LFXP6E-4Q208C

IC FPGA 142 I/O 208QFP
Part Description

XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

Quantity 1,583 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O142Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs720Number of Logic Elements/Cells6000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of LFXP6E-4Q208C – XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP

The LFXP6E-4Q208C is a commercial-grade, non-volatile FPGA from Lattice’s LatticeXP family, provided in a 208-pin BFQFP package (28 × 28 mm supplier PQFP footprint). This device integrates approximately 6,000 logic elements, roughly 73 Kbits of on-chip RAM, and 142 user I/Os to support compact, reconfigurable logic and embedded memory for commercial embedded systems and communications equipment.

Built on the LatticeXP architecture, the device offers instant-on non-volatile configuration, flexible I/O support and power management capabilities designed to simplify system-level integration and accelerate time to market for FPGA-based designs.

Key Features

  • Logic Capacity — Approximately 6,000 logic elements suitable for medium-density control, interface and glue-logic functions.
  • On-Chip Memory — Total on-chip RAM of 73,728 bits (approximately 73 Kbits) for distributed and block RAM use in buffering, FIFOs and small data stores.
  • I/O — 142 general-purpose I/Os provided in a 208-BFQFP package, enabling flexible external connectivity in a compact footprint.
  • Non-volatile, Instant-On Configuration — Device configuration is non-volatile with instant-on behavior; no external configuration memory is required.
  • Flexible sysIO™ Buffer Support — Family-level programmable I/O buffers support a wide range of interface standards, enabling mixed-voltage and multi-protocol designs.
  • Power and Sleep Modes — Includes sleep mode capability for substantial static current reduction to support low-power use cases.
  • Reconfiguration — Supports in-field reconfiguration and rapid SRAM-based updates to enable iterative improvements and feature updates.
  • Clocking — Family architecture includes analog PLL resources for clock multiplication, division and phase shifting to support complex timing requirements.
  • Package & Mounting — Surface-mount 208-BFQFP package (supplier 208-PQFP 28×28 mm) for board-level assembly in compact layouts.
  • Power and Temperature — Core voltage specified at 1.14 V to 1.26 V; commercial operating temperature range of 0 °C to 85 °C.
  • RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Interface Bridging & Protocol Conversion — Use the device’s flexible I/O support and abundant I/Os to implement protocol translators and interface bridges between mixed-voltage peripherals.
  • Embedded Control & Glue Logic — Leverage the logic capacity and on-chip RAM for control state machines, peripheral aggregation and custom logic functions in commercial equipment.
  • DDR/Memory Interface Support — Family-level dedicated DDR memory support and programmable clocking make the device suitable for designs that require embedded memory controllers and buffering.
  • In-field Upgradable Systems — Non-volatile configuration and reconfiguration features enable firmware and logic updates without external configuration memory, supporting maintenance and feature enhancement workflows.

Unique Advantages

  • Instant-on Non-volatile Configuration: Eliminates the need for external configuration memory and enables immediate device availability after power-up.
  • Compact, High-Connectivity Package: 142 I/Os in a 208-BFQFP package provide a dense pinout for mid-sized systems while keeping PCB area manageable.
  • Balanced Logic and Memory: Approximately 6,000 logic elements with ~73 Kbits of on-chip RAM allow consolidation of control logic and small data buffers without external RAM for many applications.
  • Flexible I/O Standards: Programmable I/O buffering supports a wide range of interface standards, simplifying mixed-signal and mixed-voltage integration.
  • Power Management Features: Sleep mode capability enables significant static current reduction for power-sensitive commercial applications.
  • Reconfiguration in the Field: Supports rapid in-field logic updates to extend product lifetime and enable feature evolution.

Why Choose LFXP6E-4Q208C?

The LFXP6E-4Q208C combines non-volatile instant-on configuration, mid-range logic density and flexible I/O in a compact 208-BFQFP package. Its combination of approximately 6,000 logic elements, roughly 73 Kbits of on-chip RAM and 142 I/Os makes it well suited for commercial embedded designs that require reconfigurability, interface flexibility and compact board-level integration.

For design teams targeting commercial equipment, communications modules, or embedded control applications, this device offers a balance of integration, low-power features and field reconfiguration capability backed by a family-level ecosystem of tools and IP.

Request a quote or submit your purchase inquiry to get pricing and availability for the LFXP6E-4Q208C.

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