LFXP6E-5FN256C

The LFXP6E-5FN256C is a member of the LatticeXP FPGA family, delivering a non-volatile, reconfigurable logic solution with 6,000 logic elements and 720 CLBs. Designed for commercial applications, the device integrates approximately 72 Kbits (73,728 bits) of embedded SRAM, up to 188 I/Os in a compact 256‑ball FPBGA (17 × 17 mm) package, and supports on-device reconfiguration and security features that reduce external component count and configuration complexity.

This FPGA is suited for system designers who need instant-on behavior, flexible I/O standards, and embedded memory for mid-density logic and memory tasks in consumer and industrial-adjacent commercial products.

Key Features

• Core Logic – 6,000 logic elements across 720 CLBs for mid-density logic integration and custom digital functions.
• Embedded Memory – Approximately 72 Kbits (73,728 bits) of on-chip SRAM (EBR) and additional distributed RAM resources for buffering, state storage, and small memory structures.
• I/O and Interface Flexibility – 188 I/Os in the 256-FPBGA (17 × 17 mm) package. The family’s programmable sysIO buffer supports a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS, enabling diverse system-level interfaces.
• Package & Mounting – 256-ball FPBGA footprint (256-FPBGA, 17 × 17 mm), surface-mount mounting for compact board designs.
• Power – Device core supply specified at 1.14 V to 1.26 V; family-level support for common I/O supply rails is detailed in the LatticeXP documentation.
• Clocking – Two sysCLOCK PLLs available on LFXP6 devices for clock multiplication, division and phase adjustment.
• Non-volatile, Instant-On Architecture – Family-level features include an instant-on non-volatile configuration that eliminates the need for external configuration memory and supports protected bitstream operation.
• Reconfiguration & System Tools – Supports in-field reconfiguration and JTAG-based programming. Family documentation references internal logic analysis and boundary-scan support for system debug and test.
• Commercial Temperature & Compliance – Rated for 0 °C to 85 °C operating temperature (commercial grade) and RoHS compliant.

Typical Applications

• Consumer Electronics – Custom control and interface functions, display controllers, and peripheral bridging leveraging the device’s flexible I/O and embedded memory.
• Communications & Connectivity – Protocol bridging, data path glue logic, and mid-rate serial/parallel interface implementations using the broad I/O standard support.
• Industrial Automation (Commercial Systems) – Control logic, sensor aggregation, and deterministic I/O handling for commercial automation equipment operating within the specified temperature range.
• Embedded Systems – System glue logic, peripheral controllers, and on-board processing where instant-on configuration and compact BGA packaging reduce overall BOM and footprint.

Unique Advantages

• Non-volatile, instant-on operation: Eliminates external configuration memory and reduces system boot time and BOM complexity.
• Flexible I/O standards: Wide-ranging sysIO support enables direct interfacing to a broad set of industry signaling standards without additional level-shifting components.
• Compact, high-density package: 256‑FPBGA (17 × 17 mm) with 188 I/Os supports dense PCB layouts while keeping a small board footprint.
• On-chip memory for system tasks: Approximately 72 Kbits of embedded SRAM plus distributed RAM options allow local buffering and state retention without external RAM.
• Low-power system features: Family-level sleep mode and reconfiguration capabilities help manage static current and enable in-field updates.
• Design and debug support: Family documentation includes boundary-scan and internal logic analysis features to simplify validation and test.

Why Choose LFXP6E-5FN256C?

The LFXP6E-5FN256C provides a balanced combination of mid-range logic capacity, embedded memory, and extensive I/O flexibility in a compact 256-FPBGA package. Its non-volatile, instant-on architecture reduces system complexity by removing the need for external configuration memory and adds protections for bitstream security. With family-level features for reconfiguration, power management, and on-device debug, this FPGA targets designers who need reliable mid-density programmability and interface versatility in commercial-temperature applications.

Engineers building compact consumer or commercial systems will benefit from the device’s integrated memory resources, two PLLs for clock management, and the broad I/O signaling support documented for the LatticeXP family. The device is well suited where board space, reduced BOM, and flexible interfacing are priorities.

Request a quote or submit a purchase inquiry to check availability and lead time for the LFXP6E-5FN256C. Our team can assist with pricing and supply details tailored to your project requirements.