LIFCL-33U-7CTG104I

LATTICE CROSSLINK-NX EMBEDDED VI
Part Description

LATTICE CROSSLINK-NX EMBEDDED VI

Quantity 1,020 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package104-CABGA (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case104-caBGANumber of I/O72Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells33000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits65536

Overview of LIFCL-33U-7CTG104I – CrossLink‑NX‑33U FPGA, 33,000 logic elements, 104‑CABGA

The LIFCL-33U-7CTG104I is an FPGA in the CrossLink‑NX series designed for mid-density programmable logic and system integration. It combines 33,000 logic elements with on-chip memory and DSP-centric architecture blocks described in the CrossLink‑NX preliminary datasheet.

Targeted for applications that require flexible I/O, embedded memory and specialized IP (including USB and cryptographic engine blocks referenced in the datasheet), this device is delivered in a 104‑pin CABGA package with industrial-grade temperature support for robust deployment.

Key Features

  • Core Logic  Approximately 33,000 logic elements to implement glue logic, protocol bridging, and custom datapaths as required by embedded designs.
  • Embedded Memory  65,536 bits of on‑chip RAM (approximately 0.066 Mbits) for local data buffering, FIFOs, and small lookup tables; supports single, dual and pseudo‑dual port modes as described in the series documentation.
  • DSP and Processing Blocks  Includes the series’ sysDSP architecture and related DSP features for targeted signal processing functions referenced in the datasheet.
  • Programmable I/O and I/O Count  72 I/O pins with a programmable I/O cell architecture and sysI/O buffer options documented in the series datasheet for flexible interface support.
  • Clocking and Timing  On‑chip clocking features in the series include a global PLL, clock distribution network, DDRDLL and clock dividers for precise timing and synchronous interfaces.
  • Connectivity and Subsystems  Series-level blocks include USB hardware architecture and a cryptographic engine for secure and USB‑enabled designs (as documented in the CrossLink‑NX datasheet).
  • Package and Mounting  104‑CABGA (8×8) surface‑mount package suitable for compact board designs.
  • Power and Temperature  Recommended supply range documented for the device is 0.95 V to 1.05 V; operating temperature range is −40 °C to 100 °C (industrial grade).
  • Compliance  RoHS‑compliant for environmental compatibility.

Typical Applications

  • USB‑enabled modules  Leverage the CrossLink‑NX USB hardware architecture for designs requiring direct USB interfacing and embedded USB firmware support.
  • Interface bridging and sensor aggregation  Implement protocol conversion, I/O aggregation and sensor front‑end glue logic using the device’s programmable I/O and abundant logic resources.
  • Embedded signal processing  Use the sysDSP blocks and on‑chip RAM for compact DSP tasks, data filtering and real‑time preprocessing.
  • Industrial systems  Industrial temperature rating and surface‑mount CABGA packaging make the device suitable for factory automation and control electronics operating across extended temperatures.

Unique Advantages

  • High logic capacity: 33,000 logic elements provide headroom for implementing complex control and interface logic without external CPLDs or discrete glue chips.
  • Integrated memory and DSP: On‑chip RAM and sysDSP architecture reduce the need for external memory and accelerate signal processing tasks.
  • Rich I/O flexibility: 72 programmable I/Os and the documented sysI/O/PIC approach enable a wide range of interface standards and banking configurations.
  • Robust clocking: On‑chip PLLs, DDRDLL and clock distribution features support precise timing and high‑performance synchronous interfaces.
  • Industrial readiness: −40 °C to 100 °C operating range and RoHS compliance support deployment in industrial environments with environmental and regulatory constraints.
  • Compact system footprint: 104‑CABGA (8×8) package allows integration into space‑constrained PCB layouts while keeping I/O accessibility.

Why Choose LIFCL-33U-7CTG104I?

This CrossLink‑NX‑33U device balances substantial logic density with targeted on‑chip memory and DSP resources to simplify mid‑range embedded designs. Its documented architecture includes programmable I/O, advanced clocking, USB support and security-focused blocks, enabling integration of multiple system functions into a single package.

The industrial temperature rating, low‑voltage supply range (0.95 V–1.05 V) and compact 104‑CABGA package make the LIFCL‑33U‑7CTG104I a practical choice for engineers building robust, space‑efficient designs that require flexible interfacing and embedded processing capabilities.

Request a quote or contact sales to discuss availability, pricing and how the LIFCL‑33U‑7CTG104I can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up