LFXP6E-4QN208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 96 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4QN208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6E-4QN208C is a member of the LatticeXP family of non-volatile FPGAs, offering instant-on reconfigurability and on-chip memory for system-level integration. This device combines approximately 6,000 logic elements, 142 I/Os, and embedded memory resources in a 208‑pin BFQFP (28 × 28 mm) surface-mount package.
Designed for commercial-temperature applications (0 °C to 85 °C), the device supports in-field reconfiguration, low-power sleep modes and system clocking features that simplify integration into embedded and control systems. Core supply is specified at 1.14 V to 1.26 V and the device is RoHS compliant.
Key Features
- Non-volatile, instant-on architecture – Powers up and configures quickly without external configuration memory, enabling secure, fast startup.
- Logic capacity – Approximately 6,000 logic elements and 720 logic blocks (family PFU/PFF resources) for mid-density FPGA designs.
- Embedded and distributed memory – Provides approximately 72 Kbits of embedded block RAM plus family-level distributed RAM resources (LFXP6 family shows up to 23 Kbits distributed RAM).
- Flexible I/O and I/O count – 142 I/O pins in the 208‑pin BFQFP package to support a wide range of peripheral and interface requirements.
- Clocking and PLLs – On-chip sysCLOCK PLLs (family support) for clock multiply/divide and phase shifting; LFXP6 family supports up to 2 PLLs.
- Low-power modes and reconfiguration – Sleep mode capability (significant static current reduction) and TransFR™ reconfiguration for in-field logic updates.
- Package and mounting – 208‑BFQFP (28 × 28 mm) surface-mount package, suitable for higher I/O mid-density board designs.
- Commercial temperature grade – Rated for 0 °C to 85 °C operation.
- Standards and system support (family-level) – Family datasheet documents support for multiple I/O standards and system features including boundary-scan and onboard configuration options.
- Regulatory status – RoHS compliant.
Typical Applications
- Embedded control and system glue logic – Mid-density logic integration for control functions, protocol bridging and custom peripheral interfaces.
- In-field configurable systems – Support for reconfiguration and TransFR™ enables field updates to FPGA logic while the system is in operation.
- Memory interface and buffering – On-chip block RAM and PLL resources support memory interface logic and timing management.
- High‑I/O interface hubs – 142 I/Os in a compact PQFP package for consolidating multiple I/O standards and peripherals.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid system startup.
- Integrated memory resources: Embedded block RAM plus distributed RAM reduce external memory requirements for many designs.
- Field reconfiguration: TransFR™ and re-programmable SRAM logic allow in-field updates without complete system downtime.
- Compact, high-I/O packaging: 208‑pin BFQFP provides a balance of pin count and board-area efficiency for mid-density applications.
- Power and clocking flexibility: Low-power sleep mode and on-chip PLLs simplify power management and clock distribution in system designs.
- Regulatory and assembly readiness: Surface-mount BFQFP packaging and RoHS compliance support standard PCB assembly processes.
Why Choose LFXP6E-4QN208C?
The LFXP6E-4QN208C positions itself as a versatile, mid-density FPGA for commercial embedded designs that require non-volatile instant-on behavior, on-chip memory and flexible I/O in a compact surface-mount package. Its combination of approximately 6,000 logic elements, substantial embedded RAM and 142 I/Os makes it well suited for system glue logic, configurable interfaces, and in-field-updatable applications.
Backed by the LatticeXP family architecture and supported system features such as PLLs and boundary-scan, this device offers an integration-focused solution for designers seeking to minimize external components while retaining reconfigurability and predictable supply and thermal limits for commercial-temperature deployments.
Request a quote or submit an inquiry for pricing and availability of the LFXP6E-4QN208C to evaluate it for your next design.