LIFCL-33U-8CTG104C

LATTICE CROSSLINK-NX EMBEDDED VI
Part Description

LATTICE CROSSLINK-NX EMBEDDED VI

Quantity 1,406 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package104-CABGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case104-caBGANumber of I/O72Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells33000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits65536

Overview of LIFCL-33U-8CTG104C – CrossLink‑NX‑33U FPGA, 33,000 logic elements, 104‑CABGA

The LIFCL-33U-8CTG104C is a commercial‑grade FPGA from Lattice Semiconductor Corporation’s CrossLink‑NX‑33/33U family. It integrates 33,000 logic elements with on‑chip memory and programmable I/O to support compact, configurable logic and interface functions.

Designed for systems that need a balance of logic density, embedded RAM, and flexible I/O, this device operates at a core supply range of 0.95 V to 1.05 V, provides 72 I/O pins, and ships in a 104‑CABGA (8×8) surface‑mount package with a commercial operating range of 0 °C to 85 °C.

Key Features

  • Core Logic  33,000 logic elements (cells) for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 65,536 bits of on‑chip RAM for small buffering, state storage, and local data structures.
  • I/O and Programmability  72 user I/O pins with programmable I/O cell architecture and dedicated PIO/PIC blocks described in the CrossLink‑NX datasheet.
  • On‑chip System Blocks  Device family documentation lists sysDSP, sysMEM, global PLL and extensive clocking structures, USB hardware architecture, a cryptographic engine, and an on‑chip oscillator.
  • Power  Core voltage supply range of 0.95 V to 1.05 V for main device operation.
  • Package & Mounting  Surface‑mount 104‑CABGA (8×8) package suitable for compact, high‑density board designs.
  • Grade & Temperature  Commercial grade with specified operating temperature from 0 °C to 85 °C.
  • Compliance  RoHS‑compliant.

Typical Applications

  • Interface bridging and protocol conversion  Programmable I/O and the CrossLink‑NX I/O architecture allow implementation of custom interface logic and protocol adaptation in compact form factors.
  • Embedded signal processing  On‑chip sysDSP resources (as listed in the datasheet) combined with local RAM enable small DSP kernels and deterministic logic processing.
  • USB‑centric designs  Datasheet content includes USB hardware architecture and related firmware/host interfaces, suitable where USB integration is required.

Unique Advantages

  • Balanced integration: Combines 33,000 logic elements with embedded RAM and dedicated system blocks to reduce external component count.
  • Flexible I/O topology: 72 programmable I/Os and dedicated PIO/PIC architecture enable varied signaling and interface options without increasing board complexity.
  • Compact packaging: 104‑CABGA (8×8) BGA package provides a small PCB footprint for space‑constrained designs.
  • Low core voltage operation: 0.95 V–1.05 V core supply allows alignment with modern low‑voltage power rails.
  • System blocks included: On‑chip PLLs, clocking structures, sysMEM, sysDSP, cryptographic engine, and oscillator (as described in the CrossLink‑NX datasheet) support integrated system functions.
  • RoHS compliance: Meets environmental restrictions for lead‑free assembly.

Why Choose LIFCL-33U-8CTG104C?

The LIFCL-33U-8CTG104C positions itself as a compact, commercially graded FPGA option within the CrossLink‑NX‑33/33U family from Lattice Semiconductor Corporation. With 33,000 logic elements, on‑chip memory, a broad set of system blocks described in the datasheet (including sysDSP, sysMEM and USB hardware architecture), and 72 programmable I/Os in a 104‑CABGA package, it is well suited for designs that need integrated logic, moderate embedded RAM, and flexible interface capability in a small board footprint.

This device is appropriate for engineering teams and procurement focused on commercial‑temperature applications that require a balance of logic density, embedded system resources, and compact packaging backed by the CrossLink‑NX family documentation and design resources.

Request a quote or submit an inquiry to start a procurement request for the LIFCL-33U-8CTG104C and to obtain ordering and availability information.

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