LIFCL-33U-8USG84I

LATTICE CROSSLINK-NX EMBEDDED VI
Part Description

LATTICE CROSSLINK-NX EMBEDDED VI

Quantity 786 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package84-WLCSP (3.05x7.28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case84-UFBGA, WLCSPNumber of I/O56Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells33000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits65536

Overview of LIFCL-33U-8USG84I – CrossLink-NX-33U FPGA

The LIFCL-33U-8USG84I is a CrossLink-NX-series FPGA from Lattice Semiconductor that provides programmable logic, embedded memory, and flexible I/O in a compact WLCSP package. It is delivered in an 84-WLCSP footprint and targets designs that require a moderate logic count combined with on-chip memory and peripheral blocks documented in the device datasheet.

This device offers 33,000 logic elements, approximately 65 Kbits of embedded RAM, and 56 user I/O pins, with a core voltage range of 0.95 V to 1.05 V and an industrial operating range from −40 °C to 100 °C. The datasheet also documents on-chip features such as programmable I/O, sysDSP, global PLLs, USB hardware architecture, and a cryptographic engine.

Key Features

  • Logic Capacity — 33,000 logic elements suitable for mid-range programmable logic tasks and custom digital functions.
  • Embedded Memory — 65,536 total RAM bits (approximately 65 Kbits) for local buffering, FIFOs, and small data stores.
  • I/O and Packaging — 56 I/O pins in a compact 84-WLCSP (3.05 × 7.28 mm) package; surface-mount mounting type supports space-constrained board designs.
  • Power — Core voltage supply specified from 0.95 V to 1.05 V for low-voltage system integration.
  • Industrial Temperature Range — Specified operating temperature from −40 °C to 100 °C for deployment in demanding environments.
  • On-chip System Blocks (per datasheet) — Device documentation includes global PLLs, clock distribution, sysDSP, sysMEM, programmable I/O cells, on-chip oscillator, USB hardware architecture, and a cryptographic engine.
  • Standards & Compliance — RoHS compliant.

Typical Applications

  • USB-enabled interface bridges — Use the documented USB hardware architecture and programmable I/O to implement USB interface and bridge functions within a compact package.
  • Signal processing and DSP — On-chip sysDSP blocks and embedded RAM make the device suited for moderate DSP tasks and data path implementations.
  • Embedded control and industrial I/O — Industrial temperature rating and multiple I/O simplify consolidation of control and I/O functions in industrial equipment.
  • Space-constrained systems — The 84-WLCSP footprint (3.05 × 7.28 mm) enables compact board layouts where PCB area is limited.

Unique Advantages

  • Compact WLCSP footprint: Small 84-WLCSP package reduces PCB area and supports dense board integration.
  • Balanced logic and memory: 33,000 logic elements combined with approximately 65 Kbits of on-chip RAM for flexible partitioning of logic and local data storage.
  • Flexible I/O count: 56 I/O pins provide a balance of external connectivity for peripherals and sensors without large packages.
  • Low-voltage core operation: 0.95–1.05 V supply range aligns with modern low-voltage system designs.
  • Industrial-grade operation: −40 °C to 100 °C operating range supports deployment in harsher environments.
  • Integrated system blocks (from datasheet): On-chip PLLs, sysDSP, USB architecture, and cryptographic engine reduce the need for some external components and simplify system architecture.
  • RoHS compliant: Meets lead-free and hazardous substance directives for regulatory compliance in many markets.

Why Choose LIFCL-33U-8USG84I?

The LIFCL-33U-8USG84I positions itself as a compact, industrial-temperature FPGA option that combines a mid-range logic capacity with embedded memory and documented on-chip system blocks. Its small 84-WLCSP package and 56 I/Os make it suitable for designs where board space and thermal considerations are important, while the core voltage and temperature specifications align with modern embedded system requirements.

This device is appropriate for engineering teams that need programmable logic plus integrated DSP, USB, and security-related blocks as described in the datasheet, and who require the footprint and environmental range this package provides. Use it where a balanced mix of logic, memory, I/O, and on-chip peripherals streamline BOM and system design.

If you would like pricing, availability, or a quote for LIFCL-33U-8USG84I, please request a quote or contact sales to discuss your requirements and volume needs.

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