LFXP6E-4Q208I

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 442 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O142Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4Q208I – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6E-4Q208I is a LatticeXP family FPGA providing non-volatile, infinitely reconfigurable logic in a 208-pin BFQFP package. It combines approximately 6,000 logic elements with on-chip RAM and flexible I/O to address embedded, industrial and communications applications that require instant-on operation, in-field reconfiguration and robust thermal performance.

Designed for systems that need high integration and configurable interfaces, this device delivers 142 I/O pins, 73,728 bits of total on-chip RAM, and industrial-grade operating range from -40 °C to 100 °C while operating from a core supply between 1.14 V and 1.26 V.

Key Features

  • Core Logic  Approximately 6,000 logic elements and 720 logic block units provide mid-range LUT-based capacity for custom logic and glue-logic implementations.
  • Non-volatile, Instant-on Architecture  LatticeXP family technology enables instant-on power-up in microseconds with no external configuration memory required and supports in-field reconfiguration.
  • On-chip Memory  73,728 bits of total on-chip RAM for embedded and distributed storage; family architecture supports block and distributed memory configurations.
  • Flexible I/O  142 I/Os in a 208-BFQFP package allow a wide variety of peripheral and bus connections in a compact surface-mount footprint.
  • System and Clocking Support  Family features include multiple PLLs for clock multiply/divide and phase shifting, enabling synchronous interfaces and memory controllers.
  • Power and Low‑Power Modes  Supports Sleep Mode capability for large reductions in static current draw and fast reconfiguration for power-efficient system design.
  • Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for demanding thermal environments.
  • Package and Mounting  Surface-mount 208-PQFP (28 × 28 mm) package provides a high-pin-count option for dense board designs while remaining RoHS compliant.

Typical Applications

  • Industrial Control  Implement custom control logic, sensor aggregation and deterministic I/O handling using the device’s logic elements, extensive I/O count and industrial temperature rating.
  • Embedded Systems  Use instant-on, on-chip non-volatile configuration and reconfigurable logic to reduce BOM and eliminate external configuration memory in embedded controllers and appliances.
  • Communications and Networking  Leverage flexible clocking and programmable I/O to build protocol adapters, interface bridging and mid-range packet-processing functions.
  • Memory Interface and DSP Front-Ends  Dedicated DDR memory support and analog PLLs in the family enable implementation of memory controllers and high-speed interface blocks.

Unique Advantages

  • Instant-on Non-volatile Operation: Eliminates the need for external configuration memory and enables systems to start in microseconds.
  • In-field Reconfiguration: Supports rapid reprogramming of SRAM-based logic and system updates without replacing hardware.
  • Compact, High‑I/O Package: 208-BFQFP package delivers 142 I/Os for complex I/O requirements while fitting surface-mount board designs.
  • Power Efficiency Features: Sleep Mode and low static-current capabilities help reduce standby power in battery-backed and energy-conscious systems.
  • Industrial Reliability: Rated for -40 °C to 100 °C operation for deployment in harsher environments.
  • Integrated Memory Resources: On-chip RAM resources provide flexible embedded and distributed memory for buffering, state storage and small lookup tables.

Why Choose LFXP6E-4Q208I?

The LFXP6E-4Q208I delivers a balanced combination of reconfigurable logic, on-chip memory and abundant I/O in an industrial-grade, non-volatile FPGA. Its instant-on behavior and in-field reconfiguration capabilities make it well suited for designs that demand fast startup, secure configuration and iterative field updates without extra configuration components.

This device is appropriate for engineering teams building mid-density embedded, industrial control or communications systems that require a compact package, robust operating range and a versatile FPGA architecture backed by documented family features.

Request a quote or submit an inquiry to receive pricing, lead-time and availability for the LFXP6E-4Q208I. Our team can provide further technical details and support to help integrate this FPGA into your design.

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