LFXP6E-4TN144I

The LFXP6E-4TN144I is a non-volatile LatticeXP family field-programmable gate array (FPGA) in a 144-pin package, providing 6,000 logic elements, 73,728 bits of on-chip RAM and 100 programmable I/Os. Designed for industrial-grade applications, the device combines instant-on, in-field reconfiguration capability and flexible I/O support with a compact surface-mount 144-LQFP (supplier: 144-TQFP, 20×20 mm) package.

This device targets embedded systems that require reconfigurable logic, integrated memory and robust operation across an extended temperature range, with a nominal core supply range of 1.14 V to 1.26 V and an operating temperature of −40 °C to 100 °C.

Key Features

• Core Logic 6,000 logic elements provide a mid-range programmable fabric suitable for glue logic, protocol bridging and custom control functions.
• On‑Chip Memory 73,728 total RAM bits of embedded memory support local buffering, state machines and small data stores without external SRAM.
• I/O Density and Packaging 100 I/Os in a 144-pin LQFP package (supplier package: 144‑TQFP, 20×20 mm) for compact board layouts and broad signal access.
• Non-volatile, Instant-on Architecture LatticeXP family architecture provides non‑volatile instant-on behavior and eliminates the need for external configuration memory.
• In-field Reconfiguration and Sleep Mode Supports in-field logic updates while the system operates and a sleep mode for significant static current reduction.
• Flexible System Interfaces Family-level I/O buffer flexibility and programmable interfaces accommodate a wide range of signaling standards for interface bridging and custom peripherals.
• Power and Temperature Core supply range 1.14 V to 1.26 V; industrial operating temperature −40 °C to 100 °C; surface-mount mounting type.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Use for custom control logic, sensor interfacing and I/O aggregation where industrial temperature range and reconfigurability are required.
• Protocol Bridging & Interface Adaptation Implement protocol conversion, bus bridging and custom peripheral interfaces using the device’s flexible I/O and embedded memory.
• Embedded System Glue Logic Offload glue logic, timing adaptation and simple processing tasks from the CPU with on-chip logic and RAM.
• In-field Upgradeable Systems Leverage non-volatile instant-on operation and in-field reconfiguration to update logic while deployed without external configuration memory.

Unique Advantages

• Instant-on Non‑volatile FPGA: Eliminates external configuration memory and enables rapid start-up of system logic.
• In-field Reconfiguration: Supports logic updates while the system is operating, enabling field upgrades and iterative feature deployment.
• Compact, High‑I/O Package: 100 available I/Os in a 144-pin LQFP/TQFP footprint for space-constrained designs that still require substantial I/O.
• Embedded Memory Resources: 73,728 bits of on-chip RAM allow local buffering and state storage without adding external memory components.
• Industrial Temperature Rating: Specified for −40 °C to 100 °C operation for reliable performance in industrial environments.
• Power Efficiency and System Control: Sleep mode and a narrow core voltage range support low static current operation and predictable power budgeting.

Why Choose LFXP6E-4TN144I?

The LFXP6E-4TN144I delivers a balanced combination of mid-range logic capacity, on-chip memory and a rich I/O complement in a compact surface-mount package. Its non-volatile LatticeXP architecture provides instant-on behavior and in-field reconfiguration options that simplify system design by removing external configuration storage and enabling field upgrades.

This device is well suited to engineers and procurement teams building industrial-grade embedded systems, communications interface modules and programmable I/O solutions that require predictable power, extended temperature operation and the flexibility to evolve logic in the field.

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