LIFCL-17-8UWG72I

The LIFCL-17-8UWG72I is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation offering 17,000 logic elements and approximately 0.44 Mbits of embedded memory (442,368 bits). This compact, industrial-grade FPGA provides 40 I/Os in a 72-WLCSP package (3.7 × 4.1 mm), targeting space-constrained embedded applications that require programmable logic, on-chip memory, and flexible I/O.

With a core supply range of 0.95–1.05 V and an operating temperature range of −40 °C to 100 °C, the device is specified for industrial environments and surface-mount assembly.

Key Features

• Core Logic 17,000 logic elements for implementing custom digital logic, control functions, and glue-logic in compact systems.
• Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 bits) to support buffering, small data stores, and local packet processing.
• I/O Count 40 general-purpose I/Os providing flexible interfacing options for sensors, peripherals, and external devices.
• Power Narrow core voltage window of 0.95–1.05 V for predictable power and supply design.
• Package and Mounting 72-WLCSP (3.7 × 4.1 mm) package in a surface-mount form factor, enabling compact PCB layouts and dense system integration.
• Temperature and Grade Industrial-grade device rated for −40 °C to 100 °C operation, suitable for robust embedded installations.
• Regulatory RoHS compliant.

Typical Applications

• Industrial control and automation — Industrial temperature rating (−40 °C to 100 °C) and compact package allow deployment in space-constrained control modules and embedded controllers.
• Embedded logic and signal conditioning — 17,000 logic elements and on-chip RAM support custom data handling, sequencing, and local preprocessing tasks.
• I/O bridging and protocol adaptation — 40 general-purpose I/Os enable mapping, buffering, and protocol conversion between sensors, actuators, and host processors.
• Compact, low-footprint systems — 72-WLCSP package (3.7 × 4.1 mm) and surface-mount mounting suit small form-factor PCBs and high-density assemblies.

Unique Advantages

• Right-sized logic capacity — 17,000 logic elements provide a balance of density and predictability for mid-range programmable logic tasks without oversizing the bill of materials.
• On-chip memory for local buffering — Approximately 0.44 Mbits of embedded RAM reduces external memory dependencies for small data stores and temporary buffering.
• Compact WLCSP footprint — 72-WLCSP (3.7 × 4.1 mm) minimizes board area usage and supports compact system designs.
• Industrial temperature support — Specified −40 °C to 100 °C operation for reliable use in industrial environments.
• Predictable power design — Narrow supply range (0.95–1.05 V) simplifies core supply selection and power budgeting.
• RoHS compliant — Meets common regulatory requirements for lead-free assembly.

Why Choose LIFCL-17-8UWG72I?

The LIFCL-17-8UWG72I CrossLink-NX FPGA delivers a compact, industrial-grade programmable-logic option with 17,000 logic elements, meaningful on-chip RAM, and 40 I/Os in a 72-WLCSP package. Its combination of density, embedded memory, and small footprint makes it a practical choice for embedded designs that need programmable flexibility without a large package or external memory requirements.

This device is suited to engineering teams developing mid-range programmable logic solutions for industrial and space-constrained systems, offering predictable power characteristics and a temperature range aligned with industrial deployment needs.

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