LFXP6E-4TN144C

IC FPGA 100 I/O 144TQFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP

Quantity 83 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O100Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4TN144C – XP Field Programmable Gate Array (FPGA) IC, 100 I/Os, ~72 Kbit RAM, 6000 Logic Elements, 144-LQFP

The LFXP6E-4TN144C is a Lattice XP family FPGA in a 144-LQFP (20 × 20 mm) surface-mount package. It integrates approximately 6,000 logic elements and about 73,728 bits of on-chip RAM to address mid-density programmable logic needs for commercial applications.

Designed for embedded systems, interface bridging, and application-specific logic, this device combines non-volatile, infinitely reconfigurable architecture (as described for the LatticeXP family) with instant-on behavior, low-voltage operation and a 100-pin I/O count to enable compact, responsive solutions.

Key Features

  • Core Logic Approximately 6,000 logic elements provide the programmable fabric for custom logic, state machines, and control functions.
  • Embedded Memory Total on-chip RAM of 73,728 bits (approximately 72 Kbits) supports distributed and block memory requirements for buffering, FIFOs and small data stores.
  • I/O and Packaging 100 I/Os in a 144-LQFP (supplier package listed as 144-TQFP, 20 × 20 mm) surface-mount package, enabling a balance of pin count and compact PCB footprint.
  • Voltage and Power Operates from a core supply range of 1.14 V to 1.26 V and supports the LatticeXP family power-management features such as a sleep mode that enables substantial static current reduction.
  • Non-volatile, Reconfigurable Architecture LatticeXP family characteristics include non-volatile instant-on operation with no external configuration memory required, and the ability to reconfigure SRAM-based logic in milliseconds.
  • Reconfiguration and In-field Updates Series-level TransFR™ reconfiguration allows in-field logic updates while the system operates, supporting rapid feature or bug fixes without hardware replacement.
  • Clocking LatticeXP family devices include analog PLLs for clock multiply, divide and phase shifting; the LFXP6 family supports two PLLs for on-chip clock management.
  • Mounting and Compliance Surface-mount package and RoHS compliance support modern manufacturing requirements; specified commercial operating temperature range is 0 °C to 85 °C.

Typical Applications

  • Embedded Control — Implement control logic, protocol translation and system glue functions where compact size and reprogrammability speed development iterations.
  • Interface and I/O Bridging — Use the 100 available I/Os to aggregate and convert signals between subsystems, supporting custom buffering and timing adjustment with on-chip memory and PLLs.
  • Prototyping and Development — Fast reconfiguration and instant-on behavior enable rapid prototype validation and iterative firmware/hardware co-development.
  • Consumer and Commercial Electronics — Deploy programmable logic for user interfaces, sensor aggregation, and peripheral control within commercial temperature constraints.

Unique Advantages

  • Instant-on Non-Volatility: Eliminates the need for external configuration memory and enables immediate operation at power-up.
  • Compact, Mid-Density Integration: Roughly 6,000 logic elements and ~72 Kbits of embedded memory combine to reduce BOM and PCB area versus multi-chip implementations.
  • Flexible In-field Updates: TransFR reconfiguration supports in-system logic updates without hardware replacement, reducing maintenance cycles.
  • Deterministic Clock Control: On-chip PLLs provide clock multiplication, division and phase shifting to simplify timing architecture and reduce external components.
  • Commercial-Grade Temperature Range: Rated for 0 °C to 85 °C to match a wide range of commercial product requirements.
  • RoHS Compliant: Supports regulatory and manufacturing requirements for lead-free assemblies.

Why Choose LFXP6E-4TN144C?

The LFXP6E-4TN144C delivers a balanced mid-density FPGA option for designers seeking a compact, reconfigurable solution with instant-on non-volatile operation and meaningful on-chip memory. With approximately 6,000 logic elements, ~73 Kbits of RAM, and 100 I/Os in a 144-LQFP surface-mount package, it is well suited to embedded control, interface bridging and commercial electronic applications where board area, BOM reduction and field reconfigurability matter.

Backed by the LatticeXP family architecture—offering sleep mode power reduction, in-field reconfiguration and on-chip clock management—this device provides a scalable platform for evolving designs and iterative product development.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for LFXP6E-4TN144C.

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