LFXP6E-4QN208I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 142 73728 6000 208-BFQFP |
|---|---|
| Quantity | 1,892 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 142 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4QN208I – XP FPGA, ~6,000 Logic Elements, 142 I/Os, 208-BFQFP
The LFXP6E-4QN208I is a non-volatile, reconfigurable FPGA from Lattice Semiconductor Corporation’s LatticeXP family. It provides approximately 6,000 logic elements and approximately 73.7 Kbits of embedded RAM in a 208-pin BFQFP surface-mount package targeted at industrial applications.
This device is designed for systems that need instant-on operation, flexible I/O support and in-field reconfiguration capabilities, while meeting industrial temperature requirements from −40 °C to 100 °C.
Key Features
- Core Logic — Approximately 6,000 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 73.7 Kbits) supporting both distributed and block memory usage.
- I/O Resources — 142 I/Os in a 208-pin BFQFP package, with flexible sysIO buffer options outlined by the LatticeXP family.
- Non-volatile, Instant-on Configuration — LatticeXP family features include non-volatile instant-on operation and no requirement for external configuration memory.
- In-field Reconfiguration — TransFR™ (transparent reconfiguration) capability and reconfigurable SRAM-based logic for updating designs in the field.
- Power and Voltage — Core supply specified at 1.14 V to 1.26 V; family-level I/O voltage support includes typical I/O supply options (1.2 V, 1.8 V, 2.5 V, 3.3 V) per LatticeXP documentation.
- Clocking — Device-level clock management includes PLL resources as specified for the LFXP6 family.
- System Support — Supports IEEE 1149.1 boundary scan, ispTRACY™ internal logic analysis and JTAG for configuration and debug (family-level features).
- Thermal and Mounting — Industrial-grade operating temperature −40 °C to 100 °C and surface-mount package (208-BFQFP, supplier package 208-PQFP 28×28 mm).
- Standards and Compliance — RoHS compliant.
Typical Applications
- Industrial Control and Automation — Industrial-grade temperature range and reconfigurable logic make the device suitable for control, sequencing and interface tasks in automated systems.
- High-density I/O and Protocol Bridging — With 142 I/Os and the LatticeXP family’s flexible sysIO buffering, the device is applicable for protocol bridging, custom interface engines and peripheral aggregation.
- Memory Interface and DDR Support — Family-level dedicated DDR memory support and flexible memory resources enable use in applications requiring external memory interfaces and buffering.
- In-field Upgradable Systems — TransFR™ reconfiguration and non-volatile instant-on behavior support systems that need fast field updates and secure configuration.
Unique Advantages
- Non-volatile Instant-on — Eliminates the need for external configuration memory and enables immediate start-up behavior.
- In-field Reconfiguration — Transparent reconfiguration (TransFR™) permits logic updates while the system remains operational, reducing downtime for updates.
- Compact, High-I/O Package — 208-pin BFQFP with 142 I/Os delivers a balance of connectivity and PCB footprint for space-constrained designs.
- Industrial Temperature Range — Specified operation from −40 °C to 100 °C supports deployment in demanding environments.
- Integrated Design Ecosystem — Family-level support through Lattice design tools and available ispLeverCORE™ IP helps accelerate development and implementation.
Why Choose LFXP6E-4QN208I?
The LFXP6E-4QN208I positions itself as a mid-density, industrial-grade FPGA offering a practical combination of logic capacity (approximately 6,000 logic elements), on-chip RAM (approximately 73.7 Kbits), and a high-count I/O package (142 pins). It is well suited to designers who need instant-on non-volatile operation, flexible I/O interfacing and the capability to perform in-field logic updates.
Backed by Lattice Semiconductor’s LatticeXP family documentation and design tools, this device supports a streamlined development flow with pre-designed IP and system-level features for boundary scan and internal logic analysis, helping reduce development time and improve system maintainability.
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