LFXP6E-4FN256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA

Quantity 419 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4FN256I – XP FPGA, 6,000 logic elements, 188 I/Os, 256‑BGA

The LFXP6E-4FN256I is a non-volatile LatticeXP family Field Programmable Gate Array (FPGA) offered in a 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 6,000 logic elements, approximately 72 Kbits of embedded RAM, and up to 188 I/Os to support compact, high‑function designs.

Designed for applications that require instant-on operation, in-field reconfiguration and industrial temperature operation, this device delivers integrated memory, flexible I/O support and power-efficient modes suitable for embedded systems and industrial-class designs.

Key Features

  • Core logic — Approximately 6,000 logic elements enabling mid-density FPGA designs and local logic integration.
  • Embedded memory — Total on-chip RAM of 73,728 bits (approximately 72 Kbits) for distributed and block memory usage.
  • I/O capacity & package — Up to 188 I/Os in a 256‑ball fpBGA (17 × 17 mm) package; surface-mount mounting simplifies board integration.
  • Non-volatile, instant-on architecture — Built on the LatticeXP family technology that provides instant-on operation without external configuration memory and supports in-field reconfiguration.
  • Reconfiguration and power modes — Support for in-system reconfiguration and a sleep mode offering up to 1000× static current reduction.
  • Clocking and DDR support — Integrated PLL capability (LFXP6 devices include 2 PLLs) and dedicated DDR memory interface support up to DDR333 (166 MHz).
  • Flexible I/O buffer standards — Supports a wide range of interfaces as defined for the LatticeXP family, including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other differential standards.
  • Industrial temperature and supply — Operating temperature range of −40 °C to 100 °C and specified voltage supply 1.14 V to 1.26 V.
  • Compliance — RoHS compliant for environmental and regulatory consistency.

Typical Applications

  • Industrial control — Use in motor control, PLC expansion or machine I/O where industrial temperature range and instant-on behavior reduce startup constraints.
  • Embedded systems — Integration of glue logic, custom peripherals and memory interfaces in compact board footprints using the 256‑BGA package and 188 I/Os.
  • Communications and memory interfaces — Implement DDR interfaces and assorted serial/parallel I/O standards leveraging the device’s dedicated DDR support and flexible sysIO buffers.
  • Field-upgradable systems — In-field logic update capability lets deployed systems receive firmware or feature updates without removing the device.

Unique Advantages

  • Instant-on, non-volatile architecture — Eliminates the need for external configuration memory and accelerates system boot.
  • In-field reconfigurability — Supports runtime updates to logic, enabling feature upgrades and iterative development in deployed equipment.
  • Compact, high-density integration — 6,000 logic elements, embedded RAM and 188 I/Os in a 17 × 17 mm fpBGA reduce PCB area and BOM complexity.
  • Industrial-ready operating range — −40 °C to 100 °C rating supports reliable operation in demanding environments.
  • Power management — Sleep mode capability significantly reduces static current for low-power standby operation.
  • Standards-flexible I/O — Broad I/O standard support simplifies interfacing to processors, memory and mixed-signal peripherals.

Why Choose LFXP6E-4FN256I?

The LFXP6E-4FN256I positions mid-density FPGA capability with non-volatile instant-on behavior, flexible I/O standards and embedded memory suitable for compact industrial and embedded applications. Its combination of approximately 6,000 logic elements, ~72 Kbits of on-chip RAM and 188 I/Os in a 256‑BGA package offers a balance of integration and board-level efficiency.

This device is appropriate for engineers seeking a reconfigurable, in-field-updateable solution with industrial temperature endurance and RoHS compliance. It provides a practical platform for designs that require controlled power behavior, DDR memory interfacing and a broad range of I/O standards.

Request a quote or submit an inquiry to receive pricing and availability information for the LFXP6E-4FN256I.

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