LIFCL-33U-7CTG104I
| Part Description |
LATTICE CROSSLINK-NX EMBEDDED VI |
|---|---|
| Quantity | 1,020 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 104-CABGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 104-caBGA | Number of I/O | 72 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 33000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LIFCL-33U-7CTG104I – CrossLink‑NX‑33U FPGA, 33,000 logic elements, 104‑CABGA
The LIFCL-33U-7CTG104I is an FPGA in the CrossLink‑NX series designed for mid-density programmable logic and system integration. It combines 33,000 logic elements with on-chip memory and DSP-centric architecture blocks described in the CrossLink‑NX preliminary datasheet.
Targeted for applications that require flexible I/O, embedded memory and specialized IP (including USB and cryptographic engine blocks referenced in the datasheet), this device is delivered in a 104‑pin CABGA package with industrial-grade temperature support for robust deployment.
Key Features
- Core Logic Approximately 33,000 logic elements to implement glue logic, protocol bridging, and custom datapaths as required by embedded designs.
- Embedded Memory 65,536 bits of on‑chip RAM (approximately 0.066 Mbits) for local data buffering, FIFOs, and small lookup tables; supports single, dual and pseudo‑dual port modes as described in the series documentation.
- DSP and Processing Blocks Includes the series’ sysDSP architecture and related DSP features for targeted signal processing functions referenced in the datasheet.
- Programmable I/O and I/O Count 72 I/O pins with a programmable I/O cell architecture and sysI/O buffer options documented in the series datasheet for flexible interface support.
- Clocking and Timing On‑chip clocking features in the series include a global PLL, clock distribution network, DDRDLL and clock dividers for precise timing and synchronous interfaces.
- Connectivity and Subsystems Series-level blocks include USB hardware architecture and a cryptographic engine for secure and USB‑enabled designs (as documented in the CrossLink‑NX datasheet).
- Package and Mounting 104‑CABGA (8×8) surface‑mount package suitable for compact board designs.
- Power and Temperature Recommended supply range documented for the device is 0.95 V to 1.05 V; operating temperature range is −40 °C to 100 °C (industrial grade).
- Compliance RoHS‑compliant for environmental compatibility.
Typical Applications
- USB‑enabled modules Leverage the CrossLink‑NX USB hardware architecture for designs requiring direct USB interfacing and embedded USB firmware support.
- Interface bridging and sensor aggregation Implement protocol conversion, I/O aggregation and sensor front‑end glue logic using the device’s programmable I/O and abundant logic resources.
- Embedded signal processing Use the sysDSP blocks and on‑chip RAM for compact DSP tasks, data filtering and real‑time preprocessing.
- Industrial systems Industrial temperature rating and surface‑mount CABGA packaging make the device suitable for factory automation and control electronics operating across extended temperatures.
Unique Advantages
- High logic capacity: 33,000 logic elements provide headroom for implementing complex control and interface logic without external CPLDs or discrete glue chips.
- Integrated memory and DSP: On‑chip RAM and sysDSP architecture reduce the need for external memory and accelerate signal processing tasks.
- Rich I/O flexibility: 72 programmable I/Os and the documented sysI/O/PIC approach enable a wide range of interface standards and banking configurations.
- Robust clocking: On‑chip PLLs, DDRDLL and clock distribution features support precise timing and high‑performance synchronous interfaces.
- Industrial readiness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with environmental and regulatory constraints.
- Compact system footprint: 104‑CABGA (8×8) package allows integration into space‑constrained PCB layouts while keeping I/O accessibility.
Why Choose LIFCL-33U-7CTG104I?
This CrossLink‑NX‑33U device balances substantial logic density with targeted on‑chip memory and DSP resources to simplify mid‑range embedded designs. Its documented architecture includes programmable I/O, advanced clocking, USB support and security-focused blocks, enabling integration of multiple system functions into a single package.
The industrial temperature rating, low‑voltage supply range (0.95 V–1.05 V) and compact 104‑CABGA package make the LIFCL‑33U‑7CTG104I a practical choice for engineers building robust, space‑efficient designs that require flexible interfacing and embedded processing capabilities.
Request a quote or contact sales to discuss availability, pricing and how the LIFCL‑33U‑7CTG104I can fit into your next design.