LIA-MD6000-6MG81E

The LIA-MD6000-6MG81E is a CrossLink™ family FPGA from Lattice Semiconductor, featuring a programmable fabric, embedded memory, and dedicated I/O blocks. Its combination of reconfigurable logic, integrated I/O capabilities and automotive qualification positions it for designs that require flexible interface and control logic in demanding environments.

Architected with configurable sysI/O banks, MIPI D-PHY blocks and an embedded block RAM structure (as described in the CrossLink family data sheet), this device is intended for applications that need compact, reprogrammable logic with defined electrical and environmental specifications.

Key Features

• Programmable FPGA Fabric  Includes the CrossLink programmable fabric and PFU/slice architecture described in the CrossLink family data sheet for building custom logic functions.
• Logic Capacity  Contains 5,936 logic elements suitable for implementing mid-density logic, control and glue-code functions.
• Embedded Memory  Approximately 0.18 Mbits (184,320 bits) of on-chip RAM for buffering, state storage and small data structures.
• Flexible I/O  37 I/Os with programmable sysI/O buffers and programmable I/O banks; the CrossLink family documentation details sysI/O pull modes, drive strength and on-chip termination options.
• Dedicated Interface Blocks  CrossLink family devices include MIPI D-PHY blocks and programmable I/O banking documented in the datasheet for high-speed serial interface support.
• Power and Clocking  The device incorporates a power management unit and a comprehensive clocking structure (sysCLK PLL, primary and edge clocks, internal oscillators) as described in the CrossLink data sheet.
• Voltage Supply  Rated for operation with a 1.14 V to 1.26 V supply range.
• Automotive Grade & Qualification  Automotive grade with AEC-Q100 qualification and a wide operating temperature range of -40°C to 125°C.
• Package & Mounting  Supplied in an 81-VFBGA package (supplier device package: 81-CSFBGA, 4.5 × 4.5 mm) for surface-mount assembly.
• Compliance  RoHS compliant.

Typical Applications

• Automotive Systems  Suitable for automotive electronics that require AEC-Q100 qualification and operation across -40°C to 125°C for control, interface and logic tasks.
• Imaging & Camera Interfaces  Devices in the CrossLink family include MIPI D-PHY blocks and programmable I/O banks, enabling use in camera interface and image-processing front-end designs.
• Embedded Control & Edge Logic  With 5,936 logic elements and embedded RAM, the FPGA can implement custom control, protocol bridging and edge processing functions.
• Sensor and Peripheral Aggregation  The programmable sysI/O and 37 available I/Os support flexible sensor interfacing and signal conditioning in compact designs.

Unique Advantages

• Automotive-ready qualification: AEC-Q100 qualification and a -40°C to 125°C operating range support deployment in automotive-grade designs.
• Integrated high-speed interfaces: CrossLink family MIPI D-PHY blocks and programmable sysI/O banks reduce the need for external interface ICs.
• Compact, surface-mount package: The 81-CSFBGA (4.5 × 4.5 mm) footprint helps minimize PCB area while keeping assembly straightforward.
• Balanced on-chip resources: 5,936 logic elements combined with approximately 0.18 Mbits of embedded memory provide a practical balance of logic and RAM for mid-range designs.
• Defined power window: A narrow voltage supply range (1.14–1.26 V) enables tight power-supply planning and predictable electrical behavior.
• Standards-focused documentation: The CrossLink family data sheet includes detailed architecture, clocking, PMU and I/O buffer information to support engineering evaluation and integration.

Why Choose LIA-MD6000-6MG81E?

The LIA-MD6000-6MG81E delivers a focused combination of reconfigurable logic, embedded memory and dedicated I/O features within the CrossLink family architecture. Its automotive qualification, well-defined supply and temperature range, and documented I/O and clocking subsystems make it a pragmatic choice for engineers building compact, reprogrammable interface or control modules.

This device is suited to designs that require mid-density logic capacity, flexible I/O and on-chip memory in a small surface-mount package, backed by the CrossLink family technical documentation for integration and system-level planning.

Request a quote or contact sales to discuss pricing, availability and how the LIA-MD6000-6MG81E can fit your next design.