LFXP6E-4FN256I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 73728 6000 256-BGA |
|---|---|
| Quantity | 419 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4FN256I – XP FPGA, 6,000 logic elements, 188 I/Os, 256‑BGA
The LFXP6E-4FN256I is a non-volatile LatticeXP family Field Programmable Gate Array (FPGA) offered in a 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 6,000 logic elements, approximately 72 Kbits of embedded RAM, and up to 188 I/Os to support compact, high‑function designs.
Designed for applications that require instant-on operation, in-field reconfiguration and industrial temperature operation, this device delivers integrated memory, flexible I/O support and power-efficient modes suitable for embedded systems and industrial-class designs.
Key Features
- Core logic — Approximately 6,000 logic elements enabling mid-density FPGA designs and local logic integration.
- Embedded memory — Total on-chip RAM of 73,728 bits (approximately 72 Kbits) for distributed and block memory usage.
- I/O capacity & package — Up to 188 I/Os in a 256‑ball fpBGA (17 × 17 mm) package; surface-mount mounting simplifies board integration.
- Non-volatile, instant-on architecture — Built on the LatticeXP family technology that provides instant-on operation without external configuration memory and supports in-field reconfiguration.
- Reconfiguration and power modes — Support for in-system reconfiguration and a sleep mode offering up to 1000× static current reduction.
- Clocking and DDR support — Integrated PLL capability (LFXP6 devices include 2 PLLs) and dedicated DDR memory interface support up to DDR333 (166 MHz).
- Flexible I/O buffer standards — Supports a wide range of interfaces as defined for the LatticeXP family, including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other differential standards.
- Industrial temperature and supply — Operating temperature range of −40 °C to 100 °C and specified voltage supply 1.14 V to 1.26 V.
- Compliance — RoHS compliant for environmental and regulatory consistency.
Typical Applications
- Industrial control — Use in motor control, PLC expansion or machine I/O where industrial temperature range and instant-on behavior reduce startup constraints.
- Embedded systems — Integration of glue logic, custom peripherals and memory interfaces in compact board footprints using the 256‑BGA package and 188 I/Os.
- Communications and memory interfaces — Implement DDR interfaces and assorted serial/parallel I/O standards leveraging the device’s dedicated DDR support and flexible sysIO buffers.
- Field-upgradable systems — In-field logic update capability lets deployed systems receive firmware or feature updates without removing the device.
Unique Advantages
- Instant-on, non-volatile architecture — Eliminates the need for external configuration memory and accelerates system boot.
- In-field reconfigurability — Supports runtime updates to logic, enabling feature upgrades and iterative development in deployed equipment.
- Compact, high-density integration — 6,000 logic elements, embedded RAM and 188 I/Os in a 17 × 17 mm fpBGA reduce PCB area and BOM complexity.
- Industrial-ready operating range — −40 °C to 100 °C rating supports reliable operation in demanding environments.
- Power management — Sleep mode capability significantly reduces static current for low-power standby operation.
- Standards-flexible I/O — Broad I/O standard support simplifies interfacing to processors, memory and mixed-signal peripherals.
Why Choose LFXP6E-4FN256I?
The LFXP6E-4FN256I positions mid-density FPGA capability with non-volatile instant-on behavior, flexible I/O standards and embedded memory suitable for compact industrial and embedded applications. Its combination of approximately 6,000 logic elements, ~72 Kbits of on-chip RAM and 188 I/Os in a 256‑BGA package offers a balance of integration and board-level efficiency.
This device is appropriate for engineers seeking a reconfigurable, in-field-updateable solution with industrial temperature endurance and RoHS compliance. It provides a practical platform for designs that require controlled power behavior, DDR memory interfacing and a broad range of I/O standards.
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