LIFCL-17-9BG256C

IC FPGA 78 I/O 256CABGA
Part Description

CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 78 442368 17000 256-LFBGA

Quantity 1,688 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O78Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4250Number of Logic Elements/Cells17000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits442368

Overview of LIFCL-17-9BG256C – CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 78 442368 17000 256-LFBGA

The LIFCL-17-9BG256C CrossLink-NX™ is a Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 17,000 logic elements, approximately 0.44 Mbits of on-chip RAM (442,368 bits), and 78 I/O in a compact 256-LFBGA surface-mount package.

Specified for commercial-grade use, the device operates from a 0.95 V to 1.05 V core supply and across an operating temperature range of 0 °C to 85 °C, and is RoHS-compliant.

Key Features

  • Logic Capacity 17,000 logic elements for implementing programmable logic and custom digital functions.
  • Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 bits) to support buffering, state storage, and small data tables.
  • I/O Resources 78 I/O pins to interface with peripherals and external components.
  • Package and Mounting 256-LFBGA (256-CABGA 14×14) surface-mount package for a compact board footprint.
  • Power Core supply voltage range of 0.95 V to 1.05 V for low-voltage operation.
  • Temperature Range Commercial operating temperature from 0 °C to 85 °C.
  • Environmental Compliance RoHS-compliant construction.

Unique Advantages

  • Compact, high-density package: 256-LFBGA (14×14) provides significant integration in a small surface-mount footprint.
  • Balanced logic and memory: 17,000 logic elements combined with approximately 0.44 Mbits of embedded RAM supports a range of mid-density designs.
  • Robust I/O count: 78 I/O pins enable direct interfacing to multiple external devices and peripherals.
  • Low-voltage operation: 0.95 V to 1.05 V core supply aligns with low-voltage design domains.
  • Commercial-grade specification: Operates across 0 °C to 85 °C for standard commercial applications.
  • RoHS-compliant: Built to meet environmental compliance requirements for manufacturing and deployment.

Why Choose LIFCL-17-9BG256C?

The LIFCL-17-9BG256C CrossLink-NX FPGA delivers a practical combination of logic density, embedded memory, and I/O in a compact 256-LFBGA surface-mount package. Its low-voltage core supply and commercial temperature rating make it suitable for a wide range of standard commercial designs that require approximately 17,000 logic elements and moderate on-chip RAM.

This device is well suited for teams and projects that prioritize a balanced mid-range FPGA solution with RoHS compliance and a compact board footprint.

Request a quote or submit a pricing request for LIFCL-17-9BG256C to check availability and lead times.

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