LFXP6E-4T144I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP |
|---|---|
| Quantity | 968 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 100 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 720 | Number of Logic Elements/Cells | 6000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of LFXP6E-4T144I – XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP
The LFXP6E-4T144I is a Lattice Semiconductor XP-family FPGA in a 144-LQFP package, specified for industrial-grade applications with an operating range of -40 °C to 100 °C. It combines non-volatile, infinitely reconfigurable logic with embedded memory and flexible I/O to support compact, reliable embedded and control designs.
With 6,000 logic elements, 73,728 bits of on-chip RAM and 100 I/O pins, this device targets designs that require instant-on configuration, in-field reconfiguration and a small-footprint package while maintaining industrial temperature capability and low-voltage core operation.
Key Features
- Core architecture — Non-volatile, infinitely reconfigurable LatticeXP technology offering instant-on operation and no requirement for external configuration memory.
- Logic capacity — 6,000 logic elements to implement medium-density logic and control functions in a single device.
- Embedded memory — 73,728 bits of on-chip RAM (approximately 72 Kbits) for distributed and block memory needs.
- I/O capability — 100 general-purpose I/Os in a 144-LQFP (20 × 20 mm TQFP footprint) package for dense peripheral and interface integration.
- Voltage supply — Core supply range specified from 1.14 V to 1.26 V to match low-voltage system designs.
- Industrial operating range — Specified for operation from -40 °C to 100 °C for demanding environmental conditions.
- Low-power modes — Sleep mode enabling significant static current reduction for power-sensitive applications.
- In-field reconfiguration (TransFR) — Supports TransFR reconfiguration for updating logic while the system remains operational.
- Clocks and timing — Implements configurable PLLs (device family options include PLL resources) for clock multiply/divide and phase shifting.
Typical Applications
- Industrial control and automation — Compact FPGA logic and industrial temperature rating make this device suitable for control, I/O aggregation and real-time sequencing in factory and process equipment.
- Embedded communications and protocol bridging — Flexible I/O and on-chip memory support protocol translation, interface bridging and custom packet handling in communication modules.
- Custom peripherals and user interfaces — 100 I/Os and embedded logic enable implementation of display/LED control, keypad handling and local peripheral glue logic without external components.
- Field-updatable systems — Non-volatile instant-on plus TransFR in-field reconfiguration allow firmware and logic updates without external configuration memory or long boot times.
Unique Advantages
- Instant-on, non-volatile operation — Powers up in microseconds with no external configuration memory required, simplifying system boot and improving security of the configuration image.
- Compact, I/O-rich package — 144-LQFP footprint with 100 I/Os provides a balance of integration and board-level density for space-constrained designs.
- Industrial temperature capability — Rated from -40 °C to 100 °C to meet extended-environment deployment requirements.
- Low-voltage core — Core supply specified between 1.14 V and 1.26 V to align with modern low-voltage system domains.
- In-field reconfiguration and low-power standby — TransFR reconfiguration supports live updates; Sleep mode enables large reductions in static current when idle.
- On-chip memory and clocking — Approximately 72 Kbits of embedded RAM and integrated PLL resources enable local buffering and flexible clock management without additional ICs.
Why Choose LFXP6E-4T144I?
The LFXP6E-4T144I delivers a balanced combination of medium-density logic (6,000 logic elements), embedded memory and a high count of I/Os in a compact 144-LQFP package tailored to industrial environments. Its non-volatile, instant-on architecture and in-field reconfiguration capabilities reduce system complexity by eliminating external configuration memory and enabling updates while the system runs.
This device is well suited to engineering teams designing compact industrial and embedded systems that require reliable operation across temperature extremes, flexible I/O, and the ability to update logic in the field. The LatticeXP family ecosystem, including the documented design flows and available IP, supports efficient implementation and migration within the family.
If you would like pricing, availability or to request a quote for LFXP6E-4T144I, submit an inquiry or quote request and our team will respond with details to support your evaluation and procurement.