LIFCL-17-7UWG72C
| Part Description |
CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 40 442368 17000 72-BGA, WLCSP |
|---|---|
| Quantity | 192 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-WLCSP (3.7x4.1) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-BGA, WLCSP | Number of I/O | 40 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 1 (Unlimited) | Number of LABs/CLBs | 4250 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LIFCL-17-7UWG72C – CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 40 442368 17000 72-BGA, WLCSP
The LIFCL-17-7UWG72C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for commercial applications. It provides a balanced combination of programmable logic, embedded memory, and I/O in a compact 72-WLCSP (3.7×4.1 mm) package.
With 17,000 logic elements, approximately 0.42 Mbits of on-chip RAM, and 40 I/O pins, this device targets designs that require moderate logic density and embedded memory within a small footprint. It is RoHS compliant and specified for commercial-grade operation.
Key Features
- Core Logic Contains 17,000 logic elements suitable for programmable logic implementation and custom digital functions.
- Embedded Memory Approximately 0.42 Mbits (442,368 bits) of on-chip RAM for buffering, state retention, and local data storage.
- I/O Count Provides 40 I/O pins to interface with external peripherals and system signals.
- Power Core supply range of 0.95 V to 1.05 V for the device logic domain.
- Package & Mounting Available in a compact 72-WLCSP (3.7×4.1 mm) package; surface-mount mounting type for board-level integration.
- Temperature & Grade Commercial-grade device specified for operation from 0 °C to 85 °C.
- Compliance RoHS compliant, meeting standard environmental requirements for commercial electronics.
Unique Advantages
- Moderate logic density: 17,000 logic elements provide a balance of capacity for customized logic without the overhead of larger devices.
- On-chip RAM: Approximately 0.42 Mbits of embedded memory reduces the need for external memory in many control and buffering tasks.
- Compact footprint: 72-WLCSP (3.7×4.1 mm) package enables dense board layouts and space-constrained designs.
- Low-voltage core domain: Operates from 0.95 V to 1.05 V, enabling compatibility with low-voltage system power rails.
- Commercial temperature range: Rated 0 °C to 85 °C for standard commercial deployments.
- RoHS compliant: Meets environmental requirements for lead-free manufacturing and disposal.
Why Choose LIFCL-17-7UWG72C?
The LIFCL-17-7UWG72C delivers a practical mix of logic capacity, embedded memory, and I/O in a very small package, making it well suited for commercial designs that require programmable logic in a compact form factor. Its defined supply voltage range and commercial temperature rating provide clear integration parameters for system-level power and thermal planning.
This device is appropriate for customers seeking a mid-density FPGA solution with on-chip RAM and a small 72-WLCSP footprint, offering predictable specification-driven value and RoHS compliance for commercial electronics manufacturing.
Request a quote or submit a product inquiry to receive pricing and availability for the LIFCL-17-7UWG72C.

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