LIFCL-17-8UWG72C

The LIFCL-17-8UWG72C CrossLink-NX™ is a field programmable gate array (FPGA) optimized for compact, commercial-grade designs. It integrates 17,000 logic elements with embedded memory and a 40-pin I/O footprint to support custom digital logic, protocol bridging, and interface glue logic.

With a low-voltage core (950 mV to 1.05 V) and a small 72-WLCSP package (3.7 × 4.1 mm), this device targets space-constrained applications that require moderate logic density and efficient on-chip memory integration.

Key Features

• Core Logic 17,000 logic elements provide the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM to support buffering, small lookup tables, and local state storage.
• I/O Capacity 40 I/O pins suitable for interfacing with peripherals, sensors, and host processors in compact systems.
• Power Operates from a core supply of 950 mV to 1.05 V to match low-voltage power domains and enable power-conscious designs.
• Package and Mounting Available in a compact 72-WLCSP (3.7 × 4.1 mm) supplier device package and listed as 72-BGA, WLCSP; surface mountable for automated assembly.
• Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for typical commercial environments.
• RoHS Compliance RoHS-compliant device suitable for modern manufacturing and environmental requirements.

Typical Applications

• Compact Embedded Systems — Leverage the 72-WLCSP package and 40 I/O to implement custom control and interface logic in size-constrained products.
• Interface Bridging — Use the programmable logic and embedded RAM to create protocol translators and glue logic between disparate peripherals.
• Consumer Electronics — Integrate moderate-density programmable logic and local RAM for feature-rich consumer devices within commercial temperature ranges.

Unique Advantages

• Right-sized Logic Density: 17,000 logic elements deliver sufficient programmable resources for moderate-complexity designs without excessive die area.
• On-chip Memory: Approximately 0.44 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage.
• Compact Packaging: 72-WLCSP (3.7 × 4.1 mm) allows integration into space-limited PCBs and modern compact product layouts.
• Low-Voltage Core: 950 mV to 1.05 V operation aligns with low-voltage power domains for energy-efficient system design.
• Surface-Mount Ready: Surface mount package supports automated assembly and standard manufacturing workflows.
• RoHS Compliant: Meets common environmental manufacturing requirements for commercial products.

Why Choose LIFCL-17-8UWG72C?

The LIFCL-17-8UWG72C CrossLink-NX™ FPGA balances programmable capacity and compact form factor for commercial designs that need moderate logic resources, integrated on-chip memory, and a small footprint. Its combination of 17,000 logic elements, approximately 0.44 Mbits of embedded RAM, 40 I/O pins, and a 72-WLCSP package makes it suitable for developers targeting compact embedded systems, interface bridging, and consumer electronics within a 0 °C to 85 °C operating range.

Designed for engineers and procurement teams seeking an integrated, low-voltage FPGA solution, this device provides predictable hardware resources and RoHS compliance to streamline development and manufacturing of commercial-grade products.

Request a quote or submit an inquiry to get pricing and availability for the LIFCL-17-8UWG72C CrossLink-NX™ FPGA.