LFXP6E-4F256I

The LFXP6E-4F256I is a non-volatile LatticeXP family FPGA from Lattice Semiconductor Corporation designed for industrial applications. It combines reconfigurable logic, embedded memory and a flexible I/O fabric in a compact 256-ball fpBGA (17 × 17 mm) package to support system designs that require instant-on behavior, field reconfiguration and robust I/O connectivity.

Typical use cases include industrial control and automation, embedded processing and high-density I/O interfaces where deterministic power-up, in-field updates and an extended operating temperature range are required.

Key Features

• Core Architecture Non-volatile LatticeXP family FPGA architecture with instant-on capability and in-system reconfiguration, enabling rapid power-up and secure configuration without external configuration memory.
• Logic Capacity 720 logic blocks and approximately 6,000 logic elements provide mid-range programmable logic capacity for control, glue logic and custom state machines.
• Embedded Memory Approximately 73,728 bits (≈72 Kbits) of on-chip RAM with both embedded block RAM and distributed RAM resources for data buffering, FIFO and scratchpad memory.
• I/O and Interface Support 188 I/Os in a 256-ball fpBGA package with a programmable sysIO buffer supporting a wide range of standards and high-speed signaling options as provided in the LatticeXP family.
• Dedicated Memory Interface Built-in support for DDR memory interfaces (device-level support included in family data), enabling connections to external DDR devices where required.
• Clocking and Timing Up to 2 integrated PLLs on the LFXP6 device, providing clock multiply/divide and phase-shifting capabilities for flexible timing architectures.
• Low-Power and Sleep Mode Sleep mode capability for significant static current reduction to support low-power system states.
• Power Supply Core supply range specified from 1.14 V to 1.26 V to meet system power requirements.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package 256-FPBGA (17 × 17 mm) surface-mount package offering 188 available I/Os in a compact footprint.
• System and Development Support Family-level features include IEEE 1149.1 boundary-scan and internal logic analysis capabilities for board-level debug and in-system diagnostics.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control and Automation Implement motor control logic, sensor interfacing and deterministic I/O aggregation using the device’s industrial temperature rating and flexible I/O count.
• Embedded Processing and Glue Logic Offload custom protocol handling, signal conditioning and board-level control functions to the FPGA’s logic elements and embedded RAM.
• High-Density I/O Systems Support multi-channel data acquisition or interface bridging where 188 I/Os and programmable I/O standards are needed.
• Field Upgradeable Systems Use in equipment that requires in-field logic updates with the family’s TransFR reconfiguration and non-volatile, infinitely reconfigurable architecture.

Unique Advantages

• Instant-on, Non-volatile Configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior for systems that require immediate availability.
• Field Reconfigurability: In-system reconfiguration capability allows logic updates and feature changes without board-level hardware modifications.
• Compact, High-I/O Package: 256-FPBGA (17 × 17 mm) package delivers 188 I/Os in a small footprint to reduce board area while keeping signal connectivity high.
• Industrial Temperature Support: Specified operation from −40 °C to 100 °C for reliable operation in industrial environments.
• Integrated Memory Resources: On-chip embedded and distributed RAM (approximately 72 Kbits) for buffering and local data storage without external memory requirements for many use cases.
• Power and Clock Flexibility: Core supply range of 1.14–1.26 V and integrated PLLs enable adaptable power and clock architectures for varied system designs.

Why Choose LFXP6E-4F256I?

The LFXP6E-4F256I delivers a balanced combination of non-volatile instant-on operation, mid-range logic capacity and flexible I/O in a compact 256-ball fpBGA package suited to industrial system designs. Its embedded memory, reconfiguration capabilities and industrial temperature rating make it appropriate for applications that require reliable, field-updateable logic and substantial I/O integration.

This device is well suited to engineers and designers building industrial control equipment, embedded platforms and high-density interface modules who need a programmable, reconfigurable solution with on-chip memory and robust system-level features.

If you would like pricing, availability or to request a quote for the LFXP6E-4F256I, submit a product inquiry or request a quote through the usual procurement channels. Our team can provide availability, lead-time and ordering information.