LIFCL-33U-8CTG104C
| Part Description |
LATTICE CROSSLINK-NX EMBEDDED VI |
|---|---|
| Quantity | 1,406 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 104-CABGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 104-caBGA | Number of I/O | 72 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LIFCL-33U-8CTG104C – CrossLink‑NX‑33U FPGA, 33,000 logic elements, 104‑CABGA
The LIFCL-33U-8CTG104C is a commercial‑grade FPGA from Lattice Semiconductor Corporation’s CrossLink‑NX‑33/33U family. It integrates 33,000 logic elements with on‑chip memory and programmable I/O to support compact, configurable logic and interface functions.
Designed for systems that need a balance of logic density, embedded RAM, and flexible I/O, this device operates at a core supply range of 0.95 V to 1.05 V, provides 72 I/O pins, and ships in a 104‑CABGA (8×8) surface‑mount package with a commercial operating range of 0 °C to 85 °C.
Key Features
- Core Logic 33,000 logic elements (cells) for implementing custom digital logic and control functions.
- Embedded Memory Approximately 65,536 bits of on‑chip RAM for small buffering, state storage, and local data structures.
- I/O and Programmability 72 user I/O pins with programmable I/O cell architecture and dedicated PIO/PIC blocks described in the CrossLink‑NX datasheet.
- On‑chip System Blocks Device family documentation lists sysDSP, sysMEM, global PLL and extensive clocking structures, USB hardware architecture, a cryptographic engine, and an on‑chip oscillator.
- Power Core voltage supply range of 0.95 V to 1.05 V for main device operation.
- Package & Mounting Surface‑mount 104‑CABGA (8×8) package suitable for compact, high‑density board designs.
- Grade & Temperature Commercial grade with specified operating temperature from 0 °C to 85 °C.
- Compliance RoHS‑compliant.
Typical Applications
- Interface bridging and protocol conversion Programmable I/O and the CrossLink‑NX I/O architecture allow implementation of custom interface logic and protocol adaptation in compact form factors.
- Embedded signal processing On‑chip sysDSP resources (as listed in the datasheet) combined with local RAM enable small DSP kernels and deterministic logic processing.
- USB‑centric designs Datasheet content includes USB hardware architecture and related firmware/host interfaces, suitable where USB integration is required.
Unique Advantages
- Balanced integration: Combines 33,000 logic elements with embedded RAM and dedicated system blocks to reduce external component count.
- Flexible I/O topology: 72 programmable I/Os and dedicated PIO/PIC architecture enable varied signaling and interface options without increasing board complexity.
- Compact packaging: 104‑CABGA (8×8) BGA package provides a small PCB footprint for space‑constrained designs.
- Low core voltage operation: 0.95 V–1.05 V core supply allows alignment with modern low‑voltage power rails.
- System blocks included: On‑chip PLLs, clocking structures, sysMEM, sysDSP, cryptographic engine, and oscillator (as described in the CrossLink‑NX datasheet) support integrated system functions.
- RoHS compliance: Meets environmental restrictions for lead‑free assembly.
Why Choose LIFCL-33U-8CTG104C?
The LIFCL-33U-8CTG104C positions itself as a compact, commercially graded FPGA option within the CrossLink‑NX‑33/33U family from Lattice Semiconductor Corporation. With 33,000 logic elements, on‑chip memory, a broad set of system blocks described in the datasheet (including sysDSP, sysMEM and USB hardware architecture), and 72 programmable I/Os in a 104‑CABGA package, it is well suited for designs that need integrated logic, moderate embedded RAM, and flexible interface capability in a small board footprint.
This device is appropriate for engineering teams and procurement focused on commercial‑temperature applications that require a balance of logic density, embedded system resources, and compact packaging backed by the CrossLink‑NX family documentation and design resources.
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