LIFCL-33-8USG84C

The LIFCL-33-8USG84C is a CrossLink-NX series FPGA device providing a mid-range programmable fabric optimized for interface, control and signal-processing tasks. The device integrates programmable logic, dedicated sysDSP and sysMEM resources, and a flexible I/O architecture as described in the CrossLink-NX series documentation.

This commercial-grade FPGA is suitable for designs that require a compact package, on-chip memory and DSP capabilities, and series-level features such as integrated clocking, USB hardware/firmware, configuration and reliability functionality.

Key Features

• Core & logic: Contains 33,000 logic elements implemented across 4,125 CLBs, providing programmable digital fabric for custom logic and glue logic implementations.
• Embedded memory: 65,536 bits of on-chip RAM with sysMEM features described for single, dual and pseudo-dual port modes and memory cascading to support buffering and local storage.
• Programmable I/O and interfaces: 50 I/O pins with programmable I/O cells and sysI/O buffer configurations; the CrossLink-NX series also documents USB hardware architecture and a USB RISC-V firmware stack for interface applications.
• Clocking and timing: Integrated clocking resources including global PLLs, clock distribution network, clock dividers, dynamic clock select/control and DDRDLL options detailed in the series architecture.
• DSP and processing: sysDSP blocks and architecture features are included in the CrossLink-NX series to accelerate signal-processing and arithmetic functions within the FPGA fabric.
• Configuration and reliability: Series-level device configuration options, IEEE 1149.1-compliant boundary scan testability, Single Event Upset (SEU) handling and Always On (AON) features are included in the product family documentation.
• Power and operating range: Core supply voltage range of 0.95 V to 1.05 V; commercial operating temperature range of 0 °C to 85 °C.
• Package and mounting: 84-UFBGA WLCSP package (supplier package 84-WLCSP, 3.05 × 7.28 mm) with surface-mount mounting; RoHS compliant.

Typical Applications

• USB-enabled peripherals: Use the CrossLink-NX series USB hardware and firmware features to implement USB bridging, protocol handling or peripheral interface functions.
• Real-time signal processing: Leverage sysDSP blocks and 33,000 logic elements for on-device DSP tasks such as filtering, data aggregation and low-latency processing.
• Interface bridging and protocol conversion: 50 programmable I/O pins and flexible sysI/O buffering make the device suitable for bridging between custom or legacy interfaces and modern peripherals.
• Embedded control and sensor interfacing: On-chip RAM, I/O configurability and integrated clocking support local buffering, timing and control functions for embedded systems and sensor front-ends.

Unique Advantages

• Highly integrated series architecture: Combines programmable logic, sysDSP, sysMEM and dedicated clocking features from the CrossLink-NX family to reduce external components and simplify system design.
• Compact WLCSP package: 84-WLCSP (3.05 × 7.28 mm) footprint supports space-constrained applications while maintaining surface-mount assembly.
• Flexible I/O and USB support: Fifty I/O pins with programmable I/O cells and documented USB hardware and firmware enable interfacing to a wide range of peripherals and host systems.
• On-chip memory and DSP acceleration: 65,536 bits of embedded RAM plus sysDSP blocks provide local buffering and compute acceleration for timing-critical workloads.
• Series-level configuration and test features: Includes documented device configuration options, boundary-scan testability and SEU handling to support development and in-field reliability strategies.
• Commercial temperature and RoHS compliance: Designed for commercial deployments with a 0 °C to 85 °C operating range and RoHS-compliant materials.

Why Choose LIFCL-33-8USG84C?

The LIFCL-33-8USG84C brings CrossLink-NX series architecture into a compact WLCSP footprint, delivering 33,000 logic elements, dedicated sysDSP capabilities and on-chip memory for mid-density programmable designs. Its documented clocking, USB, configuration and reliability features make it well suited for interface bridging, real-time processing and embedded control applications where board space and integration matter.

Targeted at commercial designs, this device is appropriate for engineers seeking a balanced combination of logic capacity, embedded memory and peripheral interface features with a small package and surface-mount mounting.

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