LIFCL-17-7SG72I

The LIFCL-17-7SG72I is a CrossLink-NX™ field programmable gate array (FPGA) IC designed to provide programmable logic and embedded memory in a compact surface-mount package. It combines 17,000 logic elements with approximately 0.44 Mbits of on-chip RAM and 40 general-purpose I/O to address designs that require flexible, reconfigurable digital logic in industrial environments.

With a core supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C, this industrial-grade device is suited to systems that need deterministic logic capacity, compact packaging, and RoHS-compliant components.

Key Features

• Logic Fabric  17,000 logic elements provide programmable resources for custom digital functions and glue logic in compact system designs.
• Embedded Memory  Approximately 0.44 Mbits of on-chip RAM for frame buffers, small FIFOs, and local data storage without external memory.
• I/O Capability  40 I/O pins to support peripheral interfacing, control signals, and mixed-signal front-end connections.
• Power and Supply  Core voltage supply specified from 0.95 V to 1.05 V for integration into low-voltage power architectures.
• Package and Mounting  72-VFQFN exposed pad (supplier package: 72-QFN, 10×10) in a surface-mount form factor for space-constrained PCBs and thermal conduction through exposed pad.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting deployment in elevated-temperature and industrial environments.
• RoHS Compliance  Manufactured to meet RoHS environmental standards.

Typical Applications

• Industrial control and automation  Use the FPGA for custom control logic, I/O aggregation, and protocol bridging in systems requiring an industrial temperature rating.
• Embedded system glue logic  Implement interface translation, signal conditioning, and peripheral management using the device's 17,000 logic elements and 40 I/O lines.
• Sensor and actuator interfacing  Local preprocessing, filtering, and timing functions can be implemented on-chip to reduce external component count and latency.

Unique Advantages

• Right-sized logic capacity: 17,000 logic elements provide substantial programmable resources while keeping board area and BOM impact low.
• On-chip RAM for local buffering: Approximately 0.44 Mbits of embedded memory reduces reliance on external RAM for small data storage needs.
• Compact, thermally-aware packaging: 72‑VFQFN with an exposed pad supports surface-mount assembly and improved thermal conduction in space-constrained designs.
• Industrial operating range: −40 °C to 100 °C rating enables deployment in temperature-challenging environments without additional temperature-conditioning hardware.
• Low-voltage core support: 0.95–1.05 V supply compatibility aligns with modern low-voltage system power rails.
• Regulatory readiness: RoHS-compliant manufacturing facilitates integration into environmentally conscious product lines.

Why Choose LIFCL-17-7SG72I?

The LIFCL-17-7SG72I balances programmable logic capacity, embedded memory, and I/O flexibility in a compact, industrial-grade package. Its combination of 17,000 logic elements, approximately 0.44 Mbits of on-chip RAM, and 40 I/O lines makes it suitable for engineers who need reconfigurable logic and local buffering without a large PCB footprint.

This device is well suited to designers working on industrial control, embedded interface logic, and sensor/actuator front ends that require robust temperature performance, low-voltage core compatibility, and RoHS compliance. The 72‑VFQFN exposed-pad package supports surface-mount assembly and thermal management for reliable long-term operation.

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