LIA-MD6000-6KMG80E

The LIA-MD6000-6KMG80E is a CrossLink™ family field programmable gate array (FPGA) supplied by Lattice Semiconductor Corporation. It integrates programmable FPGA fabric, embedded memory, and system I/O features described for the CrossLink family.

Designed for applications requiring on-chip logic, embedded RAM and hardened I/O blocks, this device is supplied in an 80-TFBGA package, supports a narrow core supply range, and is qualified to AEC-Q100 for automotive use.

Key Features

• Programmable Logic — 5,936 logic elements (logic cells) and 1,484 CLBs provide the on-chip programmable fabric for custom logic implementation.
• Embedded Memory — Approximately 0.18 Mbits of embedded memory (184,320 total RAM bits) for buffering, small FIFOs and local storage.
• I/O Count & Capabilities — 37 general-purpose I/Os and documented support in the CrossLink family for hardened MIPI D‑PHY I/Os and programmable sysI/O buffers as described in the family datasheet.
• Package & Mounting — 80-TFBGA package (supplier device package: 80-CKFBGA, 7×7) in a surface-mount form factor suitable for compact PCB layouts.
• Power — Core supply operating range of 1.14 V to 1.26 V to match system power designs requiring low-voltage FPGA cores.
• Temperature Range — Rated for operation from −40°C to 125°C to support extended-temperature environments.
• Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation as listed in the product data.
• Standards & Compliance — RoHS compliant.
• Family-level Architecture — CrossLink family features referenced in the datasheet include programmable I/O banks, sysI/O buffer options, PLL-based clocking, embedded block RAM, power management unit (PMU), and configuration/programming support.

Typical Applications

• Automotive Systems — Engineered and AEC‑Q100 qualified for use in automotive electronics where on-chip logic and embedded memory are required across −40°C to 125°C operating conditions.
• Camera and Sensor Interfaces — CrossLink family documentation includes hardened MIPI D‑PHY I/O and programmable sysI/O features useful for camera and sensor interface designs.
• Embedded Logic and Glue-logic — Compact FPGA fabric and on-chip RAM suitable for protocol bridging, preprocessing, and custom control logic in space-constrained designs.

Unique Advantages

• Automotive-grade qualification: AEC‑Q100 qualification supports deployment in automotive applications that require qualified components.
• Compact package with adequate I/O: The 80-TFBGA 7×7 package balances PCB footprint and 37 I/O pins for space-constrained board designs.
• Integrated memory and logic: Nearly 184,320 bits of embedded RAM combined with 5,936 logic elements reduces dependence on external memory for small buffering and control tasks.
• Low-voltage core: Narrow core supply range (1.14 V to 1.26 V) aligns with low-voltage system power rails.
• Family-level feature set: CrossLink family architecture includes programmable I/O banks, PLL clocking, and power management structures described in the datasheet to support varied system functions.
• Extended operating range: −40°C to 125°C rating enables operation across broad temperature environments.

Why Choose LIA-MD6000-6KMG80E?

The LIA-MD6000-6KMG80E provides a balanced combination of programmable logic, embedded memory, and system I/O in a compact 80‑TFBGA package. With AEC‑Q100 qualification and an extended operating temperature range, it is positioned for automotive and other temperature-demanding applications that need on‑chip logic and memory without a large board footprint.

Engineers designing sensor interfaces, camera front-ends or embedded logic subsystems can leverage the CrossLink family’s documented I/O and clocking features along with this device’s logic and memory resources to simplify system design and reduce external component count.

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