LIFCL-17-9MG121I

The LIFCL-17-9MG121I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC optimized for industrial embedded applications. It integrates 17,000 logic elements and approximately 0.442 Mbits of embedded memory with 72 general I/O in a compact 121‑VFBGA (CSPBGA) package.

Designed for systems that require programmable logic with a small footprint and industrial temperature capability, this device supports low-voltage core operation and a broad operating temperature range for reliable deployment in controlled industrial environments.

Key Features

• Core Capacity — 17,000 logic elements providing programmable fabric suitable for mid-range logic integration and custom digital functions.
• Logic Blocks — 4,250 CLBs to structure combinational and sequential logic resources across the device.
• Embedded Memory — Approximately 0.442 Mbits of on-chip RAM for lookup tables, buffering, and small data storage.
• I/O — 72 I/O pins enabling multiple external interfaces and board-level connectivity options.
• Power — Core voltage supply range of 0.950 V to 1.05 V to match modern low-voltage system domains.
• Package — 121‑VFBGA (CSPBGA) supplier package 121‑CSFBGA (6×6) for space-constrained board designs.
• Temperature Rating — Industrial operating temperature range from −40 °C to 100 °C for reliable performance in many industrial environments.
• Mounting — Surface-mount device suitable for standard PCB assembly flows.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Programmable logic for custom control loops, state machines, and I/O aggregation in industrial equipment operating across a wide temperature range.
• Interface Consolidation — Implement glue logic and custom protocol bridging where a compact FPGA with 72 I/O is required.
• Embedded System Prototyping and Low‑Volume Production — Mid‑range logic density and on-chip RAM make this device appropriate for iterative design and small-run deployments in industrial contexts.

Unique Advantages

• Highly adaptable logic capacity: 17,000 logic elements let designers implement substantial custom logic without moving to larger FPGA families, reducing BOM complexity.
• Compact package footprint: The 121‑VFBGA (6×6) CSPBGA package enables dense board layouts and helps save board space in constrained designs.
• Industrial temperature tolerance: Rated from −40 °C to 100 °C to support deployments where wider thermal margins are required.
• Low-voltage core operation: 0.950 V to 1.05 V supply supports integration into modern low-power system domains.
• On‑chip memory for local buffering: Approximately 0.442 Mbits of embedded RAM reduces reliance on external memory for small data storage and control functions.
• RoHS compliant: Conforms to lead-free, environmentally compliant manufacturing requirements.

Why Choose LIFCL-17-9MG121I?

The LIFCL-17-9MG121I positions itself as a mid‑density CrossLink‑NX FPGA that balances programmable logic capacity, embedded memory, and a compact BGA package for industrial applications. Its combination of 17,000 logic elements, 72 I/O, and industrial temperature rating makes it suitable for designers who need configurable hardware in space-constrained, temperature-demanding environments.

For engineers and procurement teams building industrial embedded systems, this device provides a scalable and reliable programmable solution that simplifies board-level integration while supporting low-voltage system architectures.

Request a quote or submit an inquiry to learn about availability, pricing, and lead times for the LIFCL-17-9MG121I.