LFXP6E-4QN208C

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 96 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O142Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4QN208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6E-4QN208C is a member of the LatticeXP family of non-volatile FPGAs, offering instant-on reconfigurability and on-chip memory for system-level integration. This device combines approximately 6,000 logic elements, 142 I/Os, and embedded memory resources in a 208‑pin BFQFP (28 × 28 mm) surface-mount package.

Designed for commercial-temperature applications (0 °C to 85 °C), the device supports in-field reconfiguration, low-power sleep modes and system clocking features that simplify integration into embedded and control systems. Core supply is specified at 1.14 V to 1.26 V and the device is RoHS compliant.

Key Features

  • Non-volatile, instant-on architecture – Powers up and configures quickly without external configuration memory, enabling secure, fast startup.
  • Logic capacity – Approximately 6,000 logic elements and 720 logic blocks (family PFU/PFF resources) for mid-density FPGA designs.
  • Embedded and distributed memory – Provides approximately 72 Kbits of embedded block RAM plus family-level distributed RAM resources (LFXP6 family shows up to 23 Kbits distributed RAM).
  • Flexible I/O and I/O count – 142 I/O pins in the 208‑pin BFQFP package to support a wide range of peripheral and interface requirements.
  • Clocking and PLLs – On-chip sysCLOCK PLLs (family support) for clock multiply/divide and phase shifting; LFXP6 family supports up to 2 PLLs.
  • Low-power modes and reconfiguration – Sleep mode capability (significant static current reduction) and TransFR™ reconfiguration for in-field logic updates.
  • Package and mounting – 208‑BFQFP (28 × 28 mm) surface-mount package, suitable for higher I/O mid-density board designs.
  • Commercial temperature grade – Rated for 0 °C to 85 °C operation.
  • Standards and system support (family-level) – Family datasheet documents support for multiple I/O standards and system features including boundary-scan and onboard configuration options.
  • Regulatory status – RoHS compliant.

Typical Applications

  • Embedded control and system glue logic – Mid-density logic integration for control functions, protocol bridging and custom peripheral interfaces.
  • In-field configurable systems – Support for reconfiguration and TransFR™ enables field updates to FPGA logic while the system is in operation.
  • Memory interface and buffering – On-chip block RAM and PLL resources support memory interface logic and timing management.
  • High‑I/O interface hubs – 142 I/Os in a compact PQFP package for consolidating multiple I/O standards and peripherals.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid system startup.
  • Integrated memory resources: Embedded block RAM plus distributed RAM reduce external memory requirements for many designs.
  • Field reconfiguration: TransFR™ and re-programmable SRAM logic allow in-field updates without complete system downtime.
  • Compact, high-I/O packaging: 208‑pin BFQFP provides a balance of pin count and board-area efficiency for mid-density applications.
  • Power and clocking flexibility: Low-power sleep mode and on-chip PLLs simplify power management and clock distribution in system designs.
  • Regulatory and assembly readiness: Surface-mount BFQFP packaging and RoHS compliance support standard PCB assembly processes.

Why Choose LFXP6E-4QN208C?

The LFXP6E-4QN208C positions itself as a versatile, mid-density FPGA for commercial embedded designs that require non-volatile instant-on behavior, on-chip memory and flexible I/O in a compact surface-mount package. Its combination of approximately 6,000 logic elements, substantial embedded RAM and 142 I/Os makes it well suited for system glue logic, configurable interfaces, and in-field-updatable applications.

Backed by the LatticeXP family architecture and supported system features such as PLLs and boundary-scan, this device offers an integration-focused solution for designers seeking to minimize external components while retaining reconfigurability and predictable supply and thermal limits for commercial-temperature deployments.

Request a quote or submit an inquiry for pricing and availability of the LFXP6E-4QN208C to evaluate it for your next design.

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