LIFCL-17-9SG72C

The LIFCL-17-9SG72C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides 17,000 logic elements and approximately 0.44 Mbits of embedded RAM in a compact 72‑VFQFN (10 × 10 mm QFN) exposed-pad package.

Designed for commercial-grade embedded designs, this surface-mount FPGA operates from a low core supply range of 0.95 V to 1.05 V and supports up to 40 I/O pins, offering a balanced combination of logic density, on-chip memory and small-footprint packaging for space-constrained applications.

Key Features

• Core Logic Contains 17,000 logic elements suitable for mid-range FPGA designs and programmable logic integration.
• Embedded Memory Total on-chip RAM of 442,368 bits, equivalent to approximately 0.44 Mbits of embedded memory for buffering, FIFOs and small data storage.
• I/O Up to 40 general-purpose I/O pins to interface with peripherals and external devices.
• Power Low-voltage core operation with a supply range of 0.95 V to 1.05 V for power-sensitive designs.
• Package & Mounting 72‑VFQFN exposed pad (72‑QFN, 10 × 10 mm) surface-mount package for compact PCB footprints and thermal conduction through the exposed pad.
• Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance RoHS compliant, supporting lead-free assembly and regulatory requirements.

Unique Advantages

• Balanced Logic Density: 17,000 logic elements provide a mid-range capacity for integrating control, glue logic and protocol bridging without excess footprint.
• On-Chip Memory for Data Handling: Approximately 0.44 Mbits of embedded RAM enables local buffering and small data-store tasks, reducing external memory needs.
• Compact Thermal-Aware Package: 72‑VFQFN with an exposed pad offers a small board footprint while allowing improved thermal dissipation through the package center.
• Low-Voltage Core: 0.95 V to 1.05 V supply range supports designs targeting reduced core power consumption.
• RoHS Compliance: Meets environmental lead-free requirements for modern manufacturing flows.
• Surface-Mount Installation: Standard QFN surface-mount form factor for automated assembly and high-density PCB layouts.

Why Choose LIFCL-17-9SG72C?

The LIFCL-17-9SG72C positions itself as a practical mid-range FPGA solution that combines 17,000 logic elements, substantial on-chip RAM and a small 72‑VFQFN exposed-pad package. Its low core voltage and 40 I/O pins make it well suited for compact, commercial-grade designs that require programmable logic with modest memory and I/O needs.

Choose this CrossLink-NX™ FPGA for designs that prioritize a compact footprint, low-voltage operation and RoHS-compliant assembly. The combination of logic capacity, embedded memory and QFN packaging delivers scalability and integration for a variety of embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for the LIFCL-17-9SG72C. Our team will respond with lead times and purchasing options tailored to your project needs.