LFXP6E-5QN208C

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 1,030 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O142Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-5QN208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6E-5QN208C is a non-volatile, reconfigurable FPGA from Lattice Semiconductor’s LatticeXP family. The device integrates approximately 6,000 logic elements with about 73,728 bits of on-chip RAM, offering instant-on capability without the need for external configuration memory.

Targeted for commercial applications, this surface-mount FPGA provides up to 142 user I/Os in a 208-BFQFP (28 × 28 mm) package, a core supply range of 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

  • Non-volatile configuration  Instant-on operation with no external configuration memory required; design security is enhanced by removing the need to transmit a separate bitstream.
  • Logic capacity  Approximately 6,000 logic elements suitable for mid-density logic implementations and design migration within the LatticeXP family.
  • Embedded memory  On-chip RAM totaling 73,728 bits, available as distributed and block memory resources for local data buffering and state storage.
  • Flexible I/O support  Up to 142 I/Os in the 208-BFQFP package; family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and differential standards such as LVDS and LVPECL.
  • Reconfiguration and in-field updates  Supports in-field logic updates (TransFR™) and rapid SRAM reconfiguration; FPGA fabric can be reprogrammed through system configuration ports and JTAG.
  • Power and low-power modes  Includes sleep mode capability for significant static current reduction, helping reduce system power when full operation is not required.
  • Clock management  Up to four analog PLLs per device for clock multiply/divide and phase shifting functions (family-level capability).
  • Package and mounting  208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) surface-mount package supporting high I/O count in a compact footprint.
  • Commercial grade and compliance  Rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and environmental considerations.

Typical Applications

  • Embedded control and protocol bridging  Flexible I/O and on-chip logic make the device suitable for glue logic, protocol translation and embedded control tasks.
  • Memory interface and buffering  On-chip block and distributed RAM plus family DDR support enable use in memory interface, buffering and data-path applications.
  • In-field upgradeable systems  TransFR reconfiguration and JTAG-based programming allow firmware-like updates to FPGA logic while deployed in the field.
  • Prototyping and production designs  Instant-on, non-volatile configuration and a high I/O count simplify transitions from prototype to production in commercial designs.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates external configuration memory and reduces system boot complexity.
  • In-field reconfigurability: Supports runtime logic updates and rapid SRAM reconfiguration for evolving feature sets.
  • Flexible interface support: Broad family-level I/O standards enable integration with a wide range of peripherals and signaling types.
  • Integrated clock resources: Up to four PLLs provide clocking flexibility for multi-domain designs.
  • Compact, high-I/O package: 142 I/Os in a 208-BFQFP surface-mount package balance pin count and board-level density.
  • Commercial-grade qualification and RoHS compliance: Designed for standard commercial environments with environmental compliance.

Why Choose LFXP6E-5QN208C?

The LFXP6E-5QN208C offers a balanced combination of mid-range logic capacity, embedded memory, and flexible I/O in a compact 208-BFQFP surface-mount package. Its non-volatile architecture and instant-on behavior remove the need for external configuration storage while enabling secure and rapid system startup.

This part is well suited to commercial embedded designs that require in-field reconfigurability, diverse interface support, and integrated clocking resources. Its feature set supports scalable designs and provides a straightforward migration path within the LatticeXP family.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the LFXP6E-5QN208C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up