LFXP6E-5QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,030 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-5QN208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6E-5QN208C is a non-volatile, reconfigurable FPGA from Lattice Semiconductor’s LatticeXP family. The device integrates approximately 6,000 logic elements with about 73,728 bits of on-chip RAM, offering instant-on capability without the need for external configuration memory.
Targeted for commercial applications, this surface-mount FPGA provides up to 142 user I/Os in a 208-BFQFP (28 × 28 mm) package, a core supply range of 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.
Key Features
- Non-volatile configuration Instant-on operation with no external configuration memory required; design security is enhanced by removing the need to transmit a separate bitstream.
- Logic capacity Approximately 6,000 logic elements suitable for mid-density logic implementations and design migration within the LatticeXP family.
- Embedded memory On-chip RAM totaling 73,728 bits, available as distributed and block memory resources for local data buffering and state storage.
- Flexible I/O support Up to 142 I/Os in the 208-BFQFP package; family-level I/O buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and differential standards such as LVDS and LVPECL.
- Reconfiguration and in-field updates Supports in-field logic updates (TransFR™) and rapid SRAM reconfiguration; FPGA fabric can be reprogrammed through system configuration ports and JTAG.
- Power and low-power modes Includes sleep mode capability for significant static current reduction, helping reduce system power when full operation is not required.
- Clock management Up to four analog PLLs per device for clock multiply/divide and phase shifting functions (family-level capability).
- Package and mounting 208-BFQFP (supplier package: 208-PQFP, 28 × 28 mm) surface-mount package supporting high I/O count in a compact footprint.
- Commercial grade and compliance Rated for 0 °C to 85 °C operation and RoHS compliant for regulatory and environmental considerations.
Typical Applications
- Embedded control and protocol bridging Flexible I/O and on-chip logic make the device suitable for glue logic, protocol translation and embedded control tasks.
- Memory interface and buffering On-chip block and distributed RAM plus family DDR support enable use in memory interface, buffering and data-path applications.
- In-field upgradeable systems TransFR reconfiguration and JTAG-based programming allow firmware-like updates to FPGA logic while deployed in the field.
- Prototyping and production designs Instant-on, non-volatile configuration and a high I/O count simplify transitions from prototype to production in commercial designs.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates external configuration memory and reduces system boot complexity.
- In-field reconfigurability: Supports runtime logic updates and rapid SRAM reconfiguration for evolving feature sets.
- Flexible interface support: Broad family-level I/O standards enable integration with a wide range of peripherals and signaling types.
- Integrated clock resources: Up to four PLLs provide clocking flexibility for multi-domain designs.
- Compact, high-I/O package: 142 I/Os in a 208-BFQFP surface-mount package balance pin count and board-level density.
- Commercial-grade qualification and RoHS compliance: Designed for standard commercial environments with environmental compliance.
Why Choose LFXP6E-5QN208C?
The LFXP6E-5QN208C offers a balanced combination of mid-range logic capacity, embedded memory, and flexible I/O in a compact 208-BFQFP surface-mount package. Its non-volatile architecture and instant-on behavior remove the need for external configuration storage while enabling secure and rapid system startup.
This part is well suited to commercial embedded designs that require in-field reconfigurability, diverse interface support, and integrated clocking resources. Its feature set supports scalable designs and provides a straightforward migration path within the LatticeXP family.
Request a quote or submit a procurement inquiry to receive pricing, availability, and lead-time information for the LFXP6E-5QN208C.

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