LFXP6E-4Q208C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,583 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4Q208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP
The LFXP6E-4Q208C is a commercial-grade, non-volatile FPGA from Lattice’s LatticeXP family, provided in a 208-pin BFQFP package (28 × 28 mm supplier PQFP footprint). This device integrates approximately 6,000 logic elements, roughly 73 Kbits of on-chip RAM, and 142 user I/Os to support compact, reconfigurable logic and embedded memory for commercial embedded systems and communications equipment.
Built on the LatticeXP architecture, the device offers instant-on non-volatile configuration, flexible I/O support and power management capabilities designed to simplify system-level integration and accelerate time to market for FPGA-based designs.
Key Features
- Logic Capacity — Approximately 6,000 logic elements suitable for medium-density control, interface and glue-logic functions.
- On-Chip Memory — Total on-chip RAM of 73,728 bits (approximately 73 Kbits) for distributed and block RAM use in buffering, FIFOs and small data stores.
- I/O — 142 general-purpose I/Os provided in a 208-BFQFP package, enabling flexible external connectivity in a compact footprint.
- Non-volatile, Instant-On Configuration — Device configuration is non-volatile with instant-on behavior; no external configuration memory is required.
- Flexible sysIO™ Buffer Support — Family-level programmable I/O buffers support a wide range of interface standards, enabling mixed-voltage and multi-protocol designs.
- Power and Sleep Modes — Includes sleep mode capability for substantial static current reduction to support low-power use cases.
- Reconfiguration — Supports in-field reconfiguration and rapid SRAM-based updates to enable iterative improvements and feature updates.
- Clocking — Family architecture includes analog PLL resources for clock multiplication, division and phase shifting to support complex timing requirements.
- Package & Mounting — Surface-mount 208-BFQFP package (supplier 208-PQFP 28×28 mm) for board-level assembly in compact layouts.
- Power and Temperature — Core voltage specified at 1.14 V to 1.26 V; commercial operating temperature range of 0 °C to 85 °C.
- RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Interface Bridging & Protocol Conversion — Use the device’s flexible I/O support and abundant I/Os to implement protocol translators and interface bridges between mixed-voltage peripherals.
- Embedded Control & Glue Logic — Leverage the logic capacity and on-chip RAM for control state machines, peripheral aggregation and custom logic functions in commercial equipment.
- DDR/Memory Interface Support — Family-level dedicated DDR memory support and programmable clocking make the device suitable for designs that require embedded memory controllers and buffering.
- In-field Upgradable Systems — Non-volatile configuration and reconfiguration features enable firmware and logic updates without external configuration memory, supporting maintenance and feature enhancement workflows.
Unique Advantages
- Instant-on Non-volatile Configuration: Eliminates the need for external configuration memory and enables immediate device availability after power-up.
- Compact, High-Connectivity Package: 142 I/Os in a 208-BFQFP package provide a dense pinout for mid-sized systems while keeping PCB area manageable.
- Balanced Logic and Memory: Approximately 6,000 logic elements with ~73 Kbits of on-chip RAM allow consolidation of control logic and small data buffers without external RAM for many applications.
- Flexible I/O Standards: Programmable I/O buffering supports a wide range of interface standards, simplifying mixed-signal and mixed-voltage integration.
- Power Management Features: Sleep mode capability enables significant static current reduction for power-sensitive commercial applications.
- Reconfiguration in the Field: Supports rapid in-field logic updates to extend product lifetime and enable feature evolution.
Why Choose LFXP6E-4Q208C?
The LFXP6E-4Q208C combines non-volatile instant-on configuration, mid-range logic density and flexible I/O in a compact 208-BFQFP package. Its combination of approximately 6,000 logic elements, roughly 73 Kbits of on-chip RAM and 142 I/Os makes it well suited for commercial embedded designs that require reconfigurability, interface flexibility and compact board-level integration.
For design teams targeting commercial equipment, communications modules, or embedded control applications, this device offers a balance of integration, low-power features and field reconfiguration capability backed by a family-level ecosystem of tools and IP.
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