LIFCL-33U-8CTG104I

The LIFCL-33U-8CTG104I is an industrial-grade FPGA from the CrossLink‑NX‑33/33U family. It combines a mid-range logic fabric with on-chip memory and a broad set of peripheral blocks drawn from the CrossLink‑NX architecture.

Designed for systems that require moderate logic density at low core voltage, the device offers 33,000 logic elements, approximately 65 Kbits of embedded RAM, up to 72 I/O, and a compact 104‑CABGA (8×8) surface-mount package. Operating across an industrial temperature range and RoHS compliant, it targets designs where reliability and integration are primary concerns.

Key Features

• Core Architecture  Part of the CrossLink‑NX series (CrossLink‑NX‑33 and CrossLink‑NX‑33U) with documented architecture elements such as slices, routing, and clocking blocks.
• Logic Capacity  33,000 logic elements suitable for mid-range programmable logic implementations.
• Embedded Memory  Total RAM bits: 65,536 — approximately 65 Kbits of on-chip RAM for buffering, state storage, and small FIFOs.
• I/O and Programmable I/O  Up to 72 I/O pins with programmable I/O cell structures referenced in the CrossLink‑NX documentation.
• On‑chip IP and Peripherals  Device documentation references integrated blocks including sysDSP, USB hardware and firmware stack, cryptographic engine, on‑chip oscillator, and programmable clocking (global PLL, clock dividers, dynamic clock control).
• Power and Voltage  Supported core supply range: 0.950 V to 1.050 V for low-voltage operation.
• Package and Mounting  104‑CABGA (8×8) supplier device package in a surface-mount form factor.
• Industrial Temperature Grade  Operating temperature range from −40 °C to 100 °C for deployment in industrial environments.
• Standards and Compliance  RoHS compliant.

Unique Advantages

• Balanced mid-range logic and memory: The combination of 33k logic elements with ~65 Kbits of on-chip RAM supports compact system functions without external memory for many control and interface tasks.
• Low-voltage core operation: Core supply range of 0.95–1.05 V supports designs targeting reduced power consumption at the FPGA core.
• Industrial temperature capability: −40 °C to 100 °C operation enables reliability across demanding thermal environments.
• Compact BGA package: 104‑CABGA (8×8) provides a high-density surface-mount footprint suitable for space-constrained PCBs.
• Integrated peripheral blocks: Documented CrossLink‑NX features such as sysDSP, USB support, cryptographic engine and flexible clocking simplify system integration by reducing external component count.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose LIFCL-33U-8CTG104I?

This CrossLink‑NX‑33U device is positioned for engineers who need a reliable, industrial-grade FPGA with a mid-range logic count, embedded RAM, and flexible on-chip peripherals. Its low-voltage core operation and programmable I/O capabilities make it suitable for designs that demand integration and compact packaging without sacrificing environmental robustness.

With documented architecture elements (clocking, sysDSP, programmable I/O, USB, cryptographic engine and more) and a 104‑CABGA surface-mount package, the LIFCL-33U-8CTG104I offers a practical balance of logic density, peripheral integration, and industrial temperature tolerance for a variety of embedded and control applications.

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