke interface logic and protocol adaptation.

Unique Advantages

• High-density programmable fabric: 17,000 logic elements enable consolidation of multiple discrete functions into a single device.
• On-chip embedded memory: Approximately 0.42 Mbits of RAM reduces external memory requirements for small buffers and state storage.
• Low-voltage operation: 950 mV to 1.05 V supply range supports low-power system architectures.
• Compact, serviceable package: 72-VFQFN exposed pad in a 72-QFN (10×10) footprint minimizes board area while providing thermal pad support.
• Industrial temperature capability: Rated from -40 °C to 100 °C for use in environments with wide temperature variation.
• RoHS compliant: Meets lead-free environmental requirements for modern assemblies.

Why Choose LIFCL-17-9SG72I?

The LIFCL-17-9SG72I positions itself as a compact, industrial-grade FPGA option that combines moderate logic density and embedded memory with a small QFN footprint. Its combination of 17,000 logic elements, roughly 0.42 Mbits of on-chip RAM, and 40 I/Os makes it suitable for designs that require configurable digital logic and local data storage without a large package.

Designed for engineers seeking a balance of integration, low-voltage operation, and industrial temperature tolerance, this CrossLink-NX™ FPGA supports scalable, reliable designs while maintaining RoHS compliance for modern manufacturing.

Request a quote or submit an inquiry for LIFCL-17-9SG72I to receive pricing and availability details for your project needs.